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Flatness, Bow, Warp, Curvature, Glass Thickness
FLATSCAN 650 3D
Optik Elektronik Gerätetechnik GmbH
High accurate flatness & thickness measuring system for large substrates.
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Paper Testing Instruments
Whiteness and chromaciticity tester, whiteness meter, tensile stiffness tester, automatic horizontal tensile tester, automatic horizontal tensile tester, vertical tensile tester, pulp beating (refining) freeness tester, water absorbtion tester, Cobb tester, COBB sample cutter, coefficient of friction tester, electronic bending stiffness tester, paper and cardboard thickness meter, paper and cardboard thickness meter, ink rubber tester, standard strip cutter, softness tester, carton compression tester, paper air permeability tester, internal ply bond tester, puncture strength tester, paper tearing tester, electronic tearing tester, mullen burst tester, crush tester, Bekk smoothness tester, folding endurance tester
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20J3 SHEET RESISTANCE METER
Non-contact measurement of Ohms/sq, Ohms-cm, resistivity, thickness, and moreMeasures nearly all thin conductive materials or coatingsChoose a sensor in one of four ranges, from .005 Ohms/sq to 100,000 Ohms/sqadd other sensors laterFor benchtop or inline applicationsSimple one-button operationSmall footprint with detached sensor probeOptions include vacuum-ready probe, PC-based productivity software, Ethernet connectivity, stage, and more
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Substrate Manufacturing
KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.
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Glow Discharge Optical Emission Spectrometer
GD-Profiler 2™
The GD-Profiler 2™ provides fast, simultaneous analysis of all elements of interest including the gases nitrogen, oxygen, hydrogen and chlorine. It is an ideal tool for thin and thick films characterization and process studies.
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Wall Thickness Measurement Gauges
ElektroPhysik Dr. Steingroever GmbH & Co. KG
Portable wall thickness measuring device for non-destructive measurement of up to 24 mm. Thickness measurement of all non-magnetic materials such as glass, synthetic materials, stainless steel and composites; can also be used for objects with complex geometries.
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Probe Card
T90™ Series
The 90 mm tile was designed for mounting on a standard 4.5″ probe card holder for multi-site wafer level reliability testing. The 1.6 mm (0.062″) thick rails allow the chassis to slip into planarity adjustable probe card holders for most analytical probe stations.
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Thickness Gauges
Bristol Instruments'' optical thickness gauges are a simple and non-destructive way to precisely measure thickness of a variety of transparent and semi-transparent materials. Thickness information is critical in the development and production of materials such as contact and intraocular lenses, and medical products including balloon catheters, stents, bags, and tubing. Bristol combines high accuracy with straightforward operation and rugged design to make these instruments ideal for both laboratory and manufacturing environments.
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Contactless One-Point Wafer Thickness Gauge
MX 30x
The MX30x series are manual one-point Thickness gauges for silicon wafers.
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Profilometer
MicroCam™
MicroCam™ fiber-based optical non-contact 3D profilometers deliver: High-Speed Non-Contact Surface and Cross-Sectional Inspection 3D Online Measurements, GD&T and Imaging Long Stroke Profilometry with Sub-Micron Resolution Thickness, Roughness and Vibration Measurements Fiber-based Probes which reach into Bores, Tubes, and Crevices
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Ultrasonic Thickness Gauge
MMX-6
The MMX-6 is a simple to use hand-held Ultrasonic Thickness Gauge with the ability to measure through paint and coatings and eliminate the thickness of the paint or coating. The MMX-6 uses a dual element style transducer. With the single press of a button, the MMX-6 can be switched between pit or flaw mode ( pulse-echo), and through paint/coatings mode (echo-echo) for maximum inspection efficiency. The MMX-6 is equipped with a bundle of features to make your job easier: Alarm mode, high speed scanning, and data send are the main features of the MMX-6. The MMX-6 comes as a complete kit, ready to use, and is backed by Dakota Ultrasonics 5 year limited warranty.
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Silicon O/C Content Tester
OCT-2000
Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
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Erichsen Cupping Testing Machine
GBW Series
Jinan Testing Equipment IE Corporation
GBW series Erichsen Cupping Testing Machine is designed on the basis of screw universal material testing machine. The Erichsen Cupping Tester is suitable for cupping test of metal sheet and strip steel rolled stock etc to evaluate the plastic deformation performance and ductility. The cupping test for metal sheet thickness range is 0.1mm to 5mm, Max. punching capacity is 300KN, and the pre-tightening device is optional either with hydraulic servo loading pump or manual loading pump.
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Ignition Pulse Detector
IP-3000A
IP-3000A Ignition pulse detector is a slim and light weighted detector by using amorphous metals fiber element. It is 1/4 in thickness (mass: approx. 1/50) and 1/3 in weight compared with the previous model of Ono Sokki. Also the IP-3000A can obtain constant output from low to high rotation with high sensitivity.Meeting the needs of structure or mechanism in recent gasoline engines, the IP-3000A can easily clamp around an ignition coil cable (the primary side cord of ignition coil or the current cord of electronic distributor). Moreover, heat-resistant design up to maximum operating temperature of +120 C° enables measurement under harsh environment.The IP-3000A Ignition pulse detector can be used with Ono Sokki’s engine tachometer.
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Flaw Detector & Thickness Gauge
DFX-8
Measurement Gates: Two independent gates (Flaw), and three gates (thickness). Start & width adjustable over full range. Amplitude 5-95%, 1% steps. Positive or negative triggering for each gate with audible and visual alarms
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Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
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Semiconductor Metrology Systems
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Hand Held Ultrasonic Thickness Meter
Multigauge 5600
On screen user information such as probe frequency and remaining battery. Colour LCD display. Easy to use keypad and menu system.
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Sheet Resistance Measurement
The Filmetrics® R54-series and R50-series sheet resistance measurement instruments have been developed based on over 45 years of KLA sheet resistance measurement innovation. The R50 measures metal layer thickness, sheet resistance and sheet conductance. The R54-series adds a light-tight enclosure, along with 300mm support, to provide metal thickness measurement solutions for semiconductor and compound semiconductor manufacturing.
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Ultra-slim Light Curtain [Type2 PLc SIL1]
SF2C
Panasonic Industrial Devices Sales Company of America
The Ultra-Slim SF2C Light Curtains have a thickness of only 13.2mm, come in an ultra-light polycarbonate enclosure and features easy installation and reduced wiring. They are available as a hand protection type with a beam pitch of 20mm, allowing users to detect objects as small as 25mm in diameter. SF2C Light Curtains are delivered with a 3-meter cable and mounting brackets (MS-SFC-1).
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Laser Scan Micrometers
LaserLinc understands how critical your in-process and off-line laser measurements are, for outside diameter, ovality, wall thickness, concentricity, profile and more.
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Photovoltaic/Solar Metrology System
Multi-channel thickness, TTV and bow measurement module for in-process monitoring of solar/photovoltaic wafers and other materials.
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Ice Profiler
Estimate ice forces for design of offshore platforms and operational planningDetermine the extreme thickness of ice for pipeline installationsExamine in detail the underside of sea-iceUnderstand the dynamics and thermodynamics of the sea ice regime for scientific research.Climate change studies
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Ultrasonic Thickness Gauge
TI-45 Series
You can instantly measure the thickness of a material simply by positioning a probe. This innovative gauge is widely used and is capable of measuring a variety of materials including iron, stainless steel, glass and ceramics.
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Distance, Coating and Thickness Meters
PeakTech Prüf- und Messtechnik GmbH
This professional laser distance measuring device with multi-line LCD display, which has a backlight, was specially designed for high-precision distance measurements.
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Laser Series
Jutze
Jutze laser marker series is equipped with Panasonic high-quality laser units. The laser unit, coupled with Z axis control, makes it capable of handling different thicknesses of PCBs & components. Adjustable range ± 3mm.
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Film Thickness Mapping Systems
Angstrom Sun Technologies, Inc.
Spectroscopic reflectometer mapping (SRM) tools are for industry or lab routine thin film uniformity measurement. This is relatively low cost and easy to use setup. Mapping size can be configured from 2" to 18" if needed. Dependent on film thickness range, a broad wavelength range can be configured within DUV, Vis and/or NIR range. A user-friendly software interface allows you to define various mapping patterns to map. A CCD array based detecting and data acquisition mechanism offers fast measurements. 2D/3D data presentation gives user option to quickly generate reports.
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Underwater Thickness Meter
Multigauge 3000
Large bright 10mm display. Integral battery with 55 hours runtime. Can be easily upgraded to a topside repeater. 500m depth rating.
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Line Scan Camera
Piranha4 Polarization
The Piranha4 Polarization™ camera is a breakthrough in the machine vision industry. This high-speed polarization camera features three native polarization states plus an unfiltered channel.The Piranha4 polarization camera extends detection capability in machine vision and is ideal for detecting stresses, surface roughness, film thickness, alloy composition, and 3D profiles.
