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Product
Fabric Drape Tester
TF118
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TESTEX Testing Equipment Systems Ltd.
Fabric Drape Tester, to measure and calculate the coefficient of drape by tracing a shadow of the draped fabric on paper. Fabric Drape Tester complies with BS EN 9073, BS 5058, ERT 90-1, etc.
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Product
40 Gigabit Ethernet AdvancedTCA® Fabric Interface Switch Blade
aTCA-3710
Switch Blade
The aTCA-3710 is a high performance, high bandwidth, 40G Fabric switch blade for AdvancedTCA® platforms. This product is ideal for bandwidth intensive telecom applications such as wireless access controller, DPI/security network, IPTV, IP multimedia subsystem, RNC/BSC, broadband access/bearer network, data center, and LTE/4G network applications. The aTCA-3710 provides 40GbE hub-to-node connectivity and integrated switch silicon that supports load balancing, priority queues, packet classification, and flow control to enable strict bandwidth management for implemented applications.
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Product
CompactPCI CPSB 2.16 6U 8 slot, 6 w/cPCI, 2 Fabric, no P2
107PS21608-0257R
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CompactPCI CPSB 2.16 6U 8 slot, 6 w/cPCI, 2 Fabric, no P2, fully compliant to the PICMG 2.16 Packet Switching Backplane specification.
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Product
Star Fabric to PXI Module
41-921-001
Chassis
This module resides in the Slot 1 position of a PXI chassis and interfaces to the backplane of the PXI chassis. When located in a generic peripheral slot, it can be used to drive two extension PXI chassis.
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Product
Easy-to-assemble and Collapsible RF Test Enclosure With Fabric Shielding, ≥ 90 DB Isolation, 300 MHz - 18 GHz
dbTENT
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The dbTENT is an easy-to-assemble, store and transport high-performance RF test enclosure. Whether you need to make measurements in the field or in the lab, the dbTENT provides superior 90 dB of isolation over a wide frequency range thanks to its patented double layer conductive fabric design. Featuring an interchangeable customisable I/O panel, the dbTENT meets all your needs for non-permanent isolated testing. With a setup time of only minutes, the dbTENT will get you ready for testing instantly in a wide variety of environments.
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Product
9U Blade Server for 12 Blades with Dual Fabric Switch Slots
cPCIS-3300BLS
Blade Server
- PICMG® 2.16 Packet Switching Backplane architecture- Dual PICMG® 2.16 fabric slots for high availability- 21 slots, including 12 node slots, two fabric slots, three redundant 6U CompactPCI® power modules and one CMM slot- Hot swappable 800 W + 400 W redundant CompactPCI® power supply with universal AC input
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Product
FTB Ecosystem
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Imagine test tools that actually help you deliver services with speed and quality. Imagine if you could institutionalize operational efficiencies, eliminate silos and make every component of your deployment, turn-up and monitoring part of one tightly woven fabric.
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Product
6U VPX – OpenVPX Backplanes
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VPX is a broadly defined technology utilizing the latest in a variety of switch fabric technologies in 3U and 6U format blades. OpenVPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments.
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Product
VPX / OpenVPX Chassis
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VPX is a broadly defined technology utilizing the latest in a variety of switch fabric technologies in 3U and 6U format blades. Open VPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments.
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Product
3U CompactPCI Serial Blades
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The PICMG CPCI-S.0 CompactPCI Serial standard, which evolved from the PICMG 2.0 specification, is the fastest, most versatile, most cost-effective open standard for CompactPCI (CPCI). The Serial standard is mechanically and electronically compatible with 3U and 6U euro-cards, defining an interface for high-speed switched fabrics with a star topology. Point-to-point connectors allow up to eight peripherals on one system slot without switches or bridges. Ethernet data transfer can be configured with full mesh topology, which allows up to 1000Base-T connections to all peripheral slots for redundant, safety-critical systems.
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Product
Wafer Manufacturing
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Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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Product
Brush or Sponge Pilling Tester
TF222
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TESTEX Testing Equipment Systems Ltd.
Brush or Sponge Pilling Tester, to determine the pilling propensity and simulate normal wear of knitted and woven fabrics used in apparel and automotive interiors by brush and/or sponging specimens together in a circular motion to form pills. Specimens are evaluated under standard lighting conditions using a pilliscope, light cabinet or similar, against users’ standard fabrics or piling photographs.
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Product
2-Channel 500 MHz A/D and 2-Channel 800 MHz D/A with Virtex-6 FPGA - 3U VPX
Model 52650
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- Complete radar and software radio interface solution- Supports Xilinx Virtex-6 LXT and SXT FPGAs- Supports gigabit serial fabrics including PCI Express, Serial RapidIO and Xilinx Aurora- Two 500 MHz 12-bit A/Ds- One digital upconverter- Two 800 MHz 16-bit D/As- Up to 2 GB of DDR3 SDRAM or 32 MB of QDRII+ SRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multiboard synchronization- Optional LVDS connections to the Virtex-6 FPGA for custom I/O- 3U VPX form factors provides a compact, rugged platform- Compatible with several VITA standards including: VITA-46, VITA-48 AND VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Product
Supply Chain Management
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200 Customers100 Active SuppliersPurchasing for 60 material classifications including such materials as:a) IC, Resisters, Capacitors, Wire, Cable, Power Suppliesb) Connectors, Converters, Diodes, Fuses, Fabricated partsc) Inductors, Relays, Switches, Hardware
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Product
Substrate Manufacturing
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KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.
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Product
Switch & Router Modules
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Curtiss-Wright Defense Solutions
Our highly engineered networking cards provide systems integrators with a fast and powerful way to interconnect chassis, cards, and CPUs through switched Gigabit, 10 Gigabit, and 40 Gigabit Ethernet. Operating at wire-speed, Ethernet switching and routing can be used to architect the infrastructure for unified (Ethernet only) or hybrid (Ethernet control and other switched data-plane fabric) networks for transferring IP-based control and data packets within advanced military systems.
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Product
2-Ch 500 MHz A/D with DDC & 2-Ch 800 MHz D/A with DUC, Kintex UltraScale - XMC
Model 71851
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete radar and software radio interface solution- Supports Xilinx Kintex Ultrascale FPGAs- Supports VITA-49.2 VITA Radio Transport standard- Two 500 MHz 12-bit A/Ds- Two multiband DDCs (digital downconverters)- One DUC (digital upconverter)- Two 800 MHz 16-bit D/As- 5 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS and gigabit serial connections to the Kintex - Ultrascale FPGA for custom I/O- Optional 400 MHz 14-bit A/Ds- Ruggedized and conduction-cooled versions available- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Product
cPSB 2.16 Compact Packet Switch 16 Slot, 14 node, 2F
107PS22616-4157R
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CompactPCI CPSB 2.16 6U 16 slot,14 node, 2 fabric, fully compliant to the PICMG 2.16 Packet Switching Backplane specification.
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Product
4-Channel 200 MHz, 16-bit A/D with Virtex-6 FPGA - 3U VPX
Model 52660
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- Complete radar and software radio interface solution- Supports Xilinx Virtex-6 LXT and SXT FPGAs- Supports gigabit serial fabrics including PCI Express, Serial RapidIO and Xilinx Aurora- Four 200 MHz 16-bit A/Ds- Up to 2 GB of DDR3 SDRAM or 32 MB of QDRII+ SRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multiboard synchronization- Optional LVDS connections to the Virtex-6 FPGA for custom I/O- 3U VPX form factors provides a compact, rugged platform- Compatible with several VITA standards including: VITA-46, VITA-48 AND VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available
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Product
Phase Array Ultrasonic Testing
PAUT
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Sensor Networks, Inc. (SNI) is a Pennsylvania-based technology company specializing in the design and fabrication of industrial ultrasonic transducers and tooling for demanding in-situ test and inspection applications. Engineered for precision, ease of use, and maximum durability, our offerings include Phased Array ultrasonic transducers, fixtures, couplant-delivery systems, qualification/calibration standards, procedure development, personnel training and instrumentation.
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Product
TDR Structural Health Monitoring
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Material Sensing & Instrumentation
MSI Time-Domain-Reflectometry (TDR) Structural-Health Monitoring probes the structural health of a composite part by propagating a fast electrical pulse along a distributed linear sensor which has been fabricated directly in the laminate. The sensor is formed from the native graphite fibers already used in composite manufacture, and constitutes zero defect. Fibers are patterned into a microwave waveguide geometry, or transmission line, and interrogated by a rapid pulse as shown below. Structural faults along the line cause distortions in waveguide geometry, producing reflected pulses similar to radar. Cracking, delamination, disbonds, moisture penetration, marcelling, and strain are all detected by propagation delay, for sensor lengths up to several meters.
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Product
Rainproof Tester
TF161
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TESTEX Testing Equipment Systems Ltd.
Rainproof Tester, to determine the penetration resistance of fabrics or composites at different intensities of water impact. Simulated rain horizontally impacts fabric samples mounted vertically in a stainless steel bath. Samples are backed with a standardized blotting paper, which is weighed before and after each test. The rain is formed by a column of water, which can be adjusted from 600mm to 2400mm.
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Product
Services
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We provide the following systemintegration services: Project design and management, Submittal preparation, AutoCad drawings, Panel design, Panel fabrication, HMI Design, System start-up or commissioning, Maintenance, Troubleshooting
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Product
Design and Fabrication Laboratory
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Trialon’s on-site Fabrication Shop is equipped with the tools and experienced staff to design and fabricate custom parts, test fixtures or small batch finished product. Our team is ready to provide your organization with a best-in-class experience that will meet tight timeline.
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Product
Intel® Xeon® E3 Quad-Core 10 Gigabit Ethernet AdvancedTCA® Processor Blade
aTCA-9300
Processor Blade
The ADLINK aTCA-9300 is a high performance AdvancedTCAR (ATCA) processor blade featuring dual 4-core IntelR XeonR processor E3 1275V2 /1225V2, IntelR C216 Chipset, four channel memory up to 32 GB of DDR3 memory and 300 W power supply subsystem. Versatile connectivity includes dual 10GbE Fabric Interfaces, dual GbE Base Interfaces, quad front panel GbE egress ports, front panel dual COM and USB 2.0 ports and front panel VGA connector. An onboard SATA connector supports CFast up to 32 GB and the optional RTM (aTCA-R6270/R6280) supports an 8-channel mini-SAS port, dual 10GbE SFP+ ports, dual USB ports and dual hot-swappable SATA bays providing additional network throughput and storage capacities.
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Product
1 kW and 2 kW Laser-Based Floating Zone Furnace
Laser Furnace
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The 1 kW and 2 kW laser furnace for single crystal fabrication is based on a design and developed in close cooperation with the RIKEN Center for Emergent Matter Science under the leadership of Yoshio Kaneko. Both melting zones have 5 lasers each, which guarantees a high uniformity of power density in the melting zone range. The laser profile has been optimized to reduce thermal stress during the crystal growth process. In addition, the system includes an integrated temperature sensor for real-time temperature monitoring. Temperatures up to 3000 °C can be reached and therefore materials with a very high vapor pressure, a narrow temperature range of the melt, a high thermal conductivity coefficient and incongruent melts can be melted.
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Product
2-Channel 200 MHz A/D with 766 DDCs, Kintex UltraScale FPGA - XMC
Model 71865
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete software radio receiver solution for extremely high-channel-count applications- Uses Xilinx Kintex UltraScale KU035 FPGAs- Two 200 MHz 16-bit A/Ds- Four wideband DDCs (digital downconverters)- Up to 762 narrowband DDCs- Sample clock generation and synchronization to an external system reference- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Ruggedized and conduction-cooled versions available- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Product
3U OpenVPX VITA 66-67 Backplanes
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VPX is a broadly defined technology utilizing the latest in a variety of switch fabric technologies in 3U and 6U format blades. Open VPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments.
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Product
Process EDXRF Spectrometer
NEX LS
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Applied Rigaku Technologies, Inc
Featuring advanced third generation EDXRF technology, the Rigaku NEX LS represents the next evolution of scanning multi-element process coatings analyzers for web or coil applications. To deliver superior analytical performance and reliability, the EDXRF measuring head assembly was derived from the established Rigaku NEX Series high-resolution benchtop instrumentation. With this proven technology, the Rigaku NEX LS delivers rapid, non-destructive, multi-element analyses — for coat weight, coating thickness and/or composition — for elements from aluminum (Al) through uranium (U). The measuring head is mounted on a rigid beam and is equipped with a linear traversing mechanism positioned over a roller so that the head-to-surface distance is constant. Common applications include silicone release coaters, converters, denesting Si for vacuum-formed plastics, RoHS compliance, conversion coatings, metalized plastic, top coatings on metal coil and fire retardants on fabric.





























