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Wafer Resistivity
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Four Point Probes
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Hand Held Probe Type Eddy Current Sheet Resistance/resistivity Measurement Instrument
EC-80P (Portable)
*Auto-measurement start by probe head contacting to sample*3 measurement modes for wafer resistivity, bulk resistivity and sheet resistance*Easy set up to measurement condition by JOG dial*5 types of model for each measuring range*Resistivity probe can be changed by sample’s resistivity range
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Semiconductor Metrology Systems
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Wafer Inspection Products
Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Wafer Inspection System
INSPECTRA® Series
INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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Inline Wafer Testing
IL-800
Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Wafer Prober
Precio octo
200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
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TFProbe Wafer Measurement Tools
Angstrom Sun Technologies, Inc.
Angstrom Sun Technologies Inc offers optical measurement and inspection systems for semiconductor and related industries. Its core products include wafer measurement systems, spectroscopic ellipsometers, thin film reflectometers, and microspectrophotometers.
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Wafer Internal Inspection System
INSPECTRA® IR Series
An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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Contactless Wafer Geometry Gauge
MX 20x series
The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
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Ultrasonic Wafer Scanner
AutoWafer
Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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Wafer Tester
Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Wafer and Cells PL System
HS-PL
Photoluminescence (PL) Imaging is a unique non-invasive inspection tool as it can be used in-line at many different steps of the cell manufacturing process. This facilitates the direct comparison of data obtained at one process step to data obtained at another. Additionally, PL imaging can be compared to electroluminescence (EL) imaging on finished cells using comparable equipment.
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Wafer Probe Loadboards/PIB
DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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Resistance Meter
MS8-2L
M-module MC8-2L is a mezzanine module designed to measure resistance using a two-wire measurement scheme in eight channels (eight-channel digitizer). М-module МС8-2Л is installed on the mezzanine carrier - NM module and is connected to it via a local information highway. Up to four m-modules of various types can be installed on the HM module. The NM module, together with the m-modules installed on it, forms a VXI module of size C-1 and is used to create information measuring VXI systems.
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WAFER MVM-SEM® E3300 Series
E3310
The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Insulation Resistance Testers
Shanghai Beha Electronics Co., Ltd.
*This is a variable high voltage insulation tester from 500V to 15kV in 500V steps.*The is menu driven and uses Dynamic Current Auto ranging technology.*It has a Bar-Graph which displays the voltage stressing the insulation while the test is in progress and the voltage decay during the automatic discharge of the tested circuit.*The top line of the display shows the elapsed time at the start of the test. Digital readout of the total time will remain displayed even after testing has ceased.*A 4-digit display (2000 counts) is showing the actual insulation resistance.*This instrument displays a voltage warning and sounds when AC or DC is present before injecting the test voltage.
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Yellowing Resistance Chamber
Sataton Instruments Technology CO., Ltd
Yellowing resistance chamber also called as discoloration meter is the professional testing instrument for measurement of yellow resistance performance by simulating sunlight. It is a useful tool for testing the yellowing resistance property of light color materials or products such as white thermoplastic polyurethane elastomer shoe sole or light synthetic materials. The chamber can also be used for printing and packaging industry for deploying chemical dyes.
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Resistive Current Tester
Weshine Electric Manufacturing Co., Ltd
Long Distance Digital Zinc Oxide Arrester Resistive Current Safety Testing Set
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Insulation Resistance Testers
.Multi Test Voltage .Auto range .LCD background light .Data hold .INSULATION RESISTANCE TESTER
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Concrete Surface Resistivity
Surf
Giatec Surf™ is a laboratory test device for rapid, easy and accurate measurement of the surface electrical resistivity of concrete based on the four-probe (Wenner-Array) technique. The Surf™ patented technology automatically measures resistivity around the concrete specimen using four channels of 4-probe array (located at 90° from each other). The PC software generates the required reports according to the standard specifications.
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Portable Wafer Probe Station
PS-5026B
High Power Pulse Instruments GmbH
The PS-5026B is a rugged portable wafer probing solution which has been designed for high reliability, compact size and minimum cost.
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Low Resistance Ohmmeters
Some times know as Ducter testers, these are highly accurate, easy to operate instruments that measure resistance with resolution as fine as 0.1 micro-ohm. Digital micro-ohmeters and DLROs measure contact resistance of switch and circuit breakers, aircraft frame bonds, and rail and pipeline bonds just to name a few of the applications. Megger has models available for testing using test currents from 0.5 mA to 200 amps covering a multitude of applications that require precise low-resistance measurements.
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Wafer Test Solutions
Wafer Test Solutions has established leadership positions in developing and deploying application-specific test solutions for MEMS devices, offering wafer and frame probing stations suitable for R&D, Wafer Sort, and Final Test. We offer state-of-the-art solutions to test environmental and motion sensors in wafer and other advanced packages.
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Earth Resistance Tester
Weshine Electric Manufacturing Co., Ltd
specially designed and manufactured for the field measurement of ground resistance, adopts digital and micro-processing technology, 3 wire or 2 wire method to measure ground resistance, with unique calibration function for wire resistance, anti-interference ability and environmental adaptability, to ensure the long-term measurement of high precision, high stability and reliability; The instrument out shell adopts waterproof protection case, anti-collision, anti-fall, waterproof (protection grade IP65),which is strong, safe and durable, the instrument is also equipped with large capacity rechargeable lithium battery pack, especially suitable for outdoor construction site to use.
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Auto Macro Wafer Defect Inspection
EagleView
EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
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Electronic Store Of Resistances
PS8
The module is intended for use as part of information measuring systems based on the VXI bus for software setting of resistance values with a given step along three independent channels.
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Decade Resistance Box
TEK903
The TEK903 is a very reliable decade resistance box with high quality rotary switches providing in-line readouts. Ideal for laboratory, educational and calibration applications. The extra terminal forms an accurate potential divider.
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