Flash Memory
retains data absent of power. Also known as: Flash Device
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Product
6U I7 PXI Controller
GX7927 Series
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The GX7927 is a Single Board Computer (SBC) that features the high performance, highly integrated Core i7 processor platform from Intel. Core i7 offers an integrated graphics and memory controller plus dual core processing, operating at speeds up to 2.53 GHz. Coupled with the Mobile Intel QM57 Express Chipset, the GX7927 provides an unmatched level of I/O bandwidth for both onboard and off-board functions. The module is supplied with 4 GB of DDR3 SDRAM and 16 GB of NAND Flash memory. Both standard and extended temperture operation range versions are available.
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Product
Solid State Recorder
MS 2001
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This system is used to acquire Bi phase and DM signals from aircraft and records into FLASH memory. System has automatic frame synchronization and it is achieved through in built hardware circuit.
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Product
16GB DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-D4U16GE32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
8GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U8GN32-SE
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8GB, DDR 4 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
32GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V32GN56-SB
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SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
32GB DDR4-3200 2GbX8 1.2V Samsung Chip
AQD-D4U32GN32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
16GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U16GE32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
16GB SO-DDR5-5600 2GX8 1.1V SAM
AQD-SD5V16GN56-SB
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SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
16G R-DDR4-3200 1GX8 1.2V Samsung Chip -40~85C
AQD-D4U16R32-SEW
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Registered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
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Product
16GB ECC DDR5-5600 2GX8 1.1V SAM
AQD-D5V16GE56-SB
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SAM Original Chip, Anti-sulfuration, PCB: 30μ gold finger. Independent Power Management IC build-in, ECC function support.
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Product
16GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U16GN32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
32G SO-DDR5-5600 2GX8 1.1V SAM -20~85℃
AQD-SD5V32GN56-SBH
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
3U CompactPCI® Single Board
CP32103
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LinkedHope Intelligent Technologies Co.,Ltd.
CP32103 is a 3U CompactPCI® single board, low power, small size, high integration, high reliability embedded computer module compliant with PICMG® CompactPCI® specifications.CP32103 offers a variety of processor options enabling customers to choose such as D2550、N2600 and N2800. The onboard memory, flash and SATA make sure CP32103 with good anti-shock and vibration performance.The design and production of CP32103 are controlled by full life-cycle management, so CP32103 can be long time available, as ensures maximum support for the maintenance of long life programs.
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Product
RA Family Of Arm-based MCUs
RA2
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The RA2 Series is the RA Family's entry-level 32-bit MCU, offering excellent cost performance and ultra-low power consumption. It delivers up to 48MHz of CPU performance using an Arm® Cortex®-M23 core with up to 256kB of embedded flash memory and a wide single voltage supply range from 1.6V to 5.5V. With cutting-edge peripherals like capacitive touch, the RA2 Series is ideal for system control or user interface applications such as in healthcare devices, home appliances, office equipment, and measuring equipment.
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Product
Flash ISP Feature, GTE 10.00p
K8219A
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The Flash ISP feature enables in-system programming that is usually executed through a flash player application that drives the MCU to execute the programming onto the flash device.
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Product
8GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U8GE32-SE
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8GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
8GB SO-DIMM DDR5-5600 262Pin 1GX16 1.1V Unbuffered Hynix Chip
AQD-SD5V8GN56-HC
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
4G DDR4 2400 288Pin 512MBX8 1.2V Registered Samsung Chip
AQD-D4U4GR24-SG
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DDR4-2400 Registered DIMM. – standard height, 30μ" gold plating thickness (IPC-2221 Standard) 1.2V power consumption. Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves data integrity.
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Product
16GB ECC SO-DDR5-5600 2GX8 1.1V SAM
AQD-SD5V16GE56-SB
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SAM Original Chip, Anti-sulfuration, PCB: 30μ gold finger. Independent Power Management IC build-in, ECC function support.
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Product
Rugged SODIMM DDR4 2666/3200 Wide Temperature
SQR-YD4I
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Robust PCB designed with Mounting Hole with Military MIL-810G verified. Extreme Data Transfer rate up to 3200 MT/s, Capacity: up to 32GB. Wide Temperature supported: -40°C ~ 85 °C, Original IC chip (Samsung/Hynix).
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Product
Wide Temperature Server DIMM
SQR-RD4M
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Original Hynix IC chip adopted, Wide operating temperature support -25~85oC, Data transfer rate up to 3200 MT/s.
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Product
PCIe/104 OneBank FPGA I/O Board
EMC²-7A200
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Sundance Multiprocessor Technology Ltd.
The EMC2-7A200 can use commercial, industrial or automotive graded Artix-7 FPGAs and is complimented with 1Gbyte of DDR3 local storage, 32Mbytes of Flash memory for storage/configurations and has 68x free differential I/O pins which are routed to a VITA57.1 FMC-LPC high-speed connector for bespoke interfaces.
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Product
16GB SO-DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-SD4U16GN32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
16G SO-DDR5-5600 2GX8 1.1V SAM -20~85℃
AQD-SD5V16GN56-SBH
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
16GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V16GN56-SB
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SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
8GB SO-DDR5-5600 1GX16 1.1V SAM
AQD-SD5V8GN56-SC
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SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
32GB R-DDR5 5600 R-Dimm 2GX8 1.1V SAM
AQD-D5V32GR56-SB
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SAM Original Chip, Industrial Design for Improved Reliability, Compatible with server platform, 30u” golden finger, Operating Temperature: 0°C ~ 85°C.
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Product
Plug & Play JTAG/SWD Microcontroller Debugger with Built In GDB Server & UART
Black Magic Probe V2.3
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In most cases Black Magic Debug takes the form of a firmware for the Black Magic Probe hardware, and implements a GNU DeBugger (GDB) server.The Black Magic GDB server features: - Automatic target detection- No need for target specific configuration scripts- All protocol and target specific control is done through GDB monitor commands- No “software in the middle” like OpenOCD required- Easily scriptable thanks to the GDB scripting capabilities- Interface to the host computer is a standard USB CDC ACM device (virtual serial port), which does not require special drivers on Linux or OS X.- Targets ARM Cortex-M and Cortex-A based microcontrollers- Provides full debugging functionality, including: watchpoints, flash memory breakpoints, memory and register examination, flash memory programming, etc.- [Semihosting / Host IO support] as well as [Serial Wire Debug TRACESWO support].- Implements USB DFU class for easy firmware upgrade as updates become available.- Works with Windows, Linux and Mac environments.
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Product
Flash Point
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At which temperatures will your sample burn, ignite, or cause fire? How are your flammable liquids composed, and what are their properties? Volatility is directly related to a substance‘s flash point temperature (flammability). Anton Paar’s flash point testing equipment safely and easily determines the values you require for the processing, storage, transportation, and classification of dangerous liquids.
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Product
Micron 8G DDR4 3200 288PIN 1GbX8 REG 1.2V
96D4-8G3200ER-MI
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DDR4-3200 Registered ECC DIMM, 1.2V power consumption, Supports ECC error detection and correction. Data bus inversion (DBI) for data bus, Low-power auto self refresh (LPASR).
