SIP
Session Initiation Protocol, Standard Interchange Protocol
-
Product
Single-in-Line (SIL / SIP) Reed Relays
-
The SIL / SIP reed relay is the industry standard when high reliability and consistent performance are desired in a compact package. Pickering Electronics Series 100 - 110 SIL / SIP reed relays feature the highest quality instrumentation grade reed switches making them suitable for the most demanding applications.
-
Product
802.11b/g/n Radio/Baseband (SiP)
SX-SDPGN
-
The Silex SX-SDPGN (Qualcomm Atheros AR6103) is a third generation wireless LAN solution, featuring 802.11n. Based on the game-changing AR6003 Wireless LAN chip, the SX-SDPGN brings 802.11n throughput, range and power eficiency to portable devices including patient monitors, printers, handheld terminals and more.
-
Product
High Voltage Mini-SIL / SIP Reed Relays
Series 131
-
The Pickering Series 131 is a new range of very small Single-In-Line reed relays intended for voltages very much higher than standard small SIL relays. The vacuumed, sputtered ruthenium reed switches have a superb low level performance also, which makes them an ideal choice where a wide range of signals are involved.
-
Product
Test SIP
-
VoIP, Video, and IPTV products must withstand and continue to function when facing all the conditions that occur on the Internet. These include attacks from hackers exploiting vulnerabilities in security and protocols as well as the common phenomenon of congestion, delay, jitter, drops, and so on. VoIP, Video, and IPTV products must demonstrate robustness and resiliency in the face of unusual and/or illegal conditions.
-
Product
Embedded QoE Reporting Technology System
VQmon/EP
-
VQmon®/EP is the most widely deployed and trusted performance monitoring/analytics technology for desktop IP phones, residential gateways, mobile handsets and other VoIP/VoLTE endpoints. It monitors the quality of live calls in real time, providing listening and conversational quality QoE scores (MOS and R-factor) and detailed diagnostics as raw metrics, RTCP XR (RFC 3611) and SIP Voice Quality reports (RFC 6035)
-
Product
Test And Product Engineering Services
-
Tessolve provide Test & Product engineering Solutions & services from simple Logic ICs, high-speed digital, RF, Analog, PMIC, Mixed-signal, MCU/MPU, MEMS, Image Sensors, Memory to complex devices like ASIC/ASSP, SoC / SiP devices that go into Automotive, IoT, Wearable, Wireless, Computing, Network / Fiber optics and other consumer markets. We also engage ourselves in providing test solutions for emerging technologies in the 2.5D / 3D space.
-
Product
Absorption Probe
ASD25-N
-
ASD25-N probe for direct installation into bioreactors, pipelines and vessels measuring absorption, cell growth and optical density of various liquid samples under sanitary process environments. The probe is suited for Sterilization In Place (SIP) / and Clean In Place (CIP) procedures.
-
Product
IQ4 Pipeline Metal Detection
-
The IQ4 Pipeline is a robust system designed for both Sterile in Place (SIP) and easy strip down cleaning depending on the application, complying to EN1672-2 hygiene standards. This system is designed to be used with pumped and flowing products such as meat slurries, soups, sauces, jams or dairy.
-
Product
WAN Emulation
-
Net.Storm is able to simulate any network condition to check how tolerant your services, protocols and devices are when quality / capacity degradations occur. It replicates accurately combined effects such as packet delay, errors, loss, bandwidth variations, traffic shaping and traffic policing.VoIP.Master is an advanced turn-up solution for VoIP allowing technicians to deploy VoIP thanks to its emulation capabilities that permit users to connect VoIP.Master to SIP trunks and networks emulating an IPBX, making multiple VoIP calls ensuring the trunk is operational and performing to pre-agreed SLAs.
-
Product
Isolation Amplifier
-
Mornsun Guangzhou Science & Technology
An isolation amplifier is an amplifier that provides isolation between the input and output of the circuits, including isolation between their associated power supplies. MORNSUN offers different types of analog isolation amplifiers, such as acquisition type signal conditioning modules, output isolation signal conditioning modules, two-wire loop power supply signal conditioning modules and signal isolators, etc. These analog isolation amplifiers feature excellent temperature drift characteristics of less than 50PPM/℃ across the entire operating temperature range of -40 ℃ to +85 ℃ and achieve isolation transmission, signal conversion (programmable for some models), HART communication, signal amplification, port protection and other functions. SIP, DIP, SMD and DIN Rail packages are optional.
-
Product
Ascom IP-DECT
-
Ascom IP-DECT combines Voice over IP with Digitally Enhanced Cordless Telephony (DECT) technology. Ascom IP-DECT a reliable wireless communication solution that offers enterprise-grade telephony, professional messaging, personal alarm, and positioning over secure dedicated frequency bands. It is developed based on open standards, such as SIP, which maximizes interoperability with leading vendors.
-
Product
Wireless
Virtual Panels
-
Designed with flexible work solutions in mind, the Virtual Panel enables remote users to access the full audio capabilities of the intercom system from anywhere, at any time, and be up and running in minutes without the need for dedicated operator hardware. Individual users will access the intercom via a familiar, modern software panel screen on the chosen device and a SIP connection over standard network (either wired, wireless of a combination of both). Having the audio managed by a SIP connection means the panel users are truly flexible as there is no physical connection to any dedicated hardware - it?s all in the cloud.
-
Product
Enterprise Session Border Controller
eSBC
-
Session Initiation Protocol (SIP) is the communication technology employed to set up and tear down VoIP phone calls
-
Product
Built-in MOSFET Integrated SiP
-
Renesas Electronics offers SiP products with integrated MOSFETs to enable easy configuration of high-performance multi-phase power supplies. They combine in a single package either controller, driver, and MOSFETs or driver and MOSFETs. These products make it easy to build a high-performance DC/DC converter while reducing stray capacitance and inductance, and achieving higher mounting density.
-
Product
DC toDC Converters
-
Low Cost Single Dual and Triple outputs Isolated Outputs Low Ripple, Regulated Outputs Standard packages and pin outs Custom Designs availableNew Miniature V3 Series features HighVoltage Isolation, SIP and DIP packages
-
Product
IMS-SIP Network Emulator Software
E6966B
-
Wireless telephony networks are increasing capacity for high throughput Internet Protocol (IP) packed-data by utilizing radio access technologies such as LTE and HSPA. Session Initiation Protocol (SIP) and IP Multimedia Subsystem (IMS) are progressively being adopted as part of the network infrastructure to carry traditional wireless telephony services over an all-IP network. SIP provides control of communication sessions whilst IMS is the framework that allows delivery of multimedia services over IP. With this new capability comes the need for developers and operators to move their focus to testing user equipment (UE) in this new network environment.
-
Product
SIP-90-2 Test System Interface Probe
SIP-90-2
ICT/FCT Probe
Overall Length (mil): 700Overall Length (mm): 17.78Rec. Mounting Hole Size (mil): 55Rec. Mounting Hole Size (mm): 1.40Recommended Drill Size: #54 or 1.40 mm
-
Product
SIP-90-5 Test System Interface Probe
SIP-90-5
ICT/FCT Probe
Overall Length (mil): 1,000Overall Length (mm): 25.40Rec. Mounting Hole Size (mil): 55Rec. Mounting Hole Size (mm): 1.40Recommended Drill Size: #54 or 1.40 mm
-
Product
SS7 Gateway
-
An SS7 media gateway is a networking device positioned within a carrier core network to provide protocol translations between traditional telephony signaling and modern voice-over-IP signaling (H.323 or SIP (session initiation protocol).
-
Product
SIP-90-3 Test System Interface Probe
SIP-90-3
ICT/FCT Probe
Overall Length (mil): 700Overall Length (mm): 17.78Rec. Mounting Hole Size (mil): 55Rec. Mounting Hole Size (mm): 1.40Recommended Drill Size: #54 or 1.40 mm
-
Product
µHELIX® Test Probes
Series S200, S300, S400, and S500
-
Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
-
Product
Home Automation
-
PLANET’s Home Automation product lines include home automation control gateway, IP intercoms and Z-Wave devices. Compliant with international standard protocols including Z-Wave Plus, Power over Ethernet, SIP 2.0 for Voice over IP and H.264 video codec for IP surveillance standards, PLANET’s home automation products create a safe and energy-efficient environment for modern homes and SMBs.
-
Product
Energy Equipment
-
Atec, Inc. has been designing and manufacturing instruments for energy exploration for over 50 years. We apply the same meticulous approach in providing failsafe equipment for downhole energy exploration as we do in our aerospace projects. Our corporate energy ancestry includes CATCO, SIP, Lymco Electronics, Kestran, Amtex Supply, Coastline Exploration, Coltex Drilling, and Atec Resources. Atec subsidiaries – Vital Link (Sealy, TX), Celtech (Carlsbad, NM), and Hager Machine & Tool (North Houston) – all bring extensive additional capabilities to our oil patch support operations.
-
Product
Custom & ASSP
-
Offering innovative SoC, SiP, ASIC, audio/video ASSP and other custom solutions and foundry services across a wide variety of applications in the automotive, industrial, medical, and aerospace & defense markets.
-
Product
SIP-90-4 Test System Interface Probe
SIP-90-4
ICT/FCT Probe
Overall Length (mil): 693Overall Length (mm): 17.60Rec. Mounting Hole Size (mil): 57Rec. Mounting Hole Size (mm): 1.45Recommended Drill Size: 1,45 mm
-
Product
High-density Power Drivers
-
Gate drivers, FETs and protection circuitry integrated into a single package to drive loads in industrial and home-appliance applications, with increased power density per cm². ST’s high-density power drivers are System in Package (SiP) solutions integrating in compact QFN packages the STDRIVE gate drivers and MOSFET-based power stages, responding to the industrial market trend towards higher levels of integration and lower development costs.
-
Product
Wireless Protocol Emulation
MAPS
-
Message Automation & Protocol Simulation (MAPS™) is a protocol simulation and conformance test tool that supports a variety of protocols such as SIP, MEGACO, MGCP, SS7, ISDN, GSM, MAP, CAS, LTE, UMTS, SS7 SIGTRAN, ISDN SIGTRAN, SIP I, GSM AoIP, Diameter and others. This message automation tool covers solutions for both protocol simulation and protocol analysis. Along with automation capability, the application gives users the unlimited ability to edit messages and control scenarios.
-
Product
Semiconductor Test System
TS-960e
Test System
The GENASYS Semi TS-960e PXI Express Semiconductor Test System is an integrated test platform that offers comparable system features and capabilities found in proprietary ATE systems. Available as a bench top system or with an integrated manipulator, the TS-960e takes full advantage of the PXI architecture to achieve a cost-effective and full-featured test solution for device, SoC and SiP test applications.
-
Product
Call Generation
Emutel SIP Harmony
-
SIP Harmony has strong Call Generation capabilities. Using the SIP | Harmony ''Composer'' application, scripts can be quickly created to generate high volumes of calls. Once calls are established they can be cleared down straight away or held active for any period of time to simulate different call lengths. The SIP | Harmony is also capable of terminating calls, so complete wraparound testing of any piece of equipment can be carried out.
-
Product
SDIO SiP module
SX-SDPAC
-
The SX-SDPAC is a dual-band 1x1 802.11a/b/g/n/ac plus Bluetooth 5.0+HS “Smart Ready” SDIO SiP module specifically designed for low cost high volume embedded applications.
