Solder Ball
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Product
Copper Pillar Bump
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Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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Product
BGA SMT Adapters
Giga-snaP™
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Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Product
Silver Ball Matrix Sockets
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SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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Product
Grypper "Y"
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Ironwood Electronics Grypper Y contact is design to work with BGA devices with solder balls/bumps with no equator or small exposure where the standard Grypper cannot reliably hold on to the solder ball. The Y shape, working with the sliding lid, allows reliable contact and ensures device retention in high vibration application. Lower forces, <25 grams, makes insertion easier too and the less aggressive contacting allows 40+ insertions of the same device. The Sliding Lid can be configured to include heat sinking. The Y contact designs cover BGA devices from 0.35mm pitch and larger and the short electrical length has superior electrical performance.
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Product
Socket Accessories (SMT Options)
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The SMT adapter consists of standard high temperature FR4 with plugged via technology, eutectic SN63PB37 solder balls or SAC lead free solder balls and threaded inserts for mounting the socket. The top side of adapter has SMT pads to receive socket interconnect and the bottom side has appropriate solder balls for corresponding pitch. This FR4 adapter with balls can be soldered to the SMT pads in the target board. Then socket can be mounted to the threaded insert on the FR4 adapter.
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Product
Grypper G35 / G40
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*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*Oxide cutting wipe action: The contact design wipes the side of the solder ball during insertion, breaking through solder oxides ensuring a good electrical connection between contact and solder ball*Signal integrity: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection*Test socket has solder balls attached: The G40 contacts have solder balls reflowed onto the contacts to ensure reliable solder volume at the PCB to test socket solder interface.
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Product
Soldering Inspection Video Microscope
MS-1000
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The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
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Product
Tool, Solder Kit, Mini Coax with Solder Sleeve
910121144
Soldering Fixture
Used to solder Mini Coax Solder Sleeve contacts.
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Product
Soldering Test
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The soldering tests are conducted to determine if materials can withstand soldering effects, such as resistance to soldering heat, as well as the solderability of components during the manufacturing process.
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Product
Solder Paste
MVP Versa (3D SPI)
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The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
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Product
Soldering Station
SM-943
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*Module: 943*Display: LED*Power Rating: 220V/70W*Temperature: 200-480DEGREE*Noisy: <45dB
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Product
1040g Steel Impact Ball Drop Impact Test Ball
CX-B104
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Shenzhen Chuangxin Instruments Co., Ltd.
1040g Steel impact ball drop impact test ball
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Product
Solder Test Pallet
WaveRIDER® NL 2
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The wave soldering process is one of the most challenging procedures to set up. The ECD WaveRIDER NL 2 greatly simplifies wave solder set up and ensures perfect repeatability, time after time. Board recipe preheat temperatures, conveyor speed, wave height, contact times and parallelism are all measured and monitored using the WaveRIDER NL 2 process pallet.
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Product
Solder Paste Analyser
SPA 1000
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The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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Product
68-Pin Micro-D Male Solder Bucket
40-962A-068-SB-M
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This connector is designed to allow users to directly terminate with soldered connections to the 68-Pin SCSI Style Micro D connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
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Product
01 With Soldering Eyelets | 6 Positions | M10
01-1xxx-00/30xx-6-N
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Multi wafer compact selector with 60° detent angle, 6 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque
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Product
Solder Wettability Tester
5200ZC
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The current machine (5200TN) was developed as a comprehensive machine that covers solderability test standards around the world, but we have added a high cost performance machine to the lineup that has realized the request of "single function + low price", which many people who are using the successive machines of SAT2000-5000-5100 type.
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Product
Replacement Solder Tip Lead Set for D410/D610
Dx10-SI
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- Choice of 4 GHz or 6 GHz bandwidth models- Up to 5 Vpk-pk dynamic range with low noise- ±3 V offset range- Low loading and high impedance for minimal signal disturbance- Ideal for DDR2, DDR3, LPDDR2- Deluxe soft carrying case- Innovative QuickLink architecture- Wide variety of tips and leads-- Solder-In Lead-- Optional Positioner (Browser) Tip-- Quick Connect Lead-- Square Pin Lead-- HiTemp Solder-In Lead
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Product
37-Pin D-Type Male Solder Pin HV
40-960-037-MHV
D-Sub Male Connector
This connector is designed to allow users to directly terminate cables with soldered connections.
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Product
Tool, Soldering Fixture, Micro Coaxial, Receiver and ITA
910121178
Soldering Fixture
Tool, Soldering Fixture, Micro Coaxial, Receiver and ITA.
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Product
25-Pin D-Type Female Solder Bucket
92-960-025-F
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This accessory is designed to allow users to directly terminate a cable with soldered connections to the connector. When the product is used without a backshell users should make their own cable strain relief arrangements and ensure appropriate electrical precautions are observed.
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Product
Portable Strain Gage Welding and Soldering Unit
700
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A battery-operated capacitive discharge spot welder for attaching and wiring weldable strain gages and temperature sensors.
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Product
Switch Probes (Rolling Ball Head) F88890S1101U200S05
1009596
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The Ball-Head Switch Probe F88890S1101U200S05 (item number 1009596) combines spring-loaded contacting with a defined switching or sensing function. F88890S1101U200S05 combines electrical contacting with a switching signal so that DUT presence or position can be evaluated directly in the test sequence. F88890S1101U200S05 is used for presence and position testing and sends an electrical signal to the test system when the defined actuation travel is reached. For F88890S1101U200S05, spring force is 200 cN at a nominal travel of 1 mm. F88890S1101U200S05 is rated for 1 A continuous current with a typical contact resistance of 25 mΩ. The design combines a pitch of 7 mm / 276 mil with tip style 90 (Rolling ball) and a tip diameter of 4 mm.
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Product
04 With Soldering Eyelets | 3 Wafers | 12 Positions
04-3xx4-00/30-xx
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Very robust, multi wafer selector with 30° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
9-Pin D-type Female, Solder Bucket, HV
92-960-009-F-HV
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9-Pin Female D-type Connector, High Voltage, Solder Bucket - Without Backshell
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Product
68-Pin VHDCI Connector, Slimline - Male, Solder
C068VMR-6SB-6A
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This slimline version of the VHDCI connector is designed to allow users to directly terminate a cable with soldered connections to the 68 Way VHDCI connector. It is difficult to terminate cable to the 68 pin VHDCI because of the high density and fine pitch. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
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Product
04 With Soldering Eyelets | 4 Wafers | 12 Positions
04-4xx4-00/30-xx
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Very robust, multi wafer selector with 30° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
2.3KG Steel Impact Test Ball
CX-325
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Shenzhen Chuangxin Instruments Co., Ltd.
UL858 2.3KG Steel Impact Test Ball
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Product
Ball Anvil Type Gear Micrometer
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Used for "over-pin diameter measurement" of gears A ball anvil is selected according to the gear.
