Silicon
atomic number 14 tetravalent metalloid chemical element.
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Ka-Band Silicon 5G Quad Core IC
AWMF-0108
The AWMF-0108 is a highly integrated silicon quad core IC intended for 5G phased array applications. The device supports four Tx/Rx radiating elements, includes 5 bit phase and 5 bit gain control for analog RF beam steering, and operates in half duplex fashion to enable a single antenna to support both Tx and Rx operation. The device provides 26 dB gain and +9 dBm output power during transmit mode and 28 dB coherent gain, 5.0 dB NF, and -28 dBm IIP3 during receive mode. Additional features include gain compensation over temperature, temperature reporting, Tx power telemetry, and fast beam switching using eight on-chip beam weight storage registers. The device features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 48 lead 6x6 mm QFN for easy installation in planar phased array antennas.
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Optical Profiler
DRK8090
Shandong Drick Instruments Co., Ltd.
This instrument uses noncontact, optical phase shift interferometry method does not damage the surface when measuring graphics can be quickly measured by a variety of three dimensional surface morphology, and analyzed to calculate the measurement results. Suitable for measuring a variety of blocks, the surface roughness of optical components; scale, dial the groove depth; magnetic (optical) disk, the head surface texture measurements; structural morphology of coating thickness and coating trough structure at the boundary of the grating; silicon surface roughness measurement and the graph structure and so on.
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Silicon Resistivity, PN type & Alarm Tester
HS-PSRT
It use Four Probe to test the resistivity and P/N type of wafers、ingots and all type of silicon materials.It can be used by Solar and Semiconductor industry.
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SOI Bonding Systems
An accurate wafer bonding process is the key factor in obtaining high quality single crystalline silicon films on insulating substrates. The EVG850 SOI/Direct Wafer Bonding systems are designed to fulfill a wide range of fusion/molecular wafer bonding applications, with main focus on SOI substrates manufacturing. Ultra clean handling of wafers throughout the bonding process assures high-yield and void-free bonds. All essential steps, from cleaning and alignment to pre-bonding and IR-inspection are combined in one high volume production system. EVG850 is the only production bonding system built to operate in high throughput, high-yield environments and guarantees void-free SOI wafers up to 300 mm.The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield. Wafer Bonding is a process which is strongly affected by particles: each particle on the wafer surface produces a void orders of magnitude larger than its diameter, contributing to a dramatic yield loss.
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Film Thickness Probe
FTPadv
The SE 500adv combines ellipsometry and reflectometry to eliminate the ambiguity of measuring layer thickness of transparent films. It extends the measureable thickness to 25 µm. Therefore the SE 500adv extends the capability of the standard laser ellipsometer SE 400adv especially for analyzing thicker films of dielectrics, organic materials, photoresists, silicon, and polysilicon.
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Magnetic Field Sensors
Analog Devices magnetic field sensors combine integrated bulk Hall cell technology and instrumentation circuitry to minimize temperature related drifts associated with silicon Hall cell characteristics. The architecture maximizes the advantages of a monolithic implementation while allowing sufficient versatility to meet varied application requirements with a minimum number of components.
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Digital Solutions
Dexter's Digital Detectors and Temperature Sensor Modules (TSM's) are based on Dexter's superior silicon thermopile technology and incorporate an ASIC that provides a cost effective front end for reading out the detector output. The digital solutions include pre-amplification, A/D, multi-plexing and SMBus communications. Additionaly, the SMBus can accommodate communications with up to 100 digital products. Our digital solutions are housed in industry standard TO-5/TO-39 packages.
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Voltage Controlled Oscillators
Teledyne RF & Microwave offers Voltage Controlled Oscillators (VCOs) utilizing bipolar transistors & silicon varactors over the frequency range of 40 MHz to 18GHz. Many of the VCO designs incorporate internal filtering, regulation & amplifiers to meet total system requirements in a small integrated package. Additionally, our hermetic hybrid designs can be screened to the most demanding military and space applications.
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X-Band Silicon Radar Quad Core IC
AWS-0103
The AWS-0103 is a highly integrated silicon quad core IC intended for radar and 5G phased array applications. The device supports four radiating elements, single beam transmit, and dual beam receive and includes all requisite beam steering controls for 6 bit phase and gain control. The device provides 21 dB gain and +15 dBm output power during transmit mode and 7 dB gain and +7 dBm IIP3 during receive mode. Additional features include gain compensation over temperature, temperature reporting, and fast beam switching using eight on-chip beam weight storage registers. The device features ESD protection on all pins, operates from a +1.8V supply, and is packaged in a 56 lead 7x7 mm QFN for easy installation in planar phased array antennas.
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Networking Solutions
Wi-Fi® Modules
Silicon Labs' all-inclusive Wi-Fi module are targeted for applications where excellent RF performance, low power consumption and easy application development together with fast time to market are key requirements.
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Non-Contact Mapping Life Time System
MWR-2S-3
The device is designed for express non-destructive contactless local measurement of non-equilibrium charge carrier effective lifetime in silicon substrates, epi-wafers and solar cells at different stages of manufacturing cycle. It can be used for incoming and outcoming inspection of silicon ingots and wafers, tuning and periodic inspection of semiconductor and solar cell technology quality. Lifetime determination is based on measuring photoconductivity decay after pulselight photo-exciting with usage of reflected microwave as a probe.
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pH 550 Benchtop pH Meter Kit with Probe, Stand, and pH Buffers
The PH 550 benchtop pH meter features a microprocessor chip which provides automatic temperature compensation, data storage, parameter setup, and Max/Min reading display. The meter offers a pH range from 0 to 14 and a three-point automatic calibration, with the ability to recognize standard buffer solutions (USA or NIST series). The advanced digital processing technology improves meter response time and measuring accuracy. A stable reading display icon appears when the measuring value is stable. The 3-in-1 combination pH electrode measures pH and temperature simultaneously. The compact meter includes a detachable electrode holder and three bottles of pH buffer solution. It has a dustproof and spillproof rating of IP54. Connectors are protected by silicone seal caps.
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Lab Equipment
Sper Scientific offers a range of the highest quality equipment for numerous laboratory applications. Our lineup includes: calibration kits, silicone pipet fillers, ultrasonic cleaners, pocket microscopes, laser pointers and more.
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Colorimeter
CM 10
Instrument Systems Optische Messtechnik GmbH
The CM 10 from the Instrument Systems Optronik line is a precise tristimulus colorimeter for a wide range of light sources. It features an impressively high signal dynamic range and a wide measuring range of up to 600 klx. The colorimeter head of the CM 10 contains four silicon photodiodes with full-glass filtering for the Xred, Xblue, Y and Z tristimulus functions. This permits particularly precise correction.
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High Temperature, Low Strain, Extended Performance Capacitive Extensometers
Model 7650A
Jinan Testing Equipment IE Corporation
Model 7650A extensometers measure strains with extremely high precision due to their design features and low strain range. All models are capable of tension and compression strain measurement, and may be used for fatigue testing under fully reversed load and strain conditions at frequencies up to 10 Hz.All 7650A models mount rigidly on the load frame and incorporate slide mounting to bring the extensometer into contact with the specimen. The gauge length is set automatically before mounting on the test specimen, which allows for hot mounting after thermal equilibrium has been reached.These units are specifically designed to provide high accuracy, high resolution measurements and perform high temperature fatigue testing at the highest possible frequencies. They incorporate capacitive sensors for low operating force and include electronics with programmable filtering and multi-point linearization for improved performance and accuracy. The overall design minimizes, and in many cases virtually eliminates, any influence from common lab environment vibrations.These water-cooled extensometers are equipped with high purity alumina rods for specimen contact when testing to 1200℃ (2200°F). Silicon carbide rods are used for the 1600℃ (2900°F) high temperature option.The Model 7650A is often customized for specific test needs. Contact Epsilon for a configuration that matches your requirement.
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Radiation Microdosimeters
Teledyne e2v HiRel Microdosimeter is a compact hybrid microcircuit which directly measures total ionizing dose (TID) absorbed by an internal silicon test mass. The test mass simulates silicon die of integrated circuits on-board a host spacecraft in critical mission payloads and subsystems. By accurately measuring the energy absorbed from electrons, protons, and gamma rays, an estimate of the dose absorbed by other electronic devices on the same vehicle can be made. The Microdosimeter can operate from a wide range of input voltages. The accumulated dose is presented to three dc linear outputs and one pseudo-logarithmic output giving a dose resolution of 14 µrads and a measurement range up to 40 krads. These outputs are intended to be directly connected to most analog-to-digital converters (ADCs) or spacecraft housekeeping analog inputs (0-5 V range), which makes minimal demands on the host vehicle. The Microdosimeter incorporates a test function to allow electrical testing of the hybrid without the need for a radiation source.
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256-Element Active Antenna Innovator’s Kit
AWA-0142
The AWA-0142 is an active array for 5G wireless applications developed using planar antenna technology resulting in a very low profile, lightweight unit. The surface mount assembled antenna board is based on Anokiwave’s AWMF-0135 Silicon Quad Core IC and demonstrates the performance achievable using low power silicon integration and efficient antenna layout and design. Using the AWMF-0135, the antenna provides +60dBmi (1000 W) of EIRP. The electronic 2D beam steering is achieved using analog RF beam forming, with independent phase and gain control in both Tx and Rx operating modes. The AWA-0142 antenna leads the way in showing how 5G coverage can be rolled out by network operators using the mmW bands, with low power footprint and high energy efficiency, while meeting key operating specifications for data rate, latency, coverage, and reliability.
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Silicon O/C Content Tester
HS-OCT-6700
The HS-OCT-6700 system used to measure the O&C in silicon ingot and wafers. The system is the highest performance FT-IR systems available. While the spectrometer has the power to handle the most advanced research-level experiments, routine analyses are performed just as conveniently. Every facet of the Nicolet FT-IR spectrometer has been engineered to facilitate sample handling, introduce options to scientists, and increase laboratory throughput.
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Pressure Sensors
A pressure sensor is a device that senses pressure and converts it into an electric signal where the amount depends upon the pressure applied. TE Connectivity (TE) designs and manufactures pressure sensors ranging from the sensing element to system packaging for harsh environments. We are an industry leader for our range of both standard and custom pressure sensors, from board level components to fully amplified and packaged transducers. Based on piezoresistive Micro-electromechanical systems (MEMS) and silicon strain gauge (Microfused, Krystal Bond) technology, our sensors measure everything from less than one inch of water column (<1.25 mbar) to 100K psi (7K bar).
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*Photodiode Energy Sensors
Ophir photodiode laser energy sensors are able to measure low energy pulses down to 10pJ at frequencies up to 20 kHz. Silicon photodiodes for the UV and visible spectrum and Germanium photodiodes for infrared.
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Avalanche Photodiodes
These avalanche photodiodes (APDs) are silicon photodiodes with an internal gain mechanism. As with a conventional photodiode, absorption of incident photons creates electron-hole pairs. A high reverse bias voltage creates a strong internal electric field, which accelerates the electrons through the silicon crystal lattice and produces secondary electrons by impact ionization. The resulting electron avalanche can produce gain factors up to several hundred.
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Digitizer
742 Family
The 742 is the Switched Capacitor Digitizer family, based on the DRS4 chip by PSI, with the highest sampling frequency (5GS/s) and channel density. It can record very fast signals from scintillators coupled to PMTs, Silicon Photomultipliers, APD, Diamond detectors and others, and save them with high efficiency and precision for advanced timing analysis. The 742 family has an additional channel (two channels in case of VME boards) which can be used as time reference for time of fight measurements. The resolution of this kind of measurements can reach up to 50 ps.
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Temperature & Humidity Sensor Breakout Board
Si7021
Sensor for Silicon labs has ± 3% relative humidity measurements with a range of 0–80% RH, and ±0.4 °C temperature accuracy at a range of -10 to +85 °C. Great for all of your environmental sensing projects. It uses I2C for data transfer so it works with a wide range of microcontrollers.
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Switches-Limiter
Macom Technology Solutions Holdings Inc.
At MACOM we offer an extensive collection of switches covering multiple commercial and aerospace and defense markets. Our product portfolio has a broad frequency spectrum from DC to 70 GHz. Our silicon Heterolithic Microwave Integrated Circuit (HMIC) PIN diode process is ideal for high power and broadband switches operating from 50 MHz to 26 GHz. Our AlGaAs PIN diode process can extend the upper frequency range of our switch die beyond 70 GHz and is ideal for instrumentation and radar applications. Our GaAs pHEMT and MESFET technology is ideal for fast switching and low control voltage switches optimized for both narrow band and broadband applications. Our 75 Ohm absorptive switches are designed specifically for demanding CATV, FTTx and DBS Infrastructure and CPE applications.
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Digitizer
720 Family
The 720 is a family of CAEN Waveform Digitizer able to perform basic waveform recording and run online advanced algorithms (DPP) of charge integration and pulse shape discrimination. Data is read by a Flash ADC, 12-bit resolution and 250 MS/s sampling rate, which is well suited for mid-fast signals as the ones coming from liquid or inorganic scintillators coupled to PMTs or Silicon Photomultipliers. In the waveform recording mode, algorithms of zero suppression are also implemented to reduce the data throughput.
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Optical Component Test
Test and characterize modern optical components, including photonic integrated circuits (PICs) and silicon photonics, with unmatched speed, precision and accuracy. Accelerate and improve your design or optimize your production with Luna’s suite of component analyzers and testers.
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Digitizers
2740 Family
The 2740 Digitizer is a 64-channel digital signal processor for radiation detectors available in VME64 (V2740), VME64X (VX2740), and Desktop (DT2740) form factor. It offers not only waveform digitization and recording but also Multi-Channel Analysis for nuclear spectroscopy using Silicon strip, segmented HPGe, Scintillation detector with PMTs, Wire Chambers, and others. The 2740 can perform pulse height measurements (PHA), constant fraction timing (CFD), charge integration (QDC) and pulse shape discrimination (PSD) independently for each of the 64 channels.
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Switches-SPST
Macom Technology Solutions Holdings Inc.
At MACOM we offer an extensive collection of switches covering multiple commercial and aerospace and defense markets. Our product portfolio has a broad frequency spectrum from DC to 70 GHz. Our silicon Heterolithic Microwave Integrated Circuit (HMIC) PIN diode process is ideal for high power and broadband switches operating from 50 MHz to 26 GHz. Our AlGaAs PIN diode process can extend the upper frequency range of our switch die beyond 70 GHz and is ideal for instrumentation and radar applications. Our GaAs pHEMT and MESFET technology is ideal for fast switching and low control voltage switches optimized for both narrow band and broadband applications. Our 75 Ohm absorptive switches are designed specifically for demanding CATV, FTTx and DBS Infrastructure and CPE applications.
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Barometric Pressure Transmitter
Comptus Barometric pressure sensors utilize an integrated silicon, absolute pressure sensor with internal temperature compensation. The sensor is mounted to the signal conditioner board. A 3/16 inch diameter tube may be attached to the sensor to provide remote pressure sensing. The output of the sensor is scaled to provide the desired output signal.
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Edge Grinding Machines
The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
