Flash Memory
retains data absent of power. Also known as: Flash Device
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Product
In System Programmers
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In-circuit serial programming, also known as in-system programming (ISP) or in-circuit programming (ICP) enables programming and reprogramming of microcontrollers, serial EEPROMs and flash memories already soldered on a target PCB.
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Product
High Performance Power Analyzer
AFM-8A
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AFM-8A has Developed for AFC*(Auto Frequency Control) high performance measurement and frequency update, its update up quickeer than 100mSec. multifunction power analyzer provides high-accuracy measurement and is designed for single phase and three phase application. It includes 4 Digital inputs, 4 Relay outputs, and a RS-485 Modbus RTU Communication port. The user can choose one more communication port, and 2 Analog outputs for output expansion.It provides measure voltage and current of the 2~63 harmonic, and it shows CO2 emissions, which is suitable for power monitoring, management and analyze power quality. It has TOU (time-of-use) function and 4MB Flash memory capacity, allowing users to record data for a long time. It also has a software line adjustment function to reduce the on-site line adjustment work.It has the functions of waveform capture and recording, power record, and event record, which can be used for multifunction power analyzer.
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Product
Flash Memory In-System Programming File Generation
ScanExpress Flash Generator
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ScanExpress Flash Generator is a tool to quickly create Flash programming files for use with ScanExpress™ software. The application operates as a standalone utility or integrates into ScanExpress TPG for creation and reuse of boundary-scan test files for in-system programming (ISP).ScanExpress Flash Generator combines a board Netlist, scan chain description, and BSDL files to automatically create Flash Programming Information (FPI) files. These files include all information necessary for ScanExpress Runner™ or ScanExpress Programmer™ execution systems to perform read, write, erase, and verify operations—in-system using high performance Corelis hardware.
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Product
8-Sites Flash Programmer w/Relay Barrier, True Parallel Channels
YAV90FR2
Universal Flash Programmer
The YAV90FR2 or YAM90FR2 is a flash programmer housed in a compact 6TL YAV Module form factor, designed forseamless integration into automated test environments. It incorporates the advanced FlashRunner 2.0 technology fromSMH, enabling efficient programming of microcontrollers, flash memory, and other logic or memory devices. Themodule features flexible connectivity options, with all digital I/O (DIO), programmable voltage lines, and correspondingground lines switchable via integrated relays.
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Product
Intelligent CPCI Quad Industry Pack Carrier
CPCI-6713-4 IP
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The board consists of private SDRAM and Flash memory attached to the 300 MHz TMS320C6713B DSP. An FPGA provides the timing and control. Peripherals include a serial port and connectors for IP mezzanine boards. Flash memory is availablefor downloading programs into a non-volatile memory. A PCIbus connector provides the interface to the host computer. A serial port is available for debugging.
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Product
RX Family Of 32-bit High Power Efficiency MCUs
RX200
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The RX200 Series offers the best mix of low power consumption and improved performance in the RX Family. It delivers max. of 80MHz CPU operation with 32KB to 1MB of embedded flash memory. RX200 Series offers a wide set of peripherals, including USB, CAN, ADC, advanced security, and IEC60730 appliance safety standard support. The RX200 Series is suitable for industrial equipment, home appliances, office equipment, healthcare products, meters, and so on. Some of the RX200 Series products are tuned for motor control solutions, too.
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Product
Memory Test System
T5833/T5833ES
Test System
T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wide array of memory devices is an obstacle for chipmakers, which urgently require solutions that can deliver high functionality, high performance and low cost of test (COT). Advantest's new, multifunctional T5833 memory test system meets these needs, delivering both wafer sort and final test capabilities for a full range of memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-generation non-volatile memory ICs.
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Product
Flash SATA DOM
FSD Series
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Axiomteks FSD (Flash SATA DOM) series is designed into Serial ATA II protocol type with compatible Serial ATA standard interface based on flash memory technology. This flash module is offered with various capacities ranging from 128 MB up to 32 GB and can operate under industrial temperature range goes from -40°C ~ 85°C in the harsh operating environments. The features of reliability, high performance, cost-effective and easy-tointegrate designs make FSD series a perfect solution over traditional storage devices.
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Product
16GB SO-DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-SD4U16GN32-SE
Memory Module
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
16GB SO-DDR5-5600 2GX8 1.1V SAM
AQD-SD5V16GN56-SB
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
4G DDR4 2400 288Pin 512MBX8 1.2V Registered Samsung Chip
AQD-D4U4GR24-SG
Memory Module
DDR4-2400 Registered DIMM. – standard height, 30μ" gold plating thickness (IPC-2221 Standard) 1.2V power consumption. Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves data integrity.
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Product
4G DDR4-3200 512X16 1.2V SAM -20~85℃
AQD-SD4U4GN32-SP2
Memory Module
SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
16G SO-DDR5-5600 2GX8 1.1V SAM -20~85℃
AQD-SD5V16GN56-SBH
Memory Module
SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
8GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U8GE32-SE
Memory Module
8GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
16GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U16GE32-SE
Memory Module
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
32GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V32GN56-SB
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
Wide Temperature Server DIMM
SQR-RD4M
Dual In-Line Memory Module (DIMM)
Original Hynix IC chip adopted, Wide operating temperature support -25~85oC, Data transfer rate up to 3200 MT/s.
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Product
8GB DDR4 SODIMM-3200 1GbX8 SAM
AQD-SD4U8GN32-SE
Memory Module
DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
SODIMM DDR4 3200MT/s
SQR-SD4S
Dual In-Line Memory Module (DIMM)
Original Hynix IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C Lifetime warranty.
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Product
8GB SO-DDR5-5600 1GX16 1.1V SAM
AQD-SD5V8GN56-SC
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
16GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V16GN56-SB
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
DCU Gateway Solutions
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Signals & Systems India Private Limited
SANDS DCU is an ideal gateway solution for the Energy Management System (EnMS). It provides connectivity to the cloud apart from data collection, local data storage. DCU is based on ARM Cortex-A5 processor having 512MB of DDR2 memory and expandable NAND Flash memory upto 2GB. Edge / Sensor data can be stored locally using the on-board SD card option. The cloud interface is LTE with 2G/3G fall back.
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Product
6U I7 PXI Controller
GX7927 Series
Controller
The GX7927 is a Single Board Computer (SBC) that features the high performance, highly integrated Core i7 processor platform from Intel. Core i7 offers an integrated graphics and memory controller plus dual core processing, operating at speeds up to 2.53 GHz. Coupled with the Mobile Intel QM57 Express Chipset, the GX7927 provides an unmatched level of I/O bandwidth for both onboard and off-board functions. The module is supplied with 4 GB of DDR3 SDRAM and 16 GB of NAND Flash memory. Both standard and extended temperture operation range versions are available.
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Product
8GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U8GN32-SE
Memory Module
8GB, DDR 4 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
32GB R-DDR5 5600 R-Dimm 2GX8 1.1V SAM
AQD-D5V32GR56-SB
Memory Module
SAM Original Chip, Industrial Design for Improved Reliability, Compatible with server platform, 30u” golden finger, Operating Temperature: 0°C ~ 85°C.
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Product
16GB ECC SO-DDR5-5600 2GX8 1.1V SAM
AQD-SD5V16GE56-SB
Memory Module
SAM Original Chip, Anti-sulfuration, PCB: 30μ gold finger. Independent Power Management IC build-in, ECC function support.
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Product
8GB SO-DIMM DDR5-5600 262Pin 1GX16 1.1V Unbuffered Hynix Chip
AQD-SD5V8GN56-HC
Memory Module
Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
16GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U16GN32-SE
Memory Module
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
16G R-DDR4-3200 1GX8 1.2V Samsung Chip -40~85C
AQD-D4U16R32-SEW
Memory Module
Registered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
