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Mini-ITX SBC With LGA1150 Socket Intel® Xeon® E3-v3 And 4th Gen Intel® Core™ Processor, Intel® C226, HDMI/DisplayPort/VGA/LVDS, Dual LANs And USB 3.0
MANO882
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The MANO882 supports Intel® Xeon E3 series, 4th generation Intel® Core™ i7/i5/i3 processors and Celeron® processors with the Intel® C226 chipset. Two SO-DIMM sockets onboard support up to 16 GB of DDR3-1333/1600 system memory. The outstanding motherboard sustains HDMI, DisplayPort, VGA and LVDS with triple-display capability, making this system board an ideal solution for digital signage, optical inspection for machinery, and industrial automation and control fields. In addition, the embedded board supports Intel® AMT 9.0 security technology to provide complete protection against viruses and attacks. Additionally, the MANO882 is equipped with an Infineon TPM 1.2 security chipset to enhance user data protection.
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Compact Gaming Platform Based On 12th/13th/14th Gen Intel® Core™ Processors Supports Up To Eight Independent Displays Including 4K UHD
ADi-SA6X-AD
Gaming Platform
ADLINK‘s ADi-SA6X-AD all-in-one gaming platform features powerful processing and graphics performance for gaming infotainment and retail. Equipped with 12th/13th/14th Generation Intel® Core™ processors, the ADi-SA6X-AD provides compelling graphics performance from a PCI Express 4.0x16 discrete graphics card and/or an embedded Intel® UHD Graphics 770 together with multi-display support for up to eight independent monitors. With the powerful processing performance, advanced security functions, smart middleware solutions, and versatile I/O array, the ADi-SA6X-AD fully satisfies the needs of your gaming application.
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3.5" Embedded SBC With LGA1151 Socket For 7th/6th Gen Intel® Core™ I7/i5/i3 Processor, LVDS, VGA, HDMI, 2 GbE LANs And Audio
CAPA500
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The CAPA500 features the LGA1151 socket 7th generation Intel® Core™ processor family (codename: Kaby Lake) with 35W TDP (thermal design power), as well as the Intel® H110 chipset (Q170 optional). The CAPA500 supports one 260-pin DDR4-2400 SO-DIMM with a memory capacity up to 16GB for extensive storage. The compact 3.5-inch embedded motherboard also offers display outputs through HDMI, VGA and LVDS for triple independent display applications. Moreover, the compact-sized embedded board runs on +12 VDC power, supporting auto power-on. It can operate at a wide range of temperatures from -20°C to 60°C under active thermal control. The 146 mm x 104 mm embedded SBC is suitable for IoT/M2M-related, industrial control, self-service terminal, digital signage, POS, kiosk and many other applications where high-speed processing and graphics performance under limited space is required.
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Two-Way Optical Loss Tester
KI23403OLV-INGAAS-APC-50U
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A Two-Way Optical Loss Tester (OLTS) that's perfect for medium to ultra high fiber count loss, length and optical return loss testing applications on multimode fiber at 850 / 1330nm. A pair of these compact instruments set new standards of productivity, accuracy and ease of use. A multimode APC connector on this model is required for reliable ORL test performance.
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THIN AI Motherboard 12th Gen Intel® Core™ Processor (Alder Lake), MXM GPU Integration
AIMB-288E
Motherboard
12th Gen Intel® Core™ Desktop Processors (LGA1700), with H610ESupport Intel Arc Embedded MXM GPU or NVIDIA Quadro Embedded MXM GPUUp to 64GB DDR5 4800 MT/s with two SO-DIMMTriple displays with 2 DP and 1 eDP, up to 4KAbundant Expansion: 1 M.2 M-key & 1 M.2 B-key, 4 USB 3.2 Gen2x1 & 2 USB 3.2 Gen1x1, 1 SATA IIISupport Windows 10 LTSC & Ubuntu 20.04 LTS; SUSI API, and WISE-DeviceOn for quick AI deployment at scale
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Open Pluggable Specification (OPS) Digital Signage Player With Socket G2 Intel® Core™ I5/i3 And Intel® HM76 Chipset
OPS870-HM
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OPS870-HM Open Pluggable Specification (OPS) compliant signage player is powered by 3rd Generation Intel® Core™ processors. The high performance OPS870-HM is based on Mobile Intel® HM76 Express chipset and features 3rd Generation Intel Core processors based on the leading edge 22nm process technology. Axiomtek's OPS870-HM is engineered to be installed into any OPS-compliant digital signage platform to enable faster and easier installation, and straightforward upgrading and maintenance. It significantly provides superb graphics performance, full HD content playback, and dual display presentations. Equipped with the OPS870-HM, users can apply a variety of DOOH (Digital Out Of Home) applications with ease!
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Modular TPC - Computing Box Module With Intel® Core™ Processors (10th Gen)
TPC-B610
Panel PC
High Performance Computing Box powered by Intel® 10th Gen. Core™ i CPU Socket (LGA1200) with fanless design6 x Panel Modules (IP66) ranging from 15" to 23.8" in selectionDual Channel Memory slots (DDR4) support up to 64GB in totalComprehensive I/Os, including 6 x USB, 2 x COM, 2 x RJ45...etcSupports Expansion via 1 x PCIe x16, 1 x mPCIe, 2 x M.2 (NVMe, SATA, 5G)Supports Storage via 2 x 2.5" HDD/SSD (RAID 0/1), 2 x M.2 (2242/2280)Supports Fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technologySupports Diverse system I/O, DIO, PoE...etc. via iDoor technologySupports TPM 2.0 hardware security
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PXI Embedded Controller i5, dual core, Windows 7
OTP2 module no.184
Embedded Controller
PXI offers the optimal approach to validation and production testing. You can meet timing, synchronization, and throughput requirements across devices. PXI is a robust PC-based platform for measurement and automation systems, supported by software. PXI combines PCI electrical bus characteristics with CompactPCI's modular Eurocard packaging, and then adds special synchronization buses and important software functions.
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High-Performance Gaming Platform Based On 12th Gen Intel® Core™ Processors Supports Up To Eight Independent Displays Including 4K UHD
ADi-SA2X-AD
Gaming Platform
ADLINK's ADi-SA2X-AD all-in-one gaming platform features powerful processing and graphics performance for gaming infotainment and retail. Equipped with 12th Generation Intel® Core™ processors, the ADi-SA2X-AD provides compelling graphics performance from a PCI Express 4.0x16 discrete graphics card and/or an embedded Intel® UHD Graphics 770 together with multi-display support for up to eight independent monitors. With the powerful processing performance, advanced security functions, smart middleware solutions, and versatile I/O array, the ADi-SA2X-AD fully satisfies the needs of your gaming application.
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Low Loss Cable Assemblies
True Blue
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The Answer: An unmatched combination of low loss, durability, and value.The Question: What does Teledyne Storm Microwave’s True Blue® line of cable assemblies provide?For more than 30 years, our True Blue® assemblies have been the winning choice of design, test, and production engineers for:- Military and aerospace design-in applications- General purpose test applications- Production testing- With a design based entirely on high-performance materials, the True Blue® line covers frequencies from DC to 50 GHz.Assemblies are available in both custom configurations and a variety of standard lengths and connector combinations.The basic True Blue® cable is designed to be durable. However, for applications requiring added durability, assemblies are also available ruggedized, armored, and soft armored.
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LV Iron Core Smoothing Reactors
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Smoothing Reactors are serially connected reactors inserted in DC systems to reduce harmonic currents and transient over currents and/or current ripples in DC systems. They are necessary in order to smooth the direct current wave shape to reduce losses and improve system performance.
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Air Core Test Lab Reactors
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Test Laboratory Reactors are designed for high voltage and high power test laboratories. They are designed to withstand the most extreme electrical service conditions during test periods. Design techniques are implemented in accordance with the most demanding service conditions. These reactors are used for various purposes in test laboratories such as current limiting and synthetic testing of circuit breakers, capacitor testing, artificial line simulation etc.
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2U Rackmount Network Application Platform Base On Intel 12th/13th/14th Gen Intel® Core Processors. Ideal For Data Center Deployments.
FWA-4134
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12th/13th/14th Gen Intel Core Processors, up to 24 Cores/32 Threads, Hybrid Performance & Efficiency Cores4 x DDR4 3200MHz ECC UDIMMs, up to 128GB4/8 x Advantech network module expansions1x Mini-PCIe slot1x PCIe x8 slot on rear, supports FH/HL add-on cards1 x mSATA slot, 2/4 x 3.5” HDD bays
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Pico-ITX SBC With 6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processors, HDMI/LVDS, LAN And Audio
PICO500
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The PICO500, an extreme compact pico-ITX embedded board, supports the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (Codename: Skylake-U). The tiny PICO500 is equipped with one DDR4 SO-DIMM with up to 16 GB memory capacity. Integrated with Intel® HD graphic engine, the Pico-ITX motherboard supports HDMI and 18/24-bit dual channel LVDS that delivers a whole new level of Ultra HD 4K visual experiences. Its Pico-ITX form factor allows for an extremely compact performance system; meanwhile, the PICO500 is built to withstand wide temperature conditions, ranging from -20°C to +70°C (-4°F to +158°F) with active thermal solution.
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Fanless Embedded System With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processors, Built-in Layer 2 Managed PoE Switch For Railway PC
tBOX400-510-FL
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The tBOX400-510-FL is a two-in-one transportation-certified box PC with built-in layer 2 managed PoE switch for IP surveillance applications. The tBOX400-510-FL is certified with CE (Class A) and FCC and is in compliance with EN 50155 and EN 45545-2. This high-performance transportation box PC is powered by the 7th generation Intel® Core™ (Kaby Lake) or Intel® Celeron® 3965U processors, along with dual DDR4 SO-DIMM slots for up to 32GB of memory. The built-in 10-port managed switch is powered by Qualcomm's chip. The tBOX400-510-FL has a built-in 10-port managed switch with 8-port 10/100 Mbps PoE and 2-port Gigabit LANs, featuring VLAN, QoS and PoE scheduling for the more secure and smooth network. For reliable operation in severe environments, the rugged fanless transportation box computer is designed to withstand a wide temperature range from -40°C to +60°C and vibration of up to 3 Grms. It also supports a wide voltage input range: 9V to 36V DC for vehicle applications, 14V to 32V DC for marine applications, and 24V to 110V DC for railway applications. With its high performance, industrial-grade design and full-strict certifications, the tBOX400-510-FL is suited for transportation-related applications such as onboard video surveillance and video management.
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15.6" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-315SW RPL
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Industrial-grade true-flat touchscreen with IP66-rated front panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware securitySupport iDoor, PCI or PCIe
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Quad Core KeyStone™ DSP + UltraScale™ FPGA Module
SMT6657-KU35
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Sundance Multiprocessor Technology Ltd.
The SMT6657 DSP+FPGA module is a reliable and flexible platform for digital signal processing applications requiring high-performance integer and floating-point computation.It is applicable to both symmetric multiprocessing applications in which the computational load is shared by the two DSPs and asymmetric applications where one of the DSPs is responsible for hard real-time processing and the other acts as a supervisor, handling all non-deterministic communication and optionally running under control of an operating system.
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Fanless Embedded System With Intel® Celeron® 2980U/ Core™ I5-4300U/i3-5010U ULT SoC, HDMI/DisplayPort, 2 GbE LANs, 4 USB 3.0, 2 COM And PCIe Mini Card
eBOX560-880-FL
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The eBOX560-880-FL, a palm-sized, fanless embedded computing system utilizes high performance Intel® Haswell ULT multi-core SoC. The ultra-compact, ultra-lightweight eBOX560-880-FL adopts an IP40-rated rugged aluminum cold-rolled steel enclosure to withstand vibration of up to 3 Grms (with SSD) and has a unique thermal solution to support the temperature range from -20°C to +50°C (-4°F to +122°F). Supporting 4K2K resolution via HDMI interface, the outstanding embedded box computer is ideal for passenger information system, Kiosk, entry-level gaming, video surveillance, and other automation & embedded applications.
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Fanless Embedded System With LGA1151 Intel® Xeon®, 9th/8th Gen Intel® Core™ I7/i5/i3 Or Celeron® Processor, Intel® C246, ECC/Non-ECC And 1 PCIe X4 Expansion Slot
eBOX710-521-FL
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*Intel® Xeon®, 9th/8th gen Intel® Core™ i7/i5/i3 or Celeron®processor*2 DDR4 ECC/non-ECC memory supported, up to 64GB*Dual swappable 2.5" SATA HDD drive bays with RAID 0 &1*DVI-I, HDMI, and DisplayPort with triple-view supported*6 GbE LAN, 6 USB 3.2 and 1 PCIe x4 expansion slot*Flexible I/O window supported
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18.5" FHD TFT LED LCD Touch Panel Computer With 13th Gen Intel® Core™ Processors And ATEX Explosion-Protected Certification
SPC-618WE
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Industrial-grade 18.5" FHD TFT LCD with 50K lifetime and LED backlightIntel® Core™ Processors (13th Gen ), i7-1365URE deca-coreBuilt in single DDR5 4800 RAM with 32GB capacityBuilt in sTLC SSD of 256GB with extreme longevity and reliabilityCompact, fanless embedded system with aluminum alloy front bezel and chassis grounding protectionSpecialized enhanced impact proof touchscreen with PCAP touch control and IP65-rated front panelDiverse system including Type C connector with USB 3.2, DP 1.4a, 15W power deliverySupport TPM2.0 hardware securityIEC Ex & ATEX certification for Zone 2/22 criteria and Class I Division II explosion proof certification
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Intelligent Pluggable System Specification (IPSS) Digital Signage Player With 4th Gen Intel® Core™ I5, Intel® QM87, AMT 9.0 And TPM 1.2
OPS885
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The OPS885 is world first Intelligent Pluggable Systems Specification (IPSS) compliant digital signage player. The OPS885 adopts the 4th Generation Intel® Core™ i5 processor with the Mobile Intel® QM87 Express chipset and provides superb graphics performance with 4K resolution. It comes with Intel® Active Management Technology 9.0 (AMT 9.0) that offers convenient remote diagnosis and cost-effective maintenance. The advanced signage player also features Intel® Retail Client Manager (Intel® RCM) that integrates an easy-to-use digital signage content CMS with analytics and security features. The IPSS compliant OPS885 provides digital signage vendors a comprehensive solution, and reduces their development effort and time to market. It is excellent for various display applications in shopping mall, corporate, education, bank, transportation, retail store, restaurant, performing art center.
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Embedded Motherboard supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
AMSTX-CF Series
Motherboard
Embedded graphics enables system developers to boost the performance of a wide range of workloads, including medical imaging, image analysis, compute acceleration, and artificial intelligence (AI). Leveraging graphics processing units (GPUs), embedded graphics can be used to increase application speed and accuracy, as well as decrease latency. Many embedded system developers are using embedded graphics solutions in real-world applications, such as medical, manufacturing, and traffic management, along with other embedded segments.
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COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-TL
Computer on Module
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
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1U Rackmount Network Appliance Platform With LGA1151 Socket Intel® Core™/Xeon® E-2100 Series Processor, Intel® C246/H310 And Up To 26 LANs
NA590
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*LGA1151 socket 8th gen Intel® Core™/Xeon® E-2100 series processor (Coffee Lake)*Four DDR4-2666 U-DIMM for up to 64GB of memory*Max. up to twenty-six 10/100/1000 Mbps Ethernet ports*Two expandable LAN modules supporting 1GbE/10GbE/25GbE/40GbE/Fiber/Copper/Bypass*Supports 1U redundant power supply for optional*Supports IPMI/TPM for optional*Suitable for network security, cloud computing and data centers applications
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Iron loss Testers
ATS Series
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Hunan Linkjoin Technology Co., Ltd.
Linkjoin Iron Loss Testers
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COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
Express-RLP
Computer on Module
ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
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Compact, Industrial Thermal Imaging Core
Dione 320 OEM Series
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The Dione 320 OEM is based on a state-of-the-art detector with a 320×240 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK.The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 25 x 25 x 10 mm3 and weight is 6 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione 320 versions have the same SAMTEC ST5 connector and are GenICam compliant.The compact Dione 320 OEM series find application in industrial machine vision, medical, scientific and advanced research, safety and security systems.
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Mini-ITX SBC With LGA1151 Socket 6th/7th Gen Intel® Core™ Processor, Intel® H110/Q170, HDMI/DisplayPort/VGA/LVDS/eDP, Dual LANs And USB 3.0
MANO500
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The MANO500 is based on the new 14nm 7th/6th generation Intel® Core™ i7/i5/i3 and Pentium® processors in the LGA1151 package. Featuring the new Intel® H110 Express chipset with DDR4 2133MHz memory support, this motherboard is built to perform. Its three SATA 6G ports, four USB 3.0 ports, and two RS-232/422/485 ports provide robust storage and I/O options. Users also can increase board functionality with PCIe x16 slot and PCI Express Mini Card slot. The high quality MANO500 allows the connection of up to four display interfaces via HDMI, VGA, DisplayPort, and LVDS/ Embedded DisplayPort (eDP), making it an ideal solution for gaming, workstation, digital signage, medical and other IoT&M2M applications.
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LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ MicroATX Server Board with 4 DDR4, 4 PCIe, 6 USB 3.1, 8 SATA3, Quad/Dual LANs, IPMI
ASMB-586
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- LGA 1151 Intel® Xeon® E and 8th/9th generation Core™ i7/i5/i3 processors with C246 chipset- DDR4 ECC/Non-ECC 2666/2400/2133 MHz UDIMM up to 128GB- One PCIe x16, two PCIe x4 and one PCIe x1 slots- Triple displays - DVI-D, VGA and HDMI 2.0 ports- Eight SATA3 ports and six USB 3.1 ports- 0 ~ 60° C ambient operating temperature range
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Modular TPC - Computing Box Module With Intel® Core™ Processors (13th Gen)
TPC-B520
Panel PC
Modular Computing Box powered by Intel® Core™ processors (13th gen) i5-1335UE deca-core/ i7-1365URE deca-core processorSingle DDR5 Memory slot supports up to 32GBSupport expansion via three M.2 slots (NVMe, Wifi, 5G)LAN, POE, isolated serial port and isolated digital I/O via iDoor technologySupport Type C connector with USB 3.2, DP 1.4a, 15W power deliverySupport fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technologyModular Front Panel modules ranging from 12.1" to 23.8" with P-CAP multi-touch in selection (12.1", 15", 15.6", 21.5" with high brightness panel option)
