SEM
surface imaging from 1 to 5 nm in size.
See Also: Scanning Electron Microscopy, Scanning Electron Microscopes, EBSD
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Product
Scanning Electron Microscope (SEM)
Prisma E
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Prisma E scanning electron microscope (SEM) combines a wide array of imaging and analytical modalities with new advanced automation to offer the most complete solution of any instrument in its class. It is ideal for industrial R&D, quality control, and failure analysis applications that require high resolution, sample flexibility and an easy-to-use operator interface. Prisma E succeeds the highly successful Quanta SEM.
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Atomic Force Microscope for SEM/FIB
AFSEM® AFM Insert
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AFSEM is an atomic force microscope (AFM), designed for integration in a SEM or Dualbeam (SEM/FIB) microscope. Its open access design allows you to simultaneously operate SEM and AFM inside the SEM vacuum chamber. The correlated image data of AFM and SEM enable unique characterization of your sample, and the combination of complementary techniques is a key success factor for gaining new insights into the micro and nano worlds. AFSEM enables you to easily combine two of the most powerful analysis techniques to greatly extend your correlative microscopy and analysis possibilities.
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X-Ray Photoelectron Spectrometer
AXIS Supra
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AXIS SupraTM is an X-ray photoelectron spectrometer (XPS) with unrivalled automation and ease of use for materials surface characterisation. The patented AXIS technology ensures high electron collection efficiency in spectroscopy mode and low aberrations at high magnifications in parallel imaging mode. XPS spectroscopy and imaging results can be complemented by additional surface analysis techniques such as: ultraviolet photoemission spectroscopy (UPS); Schottky field emission scanning Auger microscopy (SAM) and secondary electron microscopy (SEM) and ion scattering spectroscopy (ISS). The AXIS Supra replaces the AXIS Ultra DLD as Kratos' flagship x-ray photoelectron spectrometer.
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Microscopy Software/Hardware
ZEISS Atlas 5
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Atlas 5 is your powerful hardware and software package that extends the capacity of your ZEISS scanning electron microscopes (SEM) and ZEISS focused ion beam SEMs (FIB-SEM). Use its efficient navigation and correlation of images from any source, e.g. light- and X-ray microscopes. Take full advantage of high throughput and automated large area imaging. Unique workflows help you to gain a deeper understanding of your sample.
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MultiBeam System
FIB
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An easy-to-use, out-lens type scanning electron microscope (SEM) equipped with a Schottky electron gun, as well as a new FIB column capable of large current processing (maximum ion current 90nA) installed into one chamber. JIB-4610F enables high-resolution SEM observation after high-speed cross-section milling with FIB, and high-speed analysis with a variety of analytical instruments, such as energy dispersive X-ray spectroscopy (EDS) that takes advantage of the Schottky electron gun delivering a large probe current (200nA), electron back scatter diffraction (EBSD) to perform crystallographic characterization, and cathodoluminescence (CLD). In addition, the 3D analysis function Cut & See is included in the standard configuration, allowing cross-section milling to be executed automatically at fixed intervals, while acquiring SEM images for each cross section.
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Electron Microscope Analyzer
QUANTAX WDS
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The QUANTAX WDS (WDX) for SEM consists of the XSense wavelength dispersive spectrometer yielding the best resolution among all parallel-beam WDS systems.
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Product
Energy Dispersive X-Ray Spectroscopy (EDS)
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Rocky Mountain Laboratories, Inc.
Energy Dispersive Spectroscopy (EDS Analysis) is used in conjunction with the Scanning Electron Microscope (SEM) providing chemical analysis in areas as small as 1 µm in diameter. EDS detects all elements except for H, He, Li, and Be. EDS can be performed exactly on any features or particles seen in the SEM images and can “MAP” elements on a surface. Unknown materials can be identified and quantitative analysis can be performed.
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Product
Electron Microscope Analyzer
QUANTAX EBSD
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QUANTAX EBSD system, with its popular OPTIMUS 2 detector head, is the best available solution for analyzing nanomaterials in the SEM
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Product
Metrology/SEM
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Our SEM products use scanning electron microscope technology to measure and review tiny surface structures such as photomask etching and circuitry on wafers with high precision and stability.
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Scanning Electron Microscopy
SEM
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Materials Evaluation and Engineering
JEOL JSM-6610 LV LaboratoryScanning electron microscopy (SEM) uses electrons for imaging to obtain higher magnifications and greater depth of field than light microscopes. The instruments at MEE are capable of variable-pressure, or low vacuum, SEM (VPSEM), as well as traditional high-vacuum conditions for sample observation. VPSEM is a specialized method using a variable-pressure sample chamber that allows direct evaluation of samples that are not readily examined with a traditional high-vacuum SEM. Nonconductive or vacuum sensitive samples that would typically require additional sample preparation can be directly analyzed in VPSEM without the need for additional sample preparation, such as carbon or metallic conductive coatings. This reduces both sample preparation time and distractions in microanalysis. Our laboratory also has a field emission SEM (FESEM) for critical high-magnification work and low-voltage (LVSEM) applications. Each instrument has a spacious sample chamber that can accommodate large and irregularly-shaped specimens and accessories for feature dimensional analysis and chemical microanalysis.
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Heavy Duty Dynamometers
MD-250-HD
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The MD-250-HD series dyno (SE/DE) was designed to be a performance dynamometer first with the added benefit of being able to test 2-wheel-drive heavy-duty vehicles such as truck, buses and commercial vehicles in addition to the standard car or light duty pick-up. The 250-HD is certified in the states of Colorado, Nevada and Utah for use in loaded-mode diesel smog testing programs because of its accuracy and reliability. No other dyno in its class offers more value or better in-house motor vehicle testing capabilities than the Mustang MD-250-HD. For starters, the MD-250-HD boasts a 1,500 horsepower measurement capacity at a top speed of 175 mph and a powerful air-cooled eddy current brake provides the MD-250-HD-SE with 900-hp worth ofloading capacity for steady state testing. Loading capacity can be increased to 1,500-hp via the optional DE model. The 250-HD can be upgraded to the 250-HD-SE-M via the addition of a 100 or 200 hp AC motor for transient testing of electric buses to measure range and regeneration or for emissions testing of IC engines. Do not be fooled by its compact size – the MD-250-HD is a serious dynamometer with serious tuning capabilities. The MD-250-HD uses a powerful eddy current power absorber, a frictionless, air-cooled braking device, to enable it to apply variable and steady state loading. A complete control and data acquisition system lets you design a wide range of tests or select from a host of pre-configured tests included with the standard system. The 250-HD’s four roller design makes setting up vehicles a snap – simply drive onto the 250-HD and let the tires settle in between the rollers. The 250-HD can be installed above-ground or below-ground, it’s your choice. The above-ground system utilizes an optional premium platform and ramp system with an above-ground restraint kit. The addition of an axle pull-down kit help keep the tires from slipping or trying to “climb out” of the rollers.
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Scanning Electron Microscopy (SEM Analysis)
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Rocky Mountain Laboratories, Inc.
Scanning Electron Microscopy (SEM Analysis) can produce images of almost any sample at magnifications of 15-300,000X. The SEM has tremendous depth of field allowing for imaging that cannot be accomplished using optical microscopy. Conductive and nonconductive samples can be imaged. When operated in the backscatter (BSE) detection mode, differences in material composition can be observed. Elemental analysis can be performed on any feature observed with an integrated Energy Dispersive Spectroscopy (EDS) detector.
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Product
WAFER MVM-SEM
E3300 Family
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The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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WAFER MVM-SEM® E3300 Series
E3310
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The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Magnetic Field Testing
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Response Dynamics Vibration Engineering, Inc.
As magnetic field consultants, we have been working with magnetic field issues for sensitive tools for many decades from cutting edge development of scanning electron microscopes (SEMs) to active cancellation systems for MRI tools, to site surveys for specification compliance, debugging, and tool Magnetic Field Sensitivity Testing.
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Scanning Electron Microscope
JSM-IT510
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Scanning electron microscopes (SEMs) are indispensable tools not only for research but also for quality assurance and manufacturing sites.At those scenes, the same observation processes need to be performed repeatedly and there has been a need to improve the efficiency of the process.
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Scanning Electron Microscopes
SEM
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Scanning Electron Microscopes (SEM) scan a sample with a focused electron beam and obtain images with information about the samples’ topography and composition.
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Plane Wave Converter
PWC200
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The R&S®PWC200 Plane Wave Converter is a bidirectional array of 156 wideband Vivaldi antennas placed in the radiating near field of the device under test (DUT). The phased antenna array can form planar waves inside a specified quiet zone within the radiating near field of the 5G massive MIMO base station for realtime radiated power and transceiver measurements (EVM, ACLR, SEM, etc.).
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Scanning Electron Microscope
Verios G4 XHR SEM
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The Thermo Scientific™ Verios G4 scanning electron microscope (SEM) provides sub-nanometer resolution from 1 to 30 kV and enhanced contrast needed for precise measurements on materials in advanced semiconductor manufacturing and materials science applications, without compromising the high throughput, analytical capabilities, sample flexibility and ease of traditional Scanning Electron Microscope (SEM).
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Saluki CSA-M Series Signal Analyzer (Benchtop)
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Saluki CSA-M series benchtop signal analyzer reaches the frequency from 100 kHz to up to 26.5 GHz with a maximum of 40 MHz analysis bandwidth. It can test signal power, frequency, phase, P-1, TOI, OBW, channel power, spurious, ACPR, CCDF, SEM, EVM, and other indicators.
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Electron Microscope Analyzer
QUANTAX EDS for TEM
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Long standing expertise in EDS ensures the configuration of the best solution for your specific microscope (STEM, TEM or SEM) thanks to slim-line detector design and geometrical optimization for each microscope pole piece and EDS flange type
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RF Analyzer
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Occupied Bandwidth (OBW)Adjacent Channel Power (ACP)Channel Power (CHP)Complementary Cumulative Density Function (CCDF) Intermodulation (IMD)Spectrum Emission Mask (SEM) IQ (Waveform)Phase Noise
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Wafer Cathodoluminescence Microscope
Säntis 300
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Attolight’s Quantitative CL-SEM offers “No Compromise” large field fast scanning simultaneous acquisition of SEM images, hyperspectral CL maps, and optical spectra. Smaller diameter wafers, or miscellaneously shaped substrates are manually loaded on intermediary 300mm susceptors subsequently handled automatically by the tool.
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CD-SEM
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Our CD-SEM tools measure the width, height, sidewall angle, etc. of wiring patterns on semiconductor photomasks and wafers.
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Magnetic Field Cancelling System
MR-3
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3-axis magnetic field cancelling system for electron microscopes (SEM and TEM), electron and ion beam experiments, nanotechnology, biomagnetic investigations, etc. High reliability through rugged analog design. No tedious programming, no chrashs. More than 1000 MR-3 systems sold worldwide.
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Scanning Electron Microscopes
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Our Scanning Electron Microscopes (SEMs) resolve features from the optical regime down to the sub-nanometer length scale.
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Ion Beam Milling Systems
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When material specimen surfaces are prepared for SEM or incident light microscopy, the specimen usually undergoes multiple processes until the layer or surface to be analyzed is machined with precision. Leica Microsystems’ workflow solutions for solid state technology cover all steps required for demanding high-quality sample preparation.
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EBSD tools
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EDAX EBSD tools provide leading performance and groundbreaking technology for analyzing crystallographic microstructure, using electron backscatter diffraction in the SEM.
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Energy Dispersive X-ray Spectroscopy
EDS
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Materials Evaluation and Engineering
EDS is an elemental chemical microanalysis technique performed in conjunction with each of the SEMs at MEE. Features or phases as small as about 1 micron can be analyzed.
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Product
Cross Sections and Metallography
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Rocky Mountain Laboratories, Inc.
Cross sections are prepared by mounting samples in epoxy and then grinding and polishing the mount for imaging in the optical microscope or Scanning Electron Microscopy (SEM). Valuable information from cross sectioning can include: film thicknesses, inclusions, corrosion thickness, dimensional verification, and subsurface defects. Metallographic cross sections are typically etched to reveal the microstructure. Microstructural analysis can provide information about heat treatment history, corrosion susceptibility, as well as undesirable microconstituents.
