Image Processors
algorithmically enhances image characterization.
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Product
Rugged Conduction Cooled 3U CompactPCI Processor Blade with Quad-Core Intel® Atom™ Processor
CT-3620
Processor Blade
The ADLINK CT-3620 Series is a Rugged Conduction-Cooled 3U CompactPCI processor blade in single-slot (4HP) width form factor featuring a quad-core Intel® Atom™ SoC and soldered DDR3L-1333 ECC memory up to 4GB. Graphics is integrated graphics on the CPU and storage is provided by an onboard 32GB SSD. Rear IO signals include 2x GbE, 1x USB 2.0, VGA, 2x COM, and 1x SATA 3Gb/s, providing for expansion with an optional Rear Transition Module (RTM).
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Product
3U CompactPCI Quad-Core Intel Atom® Processor X Series Blade
cPCI-3630
Processor Blade
The ADLINK cPCI-3630 Series is a 3U CompactPCI® 2.0 processor blade featuring the 64-bit Intel Atom® Processor X Series SoC (formerly Apollo Lake I) and soldered DDR3L-1600 MHz ECC memory up to 8GB.
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Product
6U CompactPCI Intel® Atom® X6413E Processor Blade
cPCI-6660
Processor Blade
The cPCI-6660 Series is a 6U CompactPCI single-board computer available in single-slot (4HP) or dual-slot (8HP) width form factors, powered by the Quad-core Intel Atom® x6413E Processor. The cPCI-6660 now supports dual-channel DDR4-2400-3200MT/s memory with In-Band ECC (IBECC) for enhanced reliability. It features a 5V power input, four 2.5GbE Ethernet ports (3x RJ-45 and 1x M12 X-coded), onboard iSLC, and offers flexible storage options, including an optional 2.5" SATA drive space or mSATA, configurable by BOM.
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Product
AdvancedTCA® Carrier Blade with 4x Intel® Xeon® Processor E3-1515M v5 COM Express Modules and FM10420 Multi-Host Controller
aTCA-9400
Processor Blade
- 4x COM Express Type 6 module slots supporting ADLINK Express-SL/SLE with Xeon® Processor E3-1515M v5 (45W)- Integrated Intel® GT4e GPU providing high-performance H.264/H.265 transcoding- COMe modules connected by Intel® Ethernet Multi-host Controller FM10420, supporting up to 25Gbps Ethernet bandwidth between CPUs- 2x 10G SFP+, 4x 1G RJ-45 Ethernet on front panel- 2x 10G to Fabric channels, 2x1G to Base channels
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Product
Dual Intel® Xeon® E5-2600 v3 Family 40G Ethernet AdvancedTCA® Processor Blade
aTCA-9710
Processor Blade
- Two Intel® Xeon® processor E5-2600 v3 family (12C/24T)- 16 memory sockets support DDR4-2133 REG/ECC VLP RDIMM up to 256 GB- Intel® C612 PCH- Dual Intel® XL710-AM2 40GBASE-KR4 Fabric Interface channels- Support Intel® DPDK and Node Manager 3.0
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Product
3U CompactPCI Serial 9th Gen Intel Xeon®/Core™ i7 Processor Blade
cPCI-A3525 Series
Processor Blade
CompactPCI® Serial (PICMG CPCI-S.0) is a new modular computer standard officially adopted by PICMG in 2011. The CompactPCI Serial standard defines a completely new connector to support high-speed serial interfaces including PCI Express, SATA, USB and Ethernet. A CompactPCI Serial backplane has six high-speed connectors P1 to P6 on the system slot but only P1 is mandatory on peripheral slots, P2 to P6 being optional. A CompactPCI Serial system can comprise a total of nine blades (one system blade and eight peripheral I/O blades) through an Ethernet full mesh or single star architecture. The CompactPCI® Serial standard is the next-generation of the CompactPCI® specification and provides more flexibility and higher speed and bandwidth in modular system solutions.
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Product
6U VPX Dual Nodes Blade With Intel® Xeon® W-11865MRE
VPX6200
Processor Blade
- Dual nodes, redundancy architecture- Intel® Xeon® W-11865MRE processor (formerly Tiger Lake-H) per node- M.2 2242 slot per node (upgradeable to 1TB by option)- VITA 46/48/65 compliant for quick deployment- Supports Windows 10 IoT Enterprise LTSC 21H2 and Linux (kernel 5.13 and higher)
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Product
3U CompactPCI 9th Gen Intel® Xeon®/Core™ i7 Processor Blade
cPCI-3520 Series
Processor Blade
The cPCI-3520 Series is a 3U CompactPCI blade available in single-slot (4HP), dual-slot (8HP) or triple-slot (12HP) width form factors with various daughter boards to provide a broad range of I/O requirements. Faceplate I/O in the single-slot (4HP) version includes 1x DVI-I, 2x GbE and 1x USB 3.0 port (these I/O are common to all versions). Faceplate I/O in the dual-slot (8HP) version includes additional 2x USB 2.0, 1x COM, 1x KB/MS and Line-in/Line-out on the cPCI-3520D or additional 2x DisplayPorts, 1x COM in RJ-45 connector, 1x KB/MS and 1x additional USB 2.0 port on the cPCI-3520G. Two more dual-slot options are the cPCI-3520L with additional 2x GbE, 1x COM and 2x USB and the cPCI-3520M with one 100-pin high density connector supporting additional 2x DVI-D, 2x USB 2.0, 2x COM, 2x KB/MS and Line-in/Line-out ports.
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Product
3U CompactPCI Intel® 6th Gen. Quad- Core™ Processor Blade
MIC-3332
Processor Blade
MIC-3332 is using Intel® 14nm technology to provide significant performance and power efficiency. It provides an ideal solution for railway rolling stock, high-performance computing and military application. With its optimized design on EMC & thermal, it is available to meet or exceed EN50155.
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Product
3U CompactPCI Quad-Core Intel Atom® Processor X Series Blade
cPCI-3640 Series
Processor Blade
- Low power quad-core Intel Atom® x6413E Processor (formerly Elkhart Lake)- Up to 32GB DDR4-2400-3200MT/s ECC soldered memory- Optional onboard SSD support- Flexibility in IO selection- Extended temperature -40 to 85 degree C supported
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Product
6U CompactPCI 9th Gen Intel Xeon®/Core™ Processor Blade with Two PMC/XMC Sites
cPCI-6540 Series
Processor Blade
- 14nm multi-core 9th Gen Intel® Core™ processor (formerly Coffee Lake Refresh)- Dual channel DDR4 ECC memory, soldered and SO-CDIMM, up to 64GB- Versatile storage: SSD, CFast, M.2- Dual PMC/XMC sites- Remote management and TPM support
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Product
SOSA-aligned, Rugged 3U VPX Processor Blade with Intel® Xeon® W-11000E
VPX3-TL
Processor Blade
ADLINK VPX3-TL 3U VPX processor blade is powered by Intel® Xeon® W-11000E Series Processor, formerly Tiger Lake-H and delivers a greater than generational improvement in performance for enhanced data and graphics and the AI acceleration capabilities required for next-generation mission-critical applications. The SOSA-aligned design of the VPX3-TL module offers embedded computing capabilities that are easily reconfigurable and upgradable, highly cost-effective, and quick to develop and deploy.
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Product
AdvancedTCA Processor Blade
Processor Blade
Offer high-density processing power, faster data throughput, and intelligent system management.
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Product
Analytical Software for Microscopy
SPIP
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SPIP™ or Scanning Probe Image Processor - is an advanced software package for processing and analyzing microscopic images at nano- and microscale. It has been developed as a proprietary software by Image Metrology and is unique in the microscopy and microscale research market. With the high level of usable features, SPIP provides industrial and academic researchers with an advanced toolkit for working with microscope images, incl. extracting data from most microscopy file types, cleaning and enhancing data, analyzing measurements, visualizing and reporting analysis results. The software is used for research and innovation in a variety of industries such as pharmaceutical, cosmetics, semiconductors, hard disk manufacturing, polymer and aluminum manufacturing. Furthermore, SPIP is widely recognized as the standard microscope image analysis software for research and education at leading universities, and has been cited in more than 1200 scientific publications.
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Product
6U CompactPCI Processor Blades
Processor Blade
A comprehensive line of 6 U CompactPCI computers to the embedded board market.
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Product
Rugged 3U VPX Intel® Xeon® and 9th Gen Core™ i3 Processor Blade
VPX3020
Processor Blade
- Intel® Xeon® Processor E-2254MLand 9th Gen Intel® Core™ i3 (formerly “Coffee Lake-H Refresh”)- DDR4-2666 soldered ECC SDRAM up to 16GB- Optional SATA SLC SSD, up to 64GB- Up to PCIe x16 Gen3 interface supporting non-transparent bridge=
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Product
6U CompactPCI 9th/8th Gen Intel® Core™ I3/i5/i7 Processor Blade
cPCI-6640 Series
Processor Blade
The ADLINK cPCI-6640 is a 6U CompactPCI® processor blade featuring an 8th/9th Gen Intel® Core™ (formerly Coffee Lake-H) with Mobile Intel® CM246 Chipset. Dual SO-DIMM slots provide up to 64GB of DDR4-2666 dual-channel memory (2x 32GB modules). ECC memory is also available when paired with a supporting CPU.
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Product
Rugged SOSA-Aligned 3U VPX NVIDIA GPGPU Blade
VPX3-MXM-RTX5000
Processor Blade
The VPX3-MXM/RTX5000 is a 3U VPX general-purpose GPU (GPGPU) blade based on the NVIDIA RTX5000, supporting 16GB GDDR6 graphics memory with 4x DisplayPort or 4x HDMI output. The VPX3-MXM/RTX5000 brings a new level of performance to visual graphics and computing applications, fully integrating hardware acceleration for both graphics and computing code, enabling hardware acceleration for a wider class of applications than ever before.
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Product
Imaging Goniometers
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Radiant Vision Systems fully-automated goniometric systems are combined with a ProMetric® Imaging Colorimeter or Photometer and specialized software to capture a precise, comprehensive model of a light source’s near-field output.
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Product
In Vivo Imaging
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Introducing two NEW systems in the IVIS® Lumina™ preclinical in vivo imaging instrument family, the IVIS Lumina S5 and the Lumina X5. The IVIS Lumina S5 2D optical imaging system combines high sensitivity optical and patented spectral unmixing capabilities in a high-throughput system. The IVIS Lumina X5 has all the features of the S5 with integrated high-resolution x-ray.
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Product
Imaging & Analysis
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Microscopes offered by Buehler generally fall into the categories of stereo microscopes, upright microscopes, or inverted microscopes. Inverted microscopes are commonly referred to as metallurgical microscopes. Microscopes may offer episcopic (reflected light) observation, diascopic (transmitted light) observation, or both possibilities. Illumination may be delivered in bright field mode (BF) or dark field mode (DF), and several techniques such as differential interference contrast (DIC) and polarized light microscopy make use of the nature of light to reveal specific pieces of information when studying materials.
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Product
Thermal Imaging Camera
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Zhejiang ULIRvisionTechnology Co., LTD
A thermal imaging camera is a device that uses infrared and thermal imaging technology to convert the image of the temperature distribution of the target object into a visible image through detecting the infrared radiation of the target object and applying signal processing and photoelectric conversion. The thermal imaging camera accurately quantifies the actual detected heat and images of the entire object in real-time in the form of a surface, thus accurately identifying the suspected fault area that is heating. The operator initially judges the fever condition and the fault location through the image color and hotspot tracking display function displayed on the screen of the thermal imaging detector, and strictly analyzes it, thereby embodying high efficiency and high accuracy in confirming the problem.
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Product
Vehicle Imaging CMOS
AT Series
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Starting from the automotive field with innovative performance and cutting-edge imaging technology , it covers and empowers the entire intelligent transportation system.
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Product
Terahertz Imagers
T-SENSE
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The Terahertz imager T-SENSE ® visualizes enclosed hazardous substances precisely in letters as well as small parcels safely and effectively.The process is safe, fast and without risk to the health of the user. Unlike conventional visualizing processes such as x-ray technology, the T-SENSE ® functions on the lower Terahertz frequency level with safe millimeter waves that enable non-transparent materials to be illuminated.
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Product
GPGPU Processor
VPX3-4933
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Curtiss-Wright Defense Solutions
Answering the growing demand for artificial intelligence and high-performance processing in deployed EW and ISR applications, the VPX3-4933 GPGPU is designed to deliver advanced capabilities in a highly rugged, SWaP-optimized 3U VPX board.
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Product
SWIR Image Sensors
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Though NIR and SWIR act similarly to visible light, they are not visible to the human eye. As a result, these spectrums present valuable information which can show artifacts or damage that would otherwise not be seen. Click here to see some examples of how SWIR is being used in existing applications today.
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Product
Ultrasonic Imaging System
USPC 3010
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Ingenieurbüro Dr. Hillger Ultrasonic-Techniques
Detects internal defects in new materials and metals. The wide frequency range up to 35 MHz enables highestresolution. A-, C-, and D-scans can be recorded. The imaging in B-scans is an option.
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Product
Thermo Imaging
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Thermal Imaging SensorTP-L series is a compact infrared thermal imaging sensor utilizing a thermopile array detector.
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Product
Imaging Spectrocolorimeter
RM200QC
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The X-Rite RM200QC Imaging Spectrocolorimeter simplifies color measurement from incoming material to outgoing product shipments in a portable unit that fits comfortably in your hand.
