Inspection Systems
See Also: Inspection, Inspection Services, X-ray Inspection Systems, Automated Fiber Optical inspection Systems
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Defect Inspection Systems
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Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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Product
High-Accuracy Automated Optical Inspection Systems
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Fully-automated and high-accuracy 3D inspection and measurement systems. High-power, long working distance optics and high-resolution digital camera are perfect for high-magnification applications. These are full-color systems capable of high-accuracy measurements, automated defect detection and color verification.
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AOI/SPI Inspection Systems
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises AOI/SPI Inspection Systems
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Automatic Flight Inspection Systems
AT-940
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The AT-940 is a mobile and deployable flight inspection system providing high performance in the smallest possible package.
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For Real-Time X-ray Inspection Systems
Image Processors
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A number of image processing software packages are available. Features include frame averaging, measurement, text, label, marking, 3-D rendering, video recording and image storage. Additionally, BGA analysis and void measurement software can be added as well as other options. See our image processors for x-ray inspection machines below.
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Product
3D Automated Optical Inspection Systems (3D-AOI)
3Di Series
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Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
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Product
Automated Inspection Systems
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Our systems utilize phased array and eddy current array to inspect the full volume and surface of various products and profiles in many manufacturing industries, such as metal, aerospace, transportation, power generation, and oil & gas.
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Ceramics and Glass Inspection Systems
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Due to their special material properties, ceramic and glass components are the basis of many high-tech products. The same properties make the production complex and costly. Substrate defects that lead to failure of finished components should be avoided at all costs. For this reason, early automated optical inspection is essential.For the inspection of sapphire and quartz glass Intego has developed systems to detect both external and internal defects and can also provide cutting suggestions. Using index matching it is possible to test rough or uneven glass profiles.For the inspection of ceramic components Intego offers solutions specifically tailored to the respective testing task. Our modular design uses standard components that have already been developed and tested and in most cases only requires minimal adaptation.
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Visual Counting & Inspection Systems
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Sciotex has created a comprehensive line of visual counting and inspection systems. These systems can be custom configured for a wide range of applications and are often delivered, ready-for-installation in your environment.Our Products:PerfectCount, Ball Coleman SeedView, ConveyorView Inspection Systems, Sciotex ImageView, MultiView Inspection Systems
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3D Automated Optical Inspection Systems
New 3Di Series
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To handle today’s rapidly changing market trends, the system can handle complex inspection challenges such as high component mounting density areas containing highly miniaturized parts placed near much larger and taller component. With our new 3D AOI system, you can strengthen quality assurance and increase production efficiency.
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Semiconductor Wafer Microscope Inspection System
MicroINSPECT
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MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Product
Chip Inspection System
GEN3000T
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GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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AXI Inspection Systems
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises AXI Inspection Systems
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Product
Defect Inspection System
F30
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The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.
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Product
Solder Paste Inspection System
LaserVision SP3D Mini
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The LaserVision SP3D Mini offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower cost microscope platform and the ability for customers to supply their own PC if needed, the SP3D Mini sets the "affordable" boundary on reliable, low cost SPI solutions.
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Product
X-ray Inspection System
X-eye SF160 Series
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High-performance Micro-focus Open Tube with 160kV is installed and fine defects of 1㎛ are detectable. High-resolution X-ray image can be gained with world best magnification by installing high-price Open Tube as standard.Dual CT function can be purchased adtionally, and exact location & size of defects can be detected and analyzed with this function.
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Product
Automated Optical Inspection System
AOI Series
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Perform visual inspections of printed circuit boards (PCB) during manufacturing in which a camera is used to scan the board in extremely fine detail to check for any defects or failures.
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Product
5D SPI
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On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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In-Line X-ray Inspection System
X-eye 6200
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Automatically in-line inspect Solder joint defects of PCBA, and other defects on Hidden Components.Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently.Performing X-ray inspection in various production site, integrated with other manufacturing equipements.
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Inspection System for high-power precise 3D X-ray CT
X-eye PCT225
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Inspection System for 3D X-ray CT able to analyze defected area precisely by precise movement of axis with high polished Anti-vibration table. High-power X-ray Tube of max. 450kV and large area Flat Panel Detector of max.16 inches can be installed depending on the sample. Customized 3D CT equipment is available with selecting main parts by customers depends on their needs for size and material.
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IR Inspection System
EVG®20
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The EVG 20 offers a fast inspection method, especially for fusion bonded wafers. A live imageof the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG 20 tool or as a station in EVG''s integrated bonding systems.
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Entry-level X-ray Inspection System
X-eye 5100 Series
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100kV ~ 130kV Micro-focus Closed tube and high-definition Flat Panel Detector are installed and high-resolution image can be gained.Customer convenience is primarily considered in operation and maintenance of the product.Customization is available because it is specially designed to be add up any necessary functions depends on customer needs with reasonable prices.
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Real-time X-ray Inspection Systems
JewelBox Series
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JewelBox x-ray inspection systems feature ultra-high resolution, powerful microfocus x-ray tubes, five-axis, and positioners. The JewelBox Series is divided into three broad categories: JewelBox 70-T, JewelBox 90-T and Ultra Compact each of which can be customized for specific applications.
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Product
Cleanliness Inspection System / Microscope
CIX90
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The OLYMPUS CIX90 technical cleanliness inspection system is a dedicated, turnkey solution for manufacturers who maintain high quality standards for the cleanliness of manufactured components. The OLYMPUS CIX90 system makes it easy to quickly acquire, process, and document technical cleanliness inspection data to comply with international standards. The system is intuitively designed to guide users through each step of the process so that even novice inspectors can acquire important cleanliness data quickly and easily.
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Product
Solder Joint Inspection System
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DMC developed the software to inspect the solder joints of automotive power door lock switches.
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Product
Reelsurance
LCi-18 RFID
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Reelsurance LCi-18 RFID Label Counting and Inspection System with Tagsurance verifies the tag operation sensitivity using communications tests at several frequency and power level combinations with high resolution, stability and high speed. The system provides also accurate label counting, missing label detection and label dispensing of required quantities.
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Wafer Chip Inspection System
7940
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Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
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Product
Non-Destructive Resonant Inspection Drop Test Fixture
RAM-DROP
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The Drop Test Fixture, Model RAM-DROP, Resonant Inspection System, allows automated sorting and quality testing of small metal injection molded (MIM), powder injection molded (PIM), additively manufactured, and other small parts by using the Resonant Acoustic Method (NDT-RAM).
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X-ray Inspection System
JewelBox-90T/100T/110T™
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All JewelBoxes deliver precision x-ray images of ultra-high resolution and grey scale accuracy without the aberrations of voltage blooming and image distortion prevalent in other systems.
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Luminescence Defect Inspection System
INSPECTRA® PL Series
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This system uses luminescent images created using photoluminescence (PL) to perform high-speed, high-sensitivity automatic inspection for crystal defects, cracks, and luminescence defects which cannot be detected with conventional visible light surface inspection!





























