Ground Bond
Checks a ground circuit's ability to handle fault current in the event of insulation failure.
-
Product
Die-To-Wafer Bonding Systems
-
Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
-
-
Product
Earth Ground Testers
-
Plant maintenance is a must! Confirming your ground resistance is crucial for instruments and machinery. Our Earth Ground Testers provide simple accurate measurement of earth resistance.
-
Product
Ground Resistance Tester
2521
-
Shenzhen Chuangxin Instruments Co., Ltd.
High measuring accuracy, high speed, easy to use, especially suitable for using in laboratory and automatic testing line. Test current AC / 5 ~ 30 (a), resistance Ω (0 ~ 600 m), time (1 ~ 99 s) shows at the same time. Test time can be arbitrary setted. Test alarm value can be arbitrary set up. Pass/fail sound and light alarm.
-
Product
ESD Ground Point
EGP-020
-
The EGP-020 ESD Ground Point is a convenient mechanical socket that can be mounted on to any equipment frame for equal-potential bonding to the equipment. The 4 mm socket is not insulated, made of lathed brass, nickel-plated, for use as grounding socket.The EGP-020 is designed to be mounted on an unpainted conductive surface.
-
Product
Ground Cables and Clusters
-
STB Electrical Test Equipment, Inc
STB builds, tests and repairs grounding equipment. Ground cables and clusters are built to each customer's specifications.
-
Product
Temporary Bonding Systems
-
Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, important for 3D ICs, power devices and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors. A device wafer is bonded to a carrier wafer with the help of an intermediate temporary bonding adhesive, allowing the typically fragile device wafer to be processed with additional mechanical support. After the critical processes, the wafer stack is debonded. EVG’s outstanding bonding know-how is reflected in its temporary bonding equipment, which has been provided by the company since 2001.
-
Product
Bond Force Measurement And Calibration Systems
BFS-20
-
Based on its design and easy handling it can be used also on other brands to measure the bond force.
-
Product
Fusion Bonded Cable Jumpers
Series 152FB
-
Fusion Bonded Cable Jumpers. Aries Series 152FB Fusion Bonded Cable Jumpers are flexible...plug them directly into PC boards or sockets. Stranded wire conductors are fusion bonded with an overcoat of tin for easy soldering or socketing. Each jumper is shipped with protective tabs on both ends for maintaining proper conductor spacing.
-
Product
Ground Weather Analytics
HELIOS
-
L3Harris Geospatial Solutions, Inc
Microclimates are on the rise, and as a result, there are extreme deviations of wind, snow, fog and visibility even over short distances. Organizations of all sizes need hyperlocal ground information and weather data to enhance operational efficiencies and make better decisions that can save time, money, property and even lives.
-
Product
Ground Resistance Testers
-
IP67 protected top in the industry Test all ground types from Class A to Class D with a single meter Wide 0 to 2000 measurement range Minimize cabling time with innovative earthing rods and cable winder
-
Product
Ground Fault Monitor
IFT-120
-
Our ground fault monitors enable you to easily and quickly find the source of the fault before a major problem occurs and damages your equipment. This is the IFT-120, designed to assist you in rapid identification of ground faults.
-
-
Product
Post Wire and Die Bond Inspection Machine
IV-T3300
-
IV-T3300 is a post wire and die bond inspection machine with Dual JEDEC Tray Feeder System. It features a large inspection area of 600x500mm and a quick trays change of 5-7 seconds.
-
Product
SAFE-T-GROUND - Ground Continuity Monitor / Control
TR-7
-
Model TR-7 Safe-T-Ground provides continuous monitoring of a truck's ground connection throughout loading operations. Static electricity is often brought in by tank trucks entering the loading area. The Safe-T-Ground Model TR-7 instantly stops loading operations if a tank truck loses its ground.
-
-
Product
Hybrid And Fusion Bonding Systems
-
Hybrid bonding extends fusion bonding with embedded metal pads in the bond interface, allowing face-to-face connection of wafers. The main application for hybrid bonding is advanced 3D device stacking.
-
Product
Ground Fault Monitors
IFT
-
In most industrial settings, ground faults can cause significant damage. Since these leaks are unavoidable in almost all industrial environments, our ground fault monitors allow you to quickly and easily find the source of the leak before a major problem occurs and damages your equipment. The IFT-120 is designed to help you rapidly locate ground faults.
-
Product
Ground Grid Tester
GGT Series
-
The GGT500 ground grid integrity tester is designed for inspection of the substation ground grid. It can also be used as a portable micro-ohmmeter with Both Sides Grounded and Remote Control functionalities. It is intended to inspection the conditions of a grounding system beneath substations, testing of medium- and high-voltage circuit breakers, disconnecting switches, high-current bus bar joints, cable splices, and different high-current links.In the United States when inspecting the quality of the grounding systems beneath a substation, the proper procedure is to inject 300 A DC during a time period of 60 s. This is what the GGT500 will do, and in that time period, the current path and voltage drop are checked. Also acting as a micro-ohmmeter, the GGT500 can test low resistance values by producing high test currents of up to 500 A.The instrument is placed in an unbreakable, plastic case with IP67 protective rating (with closed lid). Although very portable and lightweight, micro-ohmmeters have very high output power capabilities. High output voltage enables a wider measurement range at higher test currents, as well as the use of thinner/longer test cables. GGT500 ground grid integrity tester generates a true DC ripple-free (less than 1 % ripple) current with automatically regulated test ramps. This significantly decreases magnetic transients and ensures great accuracy.When used for testing in Both Sides Grounded conditions, a special current clamp powered from the ground grid integrity tester is used for measuring a current through groundings. If even a higher safety level is required, the remote control feature enables the operator to perform measurements from a distant location, away from the instrument and test object.
-
Product
Ground Grid Systems
-
The Ground Grid systems module enables engineers to quickly and accurately design and analyze ground protection. Flexible design methodologies allow for quick auto-designed layouts or very detailed schemes. Color-coded graphical plots provide impressive results.
-
-
-
Product
Stator Ground Protection Relay
SEL-2664S
-
Schweitzer Engineering Laboratories, Inc.
Protect high-impedance grounded generators from ground faults at standstill, during startup, and while running with the multisine frequency injection and neutral overvoltage-based protection in the SEL-2664S.
-
-
-
Product
Truck Mounted Static Grounding Verification
Earth-Rite MGV
-
The Earth-Rite Mobile Ground Verification system (MGV) is a unique, patented technology designed to provide automatic confirmation of a positive electrostatic ground connection for trucks collecting and transferring flammable / combustible products.
-
Product
Bonding Ohmeters
-
bonding ohmmeter is an affordable, highly accurate, and intrinsically safe electrical bond tester. This meter is capable of performing bond measurements on a variety of components and metal-to-metal connections. The 620LK has been independently UL-913 certified, ensuring quality and safety at each step of manufacturing. Due to its safety certifications and high level of accuracy, the 620LK meter is the choice bond tester for many commercial airliners, while its sibling the 620UK-B is in countless USAF programs.
-
Product
Bond Tester
Sigma
-
Sigma is the most advanced bond tester. It comes with game-changing automation capabilities and high specifications
-
Product
Ground Testing
-
Ensuring an effective earth system is essential in a telecommunications system, and Megger is expert in earth testing having been there right from the start. These days Megger offers top end systems for design and soil surveys as well as tough easy to use testers for field engineers. We have tried to make the testers self checking as much as we can, to allow you to concentrate on collating and understanding the results.
-
Product
Resistance Wire Bonding
-
Electronic Systems of Wisconsin, Inc.
ESW's Resistance Wire Bonding System comes equipped with the latest features the market has to offer. Our system is capable of bonding armatures, stators or coils. The on-screen display in our bonder makes it easy to read, track, and record your bonding data. If desired, ESW offers complete electrical testing of the part prior to the bonding sequence as well. This ensures only good parts that have been electrically tested are processed through bonding. It is our duty to make sure you never have to worry about losing important information again. Our Sales and Engineering staff will work closely with you to make sure that a bonding systems will meet your needs. See the slideshow below to see some of our Resistance Wire Bonding Testers.
