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Product
Wireless Functional Test Fixtures
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Circuit Check’s wireless fixture technologies reduce debug time, simplify ECO’s and reduce maintenance. This allows for the highest test performance, ability to probe denser smaller targets and achieve ultra-high node counts. Higher density more complex circuit boards complicate testing requirements. Smaller more tightly spaced test pads create a wiring challenge for the fixture fabricators, test engineers and maintenance personnel. Wireless fixtures solve the challenges associated with the nest of wires found in long wire fixtures. Wireless fixtures replace the “nest” of wires with copper traces on a multilayered printed circuit board called a Translator Board (T-Board).
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Product
IDA Electrodes
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Interdigitated Array (IDA) electrode is an electrode developed for electrochemical measurements to be performed in a very small quantity of the sample. IDA electrode could be applied for the detection and reaction analysis of the compounds in a small quantity of the sample. IDA electrode is a microelectrode pattern fabricated by using the lithography technology. The Electrodes are composed of 65 pairs. In each one of the pair has a function of the oxidation and reduction electrodes.
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Product
Single Board Computers
SBC
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Our single board computers (SBCs) include versatile mezzanine sites for custom I/O processing and off-board processing. Each processing node is equipped with the best compute power from their respective device generation and are fully interoperable with similar form-factor, OSA and fabric building blocks for low-risk processing subsystem pre-integration.
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Product
Metrology Solutions for Semiconductors
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Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition. In applications ranging from C-S thin films materials characterization to wafer substrate analysis and defect detection, Bruker’s systems provide simulation analysis and fit. HRXRD, XRR, WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically designed solution for your metrology needs.
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Product
BIM Structural Modeling Services
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Structural Modeling represents the digital replica of structural components of a building i.e., beams, columns, torsion, and foundations, using Autodesk Revit software. Tejjy-BIM Inc. provides Revit Structural BIM design-drafting-modeling services for concrete & steel structure building design. Integration of BIM modeling in structural engineering facilitates better analysis of design detailing and simulates the behavior to coordinate and collaborate with the architectural & MEP (mechanical, electrical, and plumbing) system. BIM services in structural engineering facilitates structural analysis, and optimization of building design, as well as generate fabrication and construction documents.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Product
Network Switches
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Our switch fabric modules provide full service switching through hardware accelerating ASICs from leading device makers including Mellanox or may be software defined for upgradability. These high bandwidth switches include system management capabilities including full compliance with VITA 46.11.
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Product
Shrinkage Template Scale
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TESTEX Testing Equipment Systems Ltd.
Shrinkage Template Scale, suitable for all shrink testing standards. Shrinkage Template Scale complies with AATCC 135/150/160/179, BS EN 3759, ISO 3759, etc. Welcome to contact us if you have any problems about fabric shrinkage test method.
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Product
PULSE IMPATT DIODES FROM 30 TO 140 GHz
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Insight Product Company offers IMPATT diodes with pulse power up to 20 Watt and operational frequency range up to 140 GHz. Silicon p+-p-n-n+ IMPATT diodes are designed to be used in the millimeter wave oscillators and amplifiers. They are fabricated in the metal-ruby packages with hard-lead carrier (diameter 3.0 mm, 1.5 mm).
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Product
Compact Range Reflectors
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The company advances every aspect of reflector system development—from design and fabrication to surface characterization, transportation, installation, and electromagnetic evaluation.
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Product
Wafer Chucks
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ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Product
104-lane, 52-port, PCI Express
PEX89104
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The new PCIe Gen 5.0 (32 GT/s) PEX89000 series builds on the longevity of the Broadcom series of switches, now spanning 13 families. The PEX89000 family allows customers to build systems from simple PCIe connectivity inside the box to high-performance, low-latency, scalable, cost-effective PCIe fabrics for composable hyper-scale compute systems supporting ML/AI and Server/Storage applications.
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Product
Silver Plated Test Points
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The fabricators of SMT printed circuit boards may take advantage of the convenience of field testing with the unique loop design of Components Corporation's TP-107 and TP-108 series of surface mounted, printed circuit test points is now available in silver-plate for outstanding reliability. All products are RoHS and REACH compliant.
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Product
8-Channel 250 MHz A/D with Multiband DDC, Kintex UltraScale FPGA - XMC
Model 71132
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete radar and software radio interface solution- Supports Powerful Xilinx Kintex UltraScale FPGAs- Eight 250 MHz 16-bit A/Ds- Eight wideband DDCs (digital downconverters)- 64 multiband DDCs- 5 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction cooled versions available
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Product
Dual Intel® Xeon® E5-2600 v3 Family 40G Ethernet AdvancedTCA® Processor Blade
aTCA-9710
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- Two Intel® Xeon® processor E5-2600 v3 family (12C/24T)- 16 memory sockets support DDR4-2133 REG/ECC VLP RDIMM up to 256 GB- Intel® C612 PCH- Dual Intel® XL710-AM2 40GBASE-KR4 Fabric Interface channels- Support Intel® DPDK and Node Manager 3.0
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Product
LVDS Digital I/O with Kintex UltraScale FPGA - XMC
Model 71810
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Supports Xilinx Kintex Ultrascale FPGAs- Front panel digital I/O can be used as a status and control or data interface- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction-cooled versions available
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Product
Stiffness Tester Pneumatic
TF114
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TESTEX Testing Equipment Systems Ltd.
Fabric Stiffness Tester Pneumatic, used for testing the stiffness of fabric by the bending cycle test method of ASTM.
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Product
Gurley Legality Tester
DRK461A
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Shandong Drick Instruments Co., Ltd.
It can be applied to quality control and research and development of papermaking, textile, non-woven fabric, plastic film, etc
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Product
Systems Integration for Circuit Card Assembly
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Teledyne Advanced Electronic Solutions integrates CCAs and other sub-assemblies, cables and fabricated parts into system modules shipped directly to customers for integration into their products.- Box Build: custom built to order system solutions- High complexity box assemblies and subsystems- High frequency RF box assemblies and subsystems- Full functional RF testing up to 26 GHz (K band)- Multi-level systems integration – build and test modules and CCAs and integrate into higher level assemblies- Custom cell design for customer subsystems- Special bonding processes including thermal management and vibration- Robust torque and FOD control programs- System level testing including functional, vibration and thermal- Complex harness fabrication and integration- Fiber-Optic and RF waveguide integration and testing- Large system capacity in excess of 200 lbs.- Configure to order – Integrate different options, firmware, configurations, etc across a single order as required
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Product
Motorized Force Test System
MT Series
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In the past, film extruders, paper producers, converters, and woven/non-woven fabric producers have had the choice of test stands and universal test machines which are either value-priced peak-force-only machines, or expensive computer-operated integral-load cell machines. Now you can have the best of both worlds in a single instrument. The series MT-1500, a simple to use computer operated tester, with Quality Control software for automatic calculation and graphical display of break, elongation, yield, modulus, and other, tension and compression force information.
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Product
10 Micron Wire Grid Polarizer
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Fabricated from 10 micron diameter tungsten wire, and with a choice of wire spacing starting from 25 microns, these wire grid polarizers are suitable for use from approximately 100 microns (or 3 THz) to longer wavelengths. Please refer to the table below for the standard availability of wire spacing and frame clear aperture / outer diameter.
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Product
Paper Softness Tester ZRD-T1
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The ZRD-T1 Paper Softness Tester is a device designed to objectively measure the softness of paper products, such as tissues, toilet paper, or specialty papers. Softness is a complex tactile property influenced by factors like surface smoothness, flexibility, and bulk compressibility. It is widely used in industries such as tissue manufacturing, hygiene product development, textiles, and packaging to ensure compliance with quality standards and end-user comfort requirements. This test instrument conforms to many national and international standards: ASTM D2923: Standard Test Method for Rigidity of Paper – Measures bending resistance to determine stiffness. ASTM D6828: Standard Test Method for Stiffness of Nonwoven Fabrics – Evaluates drape and flexibility in materials like medical textiles or wipes. TAPPI T498: Bending Resistance of Paper (Gurley Method) – Quantifies resistance to bending forces, inversely related to softness. GB/T 8942: Chinese Standard for Softness Testing of Household Paper – Aligns with consumer expectations for tissue and toilet paper tactile quality. ISO 12625-9: Softness Evaluation of Tissue Products (optional add-on).
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Product
Bundesmann Water Repellency Tester
M230
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The Bundesmann provides a water repellency test for fabrics that are being contacted during use such as a rain jacket. Samples are mounted over a cup and are rubbed from underneath during the test.
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Product
Textile Testing Instruments
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Dongguan Amade Instruments Technology Co., Ltd
Textile testing instruments are developed to determine the quality and performance of various fibrillar component fabrics, structural fabrics, garments, home textiles and other textiles by physical and chemical methods in conformance with international standards. By using scientific testing methods to judge the quality of materials or final products, manufacturers of textiles are capable of detecting the defects and unqualified products to correct problems in time, conducive to reducing loss and maintaining the business reputation. Testings cover tensile strength, tearing strength, seam slippage, joint strength, bursting strength, resistance to wear, pilling resistance, color fastness to washing, rubbing fastness, light fastness, color fastness to perspiration, dimension stability, inflaming retarding test etc.
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Product
Friction & Peel Strength Tester
FPT-F1
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FPT-F1 Friction Peel Tester can be used to test coefficient of static and dynamic friction of plastic films, sheets, foils, paper, cardboard, woven bags, fabric (fabric style test), metal-plastic composite belt for communication cable, convey belt and textile, as well as peel strength of adhesive laminated products, medical adhesive bandage, release paper and protective films.
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Product
PCIe Gen 3 ATCA Carrier Low-Power Xeon E3
ATC122
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The ATC122 is a Carrier Module with an on board x16 PCIe Gen3 slot to accept any standard PCIe edge type module. The module has dual 10GbE connected to the Fabric channels and dual GbE to the base channels. It comes with 32 GB of ECC memory. It also has an option for Trusted Platform Management (TPM).
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Product
Halt Hass Chambers
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HALT and HASS chambers from WEIBER provide extreme temperature & vibration capabilities used during the product design and manufacturing cycles to compress the time normally required to identify design and process weaknesses. HALT techniques are important in uncovering many of the weak links inherent to the design and fabrication process of a new product. HASS techniques are incorporated during the production phase to find manufacturing process defects that could cause product failures in the field.
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Product
Thickness Gauges for Plastic films & Paper
CHY-CA
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CHY-CA is a highly precise thickness gauge with mechanical contact method, which can be used to measure the thickness of films, sheeting, paper, corrugated paperboard, textiles, non-woven fabrics, and solid insulation materials, etc.
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Product
Semiconductor
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Engineered ceramics are used in the semiconductor industry because of their excellent material properties. Ultra-pure ceramics are often used in the whole cycle of semiconductor manufacturing including Semiconductor Wafer & Wafer Processing, Semiconductor Fabrication (Front End), and Semiconductor Packaging (Back End).
