Solder Paste Inspection
assures volume and area of paste application.
See Also: Solder Paste, Solder Paste Measurement, 3D Solder Paste Inspection
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Product
68-Pin SCSI Micro-D Female Solder Bucket
40-962-068-SB-F
SCSI Female Connector
This connector is designed to allow users to directly terminate with soldered connections to the 68-Pin SCSI Style Micro D connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
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Product
Value Inspection Cameras
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General's Value Inspection Cameras offer excellent savings on certain Inspection Cameras such as the DCS280 Rugged Video Inspection System & the KT280 Professional Inspection Kit. Take a look & see if one will meet your needs.
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Product
For Real-Time X-ray Inspection Systems
Image Processors
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A number of image processing software packages are available. Features include frame averaging, measurement, text, label, marking, 3-D rendering, video recording and image storage. Additionally, BGA analysis and void measurement software can be added as well as other options. See our image processors for x-ray inspection machines below.
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Product
Substrate Inspection Apparatus
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The test system of the printed circuit board (mounting board) called the flying probe tester developed ahead of the world received high evaluation at the electronics manufacturing factory around the world, securing the top share of the industry and "Takaya of the board tester" We have established a firm position that.
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Product
Wafer Internal Inspection System
INSPECTRA® IR Series
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An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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Product
Inspection System
CIX100
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The OLYMPUS CIX100 inspection system is a dedicated, turnkey solution for manufactures who maintain the highest quality standards for the cleanliness of manufactured components. Quickly acquire, process, and document technical cleanliness inspection data to comply with company and international standards. The system’s intuitive software guides users through each step of the process so even novice operators can acquire cleanliness data quickly and easily.
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Product
Automated QC Inspection Solutions
R-Series
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The Best Alternative to Traditional Coordinate Measuring Machine (CMM). The R-Series product line will help you eliminate bottlenecks at the traditional coordinate measuring machine. These new solutions, when added to the production line, will help increase productivity through quality control processes that require no human involvement.
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Product
Inspection & Alignment Services
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As a leading provider of precision measurement services for power generation and turbo-machinery, API has the professional experience necessary to minimize the overall downtime of the outage or rebuild schedule. The ability to fully utilize API’s precision measurement capabilities, combined with experienced Service Engineers in the turbine alignment process, differentiates API for complex alignments.
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Product
Industrial CT X-Ray Inspection System
X25
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The X25 is quite possibly the most conveniently sized industrial CT system on the market. The system offers all of the same features as the larger systems while still maintaining the ability to fit through a standard interior door. The X25 is well suited for small to medium sized objects.
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Product
Magnetic Particle Flaw Inspection System
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This model can perform every kinds of magnetic particle flaw inspection in our unit. circular magnetization longitudial magnetization continuous magnetization, residual magnetization threading bar magnetization current induction magnetization, AC magnetization AC demagnetization DC magnetization, DC demagnetization.
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Product
Wafer Inspection Products
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Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Product
Inspection Class ROV
Phantom® L Series
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THE PHANTOM® L6 IS THE NEWEST IN THE NEXT GENERATION OF PROVEN, RELIABLE UNDERWATER ROBOTICS PIONEERED BY DEEP OCEAN ENGINEERING IN ITS MANUFACTURE OF REMOTELY OPERATED VEHICLES (ROV), BUILT IN THE USA FOR NEARLY FOUR DECADES.
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Product
Wafer Inspection System
INSPECTRA® Series
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INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Product
Semiconductor & Flat Panel Display Inspection Microscopes
MX63 / MX63L
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The MX63 and MX63L microscope systems are optimized for high-quality inspections of wafers as large as 300 mm, flat panel displays, circuit boards, and other large samples. Their modular design enables you to choose the components you need to tailor the system to your application. These ergonomic and user-friendly microscopes help increase throughput while keeping inspectors comfortable while they do their work. Combined with OLYMPUS Stream image analysis software, your entire workflow, from observation to report creation, can be simplified.
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Product
PWB Visual Inspection Machine (AOI/SPI)
RV-2
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PWB size: 50mm×50mm - 410mm×360mm 630mm×360mm（longer sized PWB)*. Item of inspection: Missing component,Position displacement, Polarity, Front/rear reversal, Unsoldered,Bridge, Quantity of solder, Lack of insertion component, Character recognition*
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Product
Complete GPR System for Road Inspection
RoadScan
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Geophysical Survey Systems, Inc.
The RoadScan™ 30 system provides users with an effective tool for quickly determining pavement layers at high speeds. RoadScan is able to collect data densities not obtainable using other labor-intensive methods commonly used for pavement testing.
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Product
Lo-PRO®file Collet Socket with Solder Tail Pins
Series 513
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LO-PROfile Collet Sockets with Solder Tail Pins. Features: LO-PRO file Collet Sockets are available with solder tail or wire wrap pins. Consult Data Sheet No. 12012 for wire wrap pins. Choose from several size and plating options
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Product
Vison Inspection System
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High Speed stroboscopic 2D vision inspection system for die attached and wirebond quality in back-end semiconductor processes. User friendly HMI for easy recipe creation and management. Able to configure with various defect identification module. (Strip Mapping, Inker, Scriber, Pucher, Bristle, Laser wire cutter and Laser clip bonding cutter.)
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Product
Bond Inspection
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Increasingly thin wires, finer pitches, as well as more applications of thick wire for higher capacities are among the current trends in wire bonding. At the same time, the requirements for robust and defect-free bonds are increasing, for example in assistance systems in the automotive sector and in RF modules in the 5G mobile communications network. This makes reliable inspections extremely important.
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Product
Non-Destructive Resonant Inspection Drop Test Fixture
RAM-DROP
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The Drop Test Fixture, Model RAM-DROP, Resonant Inspection System, allows automated sorting and quality testing of small metal injection molded (MIM), powder injection molded (PIM), additively manufactured, and other small parts by using the Resonant Acoustic Method (NDT-RAM).
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Product
Vision Inspection System
Vision Station
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Design and manufacture vision inspection system for SOT, SOD, TO, DPAK, SOIC, TSOP, SSOP, QFN/MLP, ODFN and LED inspection.
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Product
Dimensional Inspection (3D Inspection)
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The 3D measurement data from our scanners and PCMMs offers a comprehensive definition of a physical object that is used for measurement, inspection, comparison and reporting. When a part is defined by millions of points, you can see subtle deviations, slight variations and fine details, which gives you the confidence that a part (or mold) meets your specifications. To deliver the best of both worlds, we combine 3D scanning with our contact, touch-probe measurement tools to deliver precise dimensions on geometric shapes.
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Product
Borescopes & Inspection Cameras
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Triplett Test Equipment & Tools
Is an inspection camera with a detachable wireless 3.5" color display. It features 4x digital zoom, water resistant 8mm camera with 3.5ft cable, and 4 adjustable white LEDs for illumination.The wireless display detaches from the handle for additional freedom in viewing, and internal magnets will conveniently mount it to steel surfaces. With the included Micro SD card you can save snapshots and live video. Saved files can be viewed on the LCD screen or downloaded to a computer via the USB port.
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Product
Replacement Solder tip lead set for D420/D620
Dx20-SI
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- Choice of 4 GHz or 6 GHz bandwidth models- Up to 5 Vpk-pk dynamic range with low noise- ±3 V offset range- Low loading and high impedance for minimal signal disturbance- Ideal for DDR2, DDR3, LPDDR2- Deluxe soft carrying case- Innovative QuickLink architecture- Wide variety of tips and leads-- Solder-In Lead-- Optional Positioner (Browser) Tip-- Quick Connect Lead-- Square Pin Lead-- HiTemp Solder-In Lead
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Product
Pinhole Detection Inspection Kit
Elcometer 270
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The Elcometer 270 Pinhole Detectors Inspection Kit utilises the wet sponge technique and has been designed to set a new standard for wet sponge detectors - a high quality, low voltage detector with similar accessories to a high voltage spark tester.
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Product
On-site EL/PL Inspection Machine
“EPTiF”
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"EPTiF (EL/PL Test in Field)" enables you to check invisible conditions of installed solar panels during daytime by EL and PL inspections, which are adopted by a number of solar panel manufacturers, without detaching solar panels. Irradiance-independent and steady results can be obtained. This is the first in the industry.
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Product
Sensor for Filament Inspection
EyeFI
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EVT presents the EyeFI - the sensor for the inspection of filaments. The sensor contains two cameras with an Aptina sensor and S-Mount lenses. The cameras are perpendicular to each other. It is therefore possible to inspect two sides of the filament, which means that the EyeFI can detect if the filament is out-of-roundness. Additionally the errors and defects can be detected. For example the occurring flaws are point-shaped or partly flaked, or point-shaped and transverse, or also looking like a longitudial rib, or only spots in different shapes. The defects can be detected with the EyeFI sensor. The EyeFI contains board cameras with sensors from Aptina, the IoCap and an evaluation processor. The housing is about 14x10x4 cm in size. The IoCap is the image-capture-IO-board, which is designed and developped by EVT.
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Product
Video Inspection Station with Measuring
VIS310
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Video Inspection Stations are available with?or without on-screen measurement capabilities?and offer?an excellent way to evaluate or test small works or items in?difficult to access locations.? As todays electronic and mechanical systems keep getting smaller, it becomes impossible to test or measure these products with traditional methods. For many applications, from development to production testing, video based inspection can help maintain quality control. Many of these systems are used in labs for development or used in production for testing production samples.
