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Product
Temperature Mapping
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Measure temperature between two surfaces, utilizing a thin and flexible sensor. The resulting data and our analysis tools offer insights to enhance product design, manufacturing, quality, and research.
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Product
High Resolution Wafer Thickness & Thickness Variation Gauge
MX 10x series
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The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
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Product
Silicon & Compound Wafers
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Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Product
In-situ Wafer Temperature Monitoring
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CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
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Product
04 With Soldering Eyelets | 1 Wafer | 12 Positions
04-1xx4-00/30-xx
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Very robust, multi wafer selector with 30° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Wafer Inspection System
INSPECTRA® Series
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INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Product
01 With Soldering Eyelets | 12 Positions | M8 | 2 Wafers
01-2xxx-00/30xx-12-0
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Multi wafer compact selector with 30° detent angle, 4 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque
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Product
Bond Tester for Wafers 2 - 12 inch
Sigma W12
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Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Product
Pressure Mapping Sensors
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The pressure sensors listed below are available in a wide range of shapes, sizes, pressure ranges, and resolutions. Over 200 different pressure sensors are available. High Temperature pressure mapping sensors are also available in certain sensor models. Custom tactile pressure sensors and pressure ranges can also be created to meet your specific application requirements. Please note, the sensors listed in this catalog are matrix sensors designed to be used with one of Tekscan's pressure mapping systems. If you need single-point force sensors for testing, or custom force sensors for embedded/OEM applications, please refer to our FlexiForce™ products. For more application and industry details, see some of our key sensor application and industry solutions.
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Product
Wafer Demounting And Cleaning Machines
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Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
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Product
PORTABLE PRESSURE MAPPING
I-SCAN® HANDHELD SYSTEM
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Handheld pressure measurement system for collecting tactile pressure data.
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Product
Wafer Defect observing instrument
HS-WDI
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Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Product
Operation Support System for Wafer Prober
N-PAF
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N-PAF (Network-Based Prober Advanced Function) is a networking system developed for more effective operation and maintenance of multiple wafer probers. Remote operation helps save on labor on the factory floor. An E10-compliant RAM Analyzer can be used for operation management of the system
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Product
04 With Pins For PCB Or Soldering Eyelets | 12, 24 Positions | 1 - 4 Wafers
04-Selector-Overview
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Very robust, multi wafer selector with up to 24 positions, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Portable Wafer Probe Station
PS-5026B
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High Power Pulse Instruments GmbH
The PS-5026B is a rugged portable wafer probing solution which has been designed for high reliability, compact size and minimum cost.
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Product
Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Product
Wafer Prober
Precio XL
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Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Product
Full Wafer Test System
FOX-1P
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Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Product
MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Product
Large Area Mapping Spectroscopic Ellipsometers for Flat Panel Display and Photovoltaic Industries
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HORIBA Scientific’s large area spectroscopic ellipsometers are designed to provide thin film control solutions in flat panel display and photovoltaic manufacturing.A large mapping system allows thin film measurements at every location on the panel. Our large area spectroscopic ellipsometers are driven by our DeltaPsi2 software platform, which provides reliable recipes for routine thin film measurements. Automatic recipes fully automate measurement+modelling+mapping+results. Automatic reporting, data reprocessing, import/export package are some of the many functionalities of DeltaPsi2.
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Product
Semiconductor Wafer Defect Inspection Management Software
ProcessGuard
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Microtronic ProcessGUARD Software is the desktop client for the EagleView auto macro wafer defect inspection system. ProcessGUARD is a high volume, high speed semiconductor wafer defect inspection management solution that provides an easy-to-use, customizable and extensible platform and interface to automate your fabs defect inspection process. ProcessGUARD is feature rich (see below) and its newest releases include complete wafer randomization software, a user-defined defect library, and an integrated trainer and knowledge base.
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Product
Wafer Probe Heads
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WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
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Product
2D/3D Wafer Metrology System
7980
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Chroma 7980 provides accurate and reliable profile information. 7980 adopts new BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement.
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Product
04 With Pins For PCB | 3 Wafers | 12 Positions
04-3xx4-20/70-xx
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Very robust, multi wafer selector with 30° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Ambient Temperature Vacuum Wafer Chucks
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6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Product
Azure Maps
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Create location-aware web and mobile applications using simple and secure geospatial services, APIs, and SDKs in Azure. Deliver seamless experiences based on geospatial data with built-in location intelligence from world-class mobility technology partners.
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Product
Wafer Sort
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TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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Product
In-Line Wafer Surface Defect Inspection
ALTO-SD-150/200
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ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
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Product
04 With Pins For PCB | 2 Wafers | 24 Positions
04-2xx3-20/70-xx
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Very robust, multi wafer selector with 15° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
