Product

2 Inch 535g Steel Impact Ball For Impact Test

CX-B2

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Shenzhen Chuangxin Instruments Co., Ltd.

CX-B2 - Shenzhen Chuangxin Instruments Co., Ltd.

2 inch 535g steel impact ball for impact test

Product

01 With Soldering Eyelets | 10 Positions | M10

01-1xxx-00/30xx-10-N

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ELMA Electronic, Inc.

01-1xxx-00/30xx-10-N - ELMA Electronic, Inc.

Multi wafer compact selector with 36° detent angle, 6 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque

Product

Solderability Tester

MUST 3

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Gen3 Systems Limited

MUST 3 - Gen3 Systems Limited

The MUST System 3 is the latest technological evolution of the original Multicore Universal Solderability Tester (MUST) that grandfathered all modern solderability test standards. It remains the unquestioned industry benchmark for solderability testing.

Product

IEC60950 Ball Drop Impact Test Apparatus

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Shenzhen Chuangxin Instruments Co., Ltd.

Shenzhen Chuangxin Instruments Co., Ltd.

It is mainly used for mechanical strength testing equipment enclosure, test equipment enclosure should be able to ensure that the structure can be expected to withstand the operation does not produce within the provisions of the standard risk for damage to the outer surface of the enclosure will touch dangerous parts of the apparatus.

Product

Soldering Station

SM-858

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MCH Instruments Co.,Ltd.

SM-858 - MCH Instruments Co.,Ltd.

Digital Antistatic Soldering Station

Product

3D Solder Paste Inspection Machine (3D-SPI)

3Si Series

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Saki Corporation

3Si Series - Saki Corporation

Saki's 3D SPI identifies critical defects and assists with process improvement.

Product

Dual Projection 3D In-Line Solder Inspection System

KY8030-2

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Koh Young Technology

KY8030-2 - Koh Young Technology

The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization

Product

Solder Paste

MVP Versa (3D SPI)

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Machine Vision Products

MVP Versa (3D SPI) - Machine Vision Products

The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.

Product

96-Pin 1.27mm Pitch Female Solder Pad Connector With Backshell, Screwlocks

C096SFR-4SP-5A

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Pickering Interfaces Inc.

C096SFR-4SP-5A - Pickering Interfaces Inc.

This connector is designed to allow users to discrete wires using solder pad connections to the 96-Pin 1.27mm pitch connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.