Lithography
nano fabrication of circuitry.
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Product
Lithography System
JetStep S3500
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The JetStep S3500 panel lithography system is designed specifically for advanced packaging panel production. The system incorporates advanced features that address requirements for panel-level packaging, such as die shift due to placement accuracy or subsequent processing steps, CTE mismatch, panel warpage and panel handling.
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Product
Lithography
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EVG’s key competencies in lithographic technology lie in the high-throughput contact and proximity exposure capabilities of its mask aligners and its newly developed, revolutionary and highly versatile maskless exposure lithography systems. These capabilities are complemented by its resist coating and resist development systems with advanced in-house process competences and hands-on development skills.
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Product
Lithography Systems
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When it comes to shaping what a chip can do, lithography systems lead the way by transferring intricate circuit designs onto substrates with unmatched precision. From prototyping to high-volume manufacturing, these tools define the geometry of modern microchips, as well performance.
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Product
LITHOSCALE® Maskless Exposure Lithography Systems
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Maskless exposure lithography systems represent an entirely new product platform of EVG lithography equipment.
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Product
EUV Lithography
NXE systems
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NXE lithography systems are used in high-volume manufacturing of advanced Logic and Memory chips. The first systems to use ASML’s novel 13.5 nm EUV light source, they print microchip features with a resolution of 13 nm, which is unreachable with deep ultraviolet (DUV) lithography. Chipmakers use our NXE systems to print the highly complex foundation layers of their 7 nm, 5 nm and 3 nm nodes. Read about how EUV lithography went from imagination to reality.
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Product
Electron Beam Lithography System
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Spot type Electron Beam Lithography System JBX-8100FS achieved high throughput, small footprint and electric power saving.
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Product
EUV Lithography
EXE systems
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EXE, or ‘High NA’, systems are the latest generation in EUV lithography. With a numerical aperture (NA) of 0.55, their innovative new optics provide higher contrast and print with a resolution of just 8 nm.
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Product
Computational Lithography
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ASML's industry-leading computational lithography products enable accurate lithography simulations that help to improve chip yield and quality
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Product
Mask Alignment Systems
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EVG’s inventions, such as the world’s first bottom-side alignment system in 1985, have pioneered and set the industry standards in both top and double-sided lithography, aligned wafer bonding and nanoimprint lithography. EVG contributes in these areas through continuous development of mask aligner product generations to augment this core lithography technology.
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Product
Semiconductor Manufacturing Optics
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No lithography without optics. No semiconductors without lithography. Without semiconductors there would be no microchips, without microchips no computers – no high-tech products. As an OEM (Original Equipment Manufacturer) supplier, ZEISS enables the semiconductor industry worldwide with optics and other optical modules.
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Product
Reticle/Mask Particle Remover
RP-1
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The RP-1 automatically removes particles from the reticle/mask by air (or N2) and vacuum suction. Routinely removing the particles before the lithography process extends the replacement cycle of the pellicle and cleaning cycle of the mask, thereby contributing to a reduction in running costs.
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Product
Nanopositioning Systems
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Mad City Labs'' nanopositioning systems move and maintain the position of objects with sub-nanometer precision and high stability. Applications for nanopositioners include super resolution microscopy, high speed confocal imaging, AFM, NSOM, SPM, optical trapping, fiber positioning, single molecule spectroscopy, single molecule/particle tracking, high resolution optical alignment, nanoscopy and lithography.
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Product
Advanced Node Solution
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A major new challenge at 20nm/14nm is the requirement for extra masks (double patterning technology, or DPT) to make existing lithography work at this advanced node. Read 20 questions on 20nm - a Q&A document.
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Product
Scanning Electron Microscope
E5620
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The E5620 is a MASK DR-SEM(∗) product for reviewing and classifying ultra-small defects in photomasks and mask blanks. It implements Advantest’s highly stable image capture technology to easily import defect location data from mask inspection systems and automatically image the locations. Compared to the E5610, our predecessor DR-SEM system, the E5620 features a number of improvements designed specifically to target mask requirements for extreme ultraviolet (EUV) lithography.
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Product
Lithography System
JetStep X500
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The JetStep X500 panel lithography system is optimized for volume manufacturing of high-end AICS and advanced packaging panels. The system incorporates a large field exposure system with advanced features to meet the challenging requirements encountered in production of AICS or panel level packaging, such as; fine resolution to 3µm with large depth of focus (DOF), high overlay accuracy of ±1µm, automatic magnification compensation with independent x and y magnification adjustment of ±100 ppm, and automatic handling of panel substrates of various dimensions, thicknesses, and levels of warp.
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Product
Automated Measurement System
EVG®40NT
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The EVG40 NT (stand-alone tool) and the AVM (HVM-integrated module) enable measurement of lithography relevant parameters like critical dimension, as well as bond alignment accuracy.Because of the high-measurement accuracy, it is possible to verify compliance to tight process specifications and instantly optimize integrated process parameters.
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Product
UV-NIL / SmartNIL® Systems
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EV Group provides a complete product line for UV-based nanoimprint lithography (UV-NIL), including different single-step imprinting systems, large-area imprinters as well as step-and-repeat systems for efficient master fabrication. Besides soft UV-NIL, EVG offers its proprietary SmartNIL technology with multiple-use polymer stamp technology. The efficient and robust SmartNIL process provides high pattern fidelity, highly uniform patterned layers and minimum residual layers, combined with easy scalability in wafer size and production volume. EVG´s SmartNIL redeems the long-term promise of nanoimprinting being a high-performance, low-cost and volume-capable manufacturing technology for mass production of micro- and nanoscale structures.
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Product
Patterning Simulation
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KLA’s patterning simulation systems use advanced models to explore critical-feature designs, manufacturability and process-limited yield of proposed lithography and patterning technologies. Our patterning simulation software allows researchers to evaluate advanced patterning technologies, such as EUV lithography and multiple patterning techniques, without the time and expense of printing hundreds of test wafers using experimental materials and prototype process equipment.
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Product
Laser Head
5517DL
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The Keysight 5517DL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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Product
Semiconductor
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Aerotech has a long history of engineering and manufacturing motion systems and components for high precision wafer processing, scanning electron microscopy (SEM), wafer bumping, 450 mm wafer manufacturing, lithography equipment and advanced laser micromachining. We also specialize in systems and components for vacuum applications, such as EUV lithography. So whether you need off-the-shelf wafer bumping components or a custom-engineered SEM system manufactured and tested to exacting specifications, Aerotech can provide the optimal solution for your application.
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Product
Breakthrough compressors for the GDSII and MEBES formats
GDZip + MEZip
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Recognizing the challenge to transfer, manipulate, and store the exponentially-increasing size of IC design files, Solution-Soft has developed gdzip and mezip, breakthrough compressors for the GDSII and MEBES formats used by the industry. The MEBES format is the most commonly used format for electron beam lithography and photomask production. The GDSII stream is the standard exchange format between the design world and the mask shops.
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Product
Integrated Lithography Track Systems
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Lithography track systems complete the EVG lithography product family with a fully integrated production system and high grade of automation combining mask alignment and exposure with integrated pre- and post-processing. Based on a modular platform, the HERCULES lithography track system merges EVG’s established optical mask alignment technology with integrated cleaning, resist coating, baking and resist development modules. This turns the HERCULES platform into a “one stop shop”, where pre-processed wafers are loaded into the tool and fully structured processed wafers are returned.
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Product
Nanostructuring
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AMO offers a highly flexible process-platform for the fabrication of nanostructures. We have a broad range of lithography techniques that can be flexibly combined with each other – including interference lithography. Each lithography technique is tailored to a specific pattern-transfer process and can be used on a wide range of substrates. In addition, we have developed an advanced nanoimprint lithography process that can transfer e-beam-defined patterns to large areas in a cost-effective manner.
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Product
Nanoimprint Lithography
NIL
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EVG is the market-leading supplier of nanoimprint lithography (NIL) equipment and integration processes. EVG pioneered and mastered NIL from a research approach more than 15 years ago, to implementation in volume production on various substrate sizes from 2 inch compound semiconductor wafers to 300 mm wafers and even on large-area panels. NIL is the most promising and cost-effective process for generating nanometer-scale-resolution patterns for a variety of commercial applications in bioMEMS, microfluidics, electronics and, most recently, various diffractive optical elements.
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Product
Laser Head
5517D
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The Keysight 5517D is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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Product
Dry Systems
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Chips are made up of many layers stacked on top of one another, and it’s not necessarily the latest and greatest immersion lithography machines that are used to produce these layers. In a given chip, there may be one or two more complicated layers that are made using an EUV lithography machine, but the rest can often be printed using ‘older’ technology such as dry lithography systems. This is certainly more cost-effective for customers, since these older machines are less expensive to purchase and maintain. Read about how dry lithography systems are enabling progress.
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Product
Laser Head
5517EL
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The Keysight 5517EL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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Product
Metrology Systems
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Metrology is essential to control, optimize and ensure the highest yield in semiconductor manufacturing processes. By implementing feedback loops, both process control and process parameter correction are enabled, which allow compliance to tighter process requirements. EVG's metrology solutions are optimized for lithography and all types of bonding applications, and use non-destructive measurement methods. Customers can choose between integration of the metrology technology within fully automated process equipment, or stand-alone metrology systems serving multiple process steps.
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Product
Lithography
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With steppers for advanced packaging and flat panel display technology, Onto Innovation's latest fleet will meet today's manufacturing challenges head on. Systems are designed to maximize throughput without limited resolution and overlay.
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Product
DUV Lithography Systems
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ASML's deep ultraviolet (DUV) lithography systems dive deep into the UV spectrum to print the tiny features that form the basis of the microchip.
