Multicore
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Product
Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, 4 PoE, 4 USB 3.0, And Real-time Vision I/O
IPS960-511-PoE
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Featuring a multi-core CPU, IP40-rated rugged design, camera communication interfaces, real-time vision-specific I/O with microsecond-scale and LED lighting control, the IPS960-511-PoE provides an all-in-one solution that addresses the needs across various machine vision platforms and automatic inspection cases. The IPS960-511-PoE is powered by the LGA1151 socket the 7th & 6th generation Intel® Core™ (codename: Kaby Lake/Skylake) and Celeron® processors (up to 65W) with the Intel® H110 chipset. The intelligent vision system comes with dual DDR4-2133/2400 un-buffered SO-DIMM sockets for up to 32GB of system memory as well as supports rich camera interfaces for connecting industrial cameras, including four IEEE802.3at PoE LAN ports and four USB 3.0 ports. Its vision I/O integrates a full range of isolated I/O interfaces and real-time controls essential to machine vision applications, including trigger input, LED lighting controller, camera trigger, as well as an encoder input for conveyor tracking. The IPS960-511-PoE also supports lighting dimming control to identify object characteristics for different inspection. Two easy-swappable 2.5" HDDs are available for extensive storage needs.
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Product
External Controller for PXI
External Controller
External Controllers for PXI are rack-mount controllers that feature high-performance multicore processors, up to 4 GB of dual-channel DDR2 RAM, and optional RAID hard-drive configurations for high-speed streaming to disk. These devices offer hot-swappable fans and options for redundant power supplies. The External Controller for PXI is designed for mission-critical, physically demanding applications.
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Product
IL/RL Testing Platform
JW18001
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Shanghai Joinwit Optoelectronic Tech,co.,Ltd
To meet the test requirements of MPO devices, we adopt the JW18001 optical device testing platform,JW1608 No-mandrel IL/RL tester module, JW1606 multi-channel optical switch module and form an integrated solution for MPO testing. The application of No-mandrel technique solves the problem that the multi-core optical device can not be winded and needs fiber matching cream, thereby the testing efficiency of the insertion loss and return loss of the multi-core / ribbon fiber has been greatly improved. At the same time, MPO applications can configure a variety of testing mode, test reports, threshold setting function, so multi-core optical device testing is no longer complicated.
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Product
Vision Systems
System
Embedded vision systems, also referred to as compact vision systems, offer an alternative to Smart cameras and computer-based systems. The ADLINK EOS series is a complete embedded system that offers image acquisition, processing, archiving, and display capabilities. It is equipped with a multi-core CPU, ideal for applications requiring high computing power and multi-camera imaging, such as 3D vision and robotics guidance. Featuring rich I/O connectivity with factory-floor networks, including RS-232/422/485, USB, and isolated digital I/O, as well as onboard storage, ADLINK’s embedded vision system is ready to deploy. A system monitoring feature, feeding back temperature and voltage data, combines with a watchdog timer to maximize robustness and reliability of the ADLINK EOS series in mission critical applications.
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Product
IDE, Compiler And Debugger
RiscFree™ SDK
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RiscFree is Ashling’s cross platform SDK including an IDE and Debugger, Integrated Compiler Toolchain, Project Manager and Build System, Single-shot Installer and Source-code Creation and Navigation. The integrated Debugger provides full Multi-core Homogeneous and Heterogeneous Support including debug and trace support via the Ashling Probes for RISC-V, Arm, ARC, ARC-V and MIPS based cores
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Product
Multicore Digital Signal Processor
SI-C667xDSP
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Sheldon Instruments offers a complete portfolio of hardware products for a wide spectrum of real time applications in measurement and digital control systems. Our hardware range includes carrier boards that combine DSPs and FPGAs for various PCI/PCIExpress form factors such as slotted/desktop PCI/PCIe, PCI-104/PCIe-104, PMC/XMC, CompactPCI, as well as stand-alone embedded solutions. The DSP-FPGA carrier hardware is complemented by high performance analog and digital I/O modules as well as all necessary accessories like cables and terminal blocks.
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Product
ARM Solutions
QorIQ® Layerscape Series
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The QorIQ® communications processor portfolio offers unmatched depth and breadth, with the addition of NXP’s next-generation QorIQ Layerscape series processors built on Arm® core technology, the portfolio extends performance to the smallest form factor.- QorIQ Layerscape processor- 600MHz – 2.2GHz ARM Cortex- Single & Multi-Core Architecture
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Product
Smart Energy Solutions
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To address the needs of the smart energy market, we offer a platform that incorporates application-specific solutions as well as standard microcontroller, microprocessor, security, memory, wireless and power-line connectivity devices. This smart energy portfolio offers you best-in-class feature sets and performance for designing equipment for the smart grid. The smart meter architecture requires different levels of integration depending on system architecture partitioning, project timelines and the level of flexibility needed to address the requirements of different geographies and utility companies. Our platform provides a unique multi-level architecture built around a multi-core solution as illustrated below. A variety of devices can be used as building blocks for your smart meter design. These include metrology sensing (analog-to-digital conversion); metrology digital signal processing; application, communication and security processing as well as connectivity to area networks in homes neighborhoods.
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Product
Software
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Easy to use and intuitive software is fundamental in order to analyze complex embedded software challenges. With the increase in use of multi-core SoCs, complex operating system environments, such as AUTOSAR, and the need for hypervisors, iSYSTEM aims to deliver a user interface that provides fast and clear results so that development decisions can be made quickly. Our offering can be broken down into a few core elements:
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Product
Cavium CN63xx Packet Processor AMC
AMC730
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The AMC730 is a a 10-Gigabit Ethernet (10GbE) AdvancedMCTM(AMC) module which includes an on-board line rate multi-core packet processor based on Cavium CN63XX CPU. VadaTech offers this product in a mid size (full size optional) form factor with the AMC.1, AMC.2 and AMC.4 specifications. The AMC730 is based around the Cavium OCTEON CN63xx processor which has been specifically designed to intelligently process Ethernet packets at line rate.The processor can be loaded via the PCIe/SRIO interface or via an optional flash memory. The number of processor cores, speed grade, and amount of DDR3 memory is customizable based on customer needs. The module has 2GB of HFA for pattern matching for deep packet inspection, etc. The SDK for the processor as well as additional software stacks are available from Cavium or third party.
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Product
Architecture P2020 Processor
VME-194B
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Curtiss-Wright Defense Solutions
The VME-194B is the next generation of VME single board computer (SBC) from Curtiss-Wright Defense Solutions. It is targeted for applications with moderate processing requirements, low power and cost effectiveness. The VME-194 VME SBC is based on NXP's high performance QorIQ P2020 SOC multi-core processor.
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Product
RTOS
LynxOS
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The embedded market is exploding with the dawn of the “Internet of Things”. The basic idea being that almost everything will ultimately be connected to the internet and these embedded devices are becoming more complex. This means they need to run more full functioned operating systems, with connectivity and popular human interfaces, require more processing power, including multi-core chips, and are likely to be exposed to the same types of cyber attacks that we are facing in our corporate and personal computers.Lynx Software Technologies addresses these needs with our high performance LynxOS operating systems and tools based on open standards. Our new powerful RTOS security features allow embedded developers to design their systems to be more secure before they are connected to the internet.
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Product
Fiber Alignment
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Fiber alignment tools are essential for taking precise measurements at high speed. The PK product portfolio features many of the industry’s best-performing tools for aligning single fibers, multi-fiber subunits, connectorized assemblies, and multicore fibers.
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Product
3U OpenVPX FMC Carrier
VF361
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Sundance Multiprocessor Technology Ltd.
The VF361 is a 3U OpenVPX module that leverages on the ALTERA Arria ® V SoC FPGA, ARM Cortex-A9, and Texas Instruments Keystone Multicore DSP technology to provide a high bandwidth processing platform, ideally suited for computation and bandwidth intensive applications such as RADAR, networking, SIGINT, EW, SDR and Video.
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Product
In-Circuit Testers
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SPEA’s Bed of Nails Board Testers are scalable In-Circuit Test platforms that deliver the shortest test time, superior diagnostic accuracy, and extended test coverage for the most comprehensive range of electronic products.SPEA’s In-Circuit Board Testers are designed to increase yield, shorten the testing time, and cut the cost-of-test. Thanks to their unique Multi-Tester and Multi-Core Architecture, the SPEA’s Board Testers provide up to ten times greater throughput than conventional ICT test systems.
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Product
Development Kit
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The VP430 is 3U VPX RF processing system featuring the transformational Xilinx® Zynq® Ultrascale+™ RF system-on-chip technology (RFSoC). The ZU27DR device used on the VP430 includes eight integrated analog-to-digital converters at 4GSPS, eight digital-to-analog converters at 6.4 GSPS, a user-programmable FPGA fabric, and multi-core Zynq ARM® processing subsystem.
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Product
Multimedia Modular
DPX-M275
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Intel® 12/13/14th Generation Core™-i9/i7/i5/i3 Embedded Multi-media Gaming Board. Very high-performance Intel Hybrid Multi-core CPU’s. Two SoDIMM DDR5-4800/5600MT/s up to 64GB.
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Product
Digital Signal Processor
HSR40 CC
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Curtiss-Wright Defense Solutions
Curtiss-Wright’s CHAMP-XD2 digital signal processor (DSP) card handles the incoming data and features two multi-core Xeon D processors and two built-in 40 GbE interfaces. The processor hosts a Linux operating system and runs the HSR40 data recording and storing application. The processors can easily absorb the incoming data and redirect it to the persistent storage media, using 3rd generation PCI Express (PCIe), enabling the efficient movement of all the data.
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Product
Memory Interface Chips
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Providing memory bandwidth and capacity to unleash the power of multicore processors
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Product
Geometry
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Our glass and coating geometry test instruments ensure fiber performance and adherence to telecom standards. Our solutions are capable of measuring diameter, circularity, and concentricity for both coatings and glass plus fiber curl. Our flexible geometry measurement systems not only work with standard telecom fibers, but are continually updated to meet new requirements, such as PM, multicore and hollow-core fibers.
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Product
Architecture P4040/4080 Processor
VME-186
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Curtiss-Wright Defense Solutions
The VME-186 VME Single Board Computer is based on NXP's high-performance QorIQ P4080 SOC multi-core processor. With four or eight Power Architecture cores running up to 1.5 GHz, and up to 8 GB of high bandwidth DDR3 SDRAM, the VME-186 SBC provides processing and a variety I/O interfaces to satisfy the most demanding requirements of embedded computing.
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Product
Parallel Simulation Engine
RocketSim
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Complementing compiled-code simulators, Cadence® RocketSim™ parallel simulation engine eliminates functional verification bottlenecks by speeding up simulation using commonly available multi-core servers.
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Product
High Performance AMD Ryzen™
DPX-S460
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Very high-performance AMD multi-core SoC’s. 6 and 8 Core SoC’s up to 45W. Four independent monitors. PCIe x16 graphics card slot.
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Product
High Level Language Debugger and Emulator Tool
Universal Debug Engine
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Programmierbare Logik & Systeme GmbH
With Universal Debug Engine (UDE®) PLS offers on top solutions for software development of systems-on-silicon including debug support for the 16 Bit and 32 Bit microcontrollers C16x, C166™, ST10F276, ST10F280, XC166, XC2000, XE166, XMC4500, C166S V2, SDA6000, TriCore™ from Infineon and STMicroelectronics, Power Architecture® MPC55xx, MPC560x, MPC563x, MPC57xx from NXP™, PowerPC PPC440SPe from AMCC, Power Architecture® SPC560, SPC563, SP574 from STMicroelectronics, ARM7™, ARM9™, ARM11™, Cortex™-M0, Cortex™-M0+, Cortex™-M3, Cortex™-M4, Cortex™-M7, Cortex™-R4, Cortex™-A8, Cortex™-A9, XScale™, SuperH™ SH-2A derivatives in a new multicore debug environment as well as technical support. The extensive feature list includes functions like: high speed and flexible target access via JTAG, cJTAG with OCDS L1, EmbeddedICE, OnCE, COP, DAP, DAP2, SWD support, OCDS L2 trace, MCDS trace, CoreSight™ trace, ETM trace, ETB trace, Nexus trace, ASC, SSC, 3Pin and CAN, in-system FLASH memory programming of FLASH / OTP with UDE MemTool, support of various RTOS, OSEK® and test automation tools.
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Product
Modular Framework
LYNX MOSA.ic
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LYNX MOSA.ic is a software framework for building and integrating complex multi-core safety- or security-critical systems using independent application modules. Its elegant, modular architecture enables developers to collapse development cycles when creating, certifying, and deploying robust platforms for manned and autonomous and increasingly connected systems.
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Product
Carrier with System Management
EnsembleSeries™ CCM3012
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*PCIe Gen-3 interfaces to OpenVPX data plane*Advanced system management built-in (VITA 46.11)*Air, conduction, Air and Liquid Flow-By packages*Interoperable with other Ensemble OpenVPX processing modules*Fully MultiCore Plus® compatible
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Product
Multi-Wire Fiber Jacket Stripper - TFS-304-16
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Shanghai Fibretool Technology Co.,Ltd.
1. This stripper is suitable for stripping duplex and multi-core Fiber Cables: 4 cores ×2.0mm DUPLEX cables, 2 cores ×3.0mm DUPLEX cables and 2 cores × MTP/MPO multi-core optical cables.2. 2~4 core cable can be stripped by one operation3. Cable stripping length is adjustable from 5 mm-42 mm4. All cutting surface are precision formed, hardened, tempered and anti-rust 5. The comfort anti-fatigue design handle ensures long-term workmanship 6. Length: 161 mm, weight: 145.50g
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Product
Automotive Infotainment SoCs
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ST’s portfolio of infotainment systems on chips (SOCs) includes a complete offer of automotive-grade devices for a wide range of infotainment systems ranging from turnkey Accordo2 processors for car radio applications and Display Audio systems, featuring smartphone mirroring and support of rear-view cameras, up to powerful Accordo5 multi-core processors with best-in class 3D graphics and video decoding capabilities, to address multi-standard smartphone replication technology as well as Digital Instrument Cluster applications.
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Product
Power Architecture SBCs
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The most advanced multi-core Power Architecture processors enable you to achieve the high performance you need-whatever the demands of the application.
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Product
SMARC Short Size Module with NXP i.MX 6 Multicore Arm® Cortex®-A9
LEC-iMX6R2
Computer on Module
- NXP SoC i.MX6 ARM Cortex A9 Solo, DualLite, Dual or Quad processor- Integrated 2D/3D graphics processors, 3D 1080p video processing, power management- Onboard DDR3L-1600 system memory from 512 MB to 2 GB- Supports up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s- Extreme Rugged operating temperature: -40°C to +85°C (optional)- 15 year product availability
