3D SPI
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
See Also: 3D Solder Paste Inspection
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3D Geo-Magnetometer
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For the measurement of magnetic equilibria such as the earth's magnetic field, for the determination of anomalies and biologically active location factors. Three highly sensitive magnetic field sensors, as well as a dedicated microprocessor, are integrated into the measuring probe. The sensitive magnetic field sensor is connected to a PC, notebook or laptop (not included). The main features in brief:
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SPI Isolators
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SPI (Serial peripheral interface) is one of the most widely used interfaces between microcontrollers and peripheral ICs such as sensors, ADCs, DACs, shift registers, SRAM, and others. Analog Devices has your isolated SPI bus covered with our dedicated SPI digital isolators which support this synchronous, full duplex master-slave-based interface. Options include devices built with ADI's proven iCoupler® technology and offering a small footprint, simple design-in, fast speeds, and high data integrity, as well as integrated µModules which require no external components. Our SPI isolator solutions increase performance and reduce board space. This simple, compact solution is ideal for isolated SPI data requiring communication across different ground potentials or through large common mode transients often found in Industrial PLCs (programmable logic controllers) and Instrumentation and data acquisition systems.
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Ultra High Performance 3D CT System
UltraTom
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3D micro-tomography (CT Scan) and nano-tomography. Modular system with multiple imagers and x-ray generators. Experimentations possible in-situ. Large volume Inspection and manipulation volume.
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3D Verification Station
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Omron’s 3D verification systems provide high-quality imagery to ensure the best results in post-solder inspection.
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3D Sensors (Main Screen)
surfaceCONTROL
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surfaceCONTROL sensors are used for 3D measurements and surface inspections. The sensors use the fringe projection principle to detect diffuse reflecting surface and to generate a 3D point cloud. This point cloud is subsequently evaluated in order to recognize geometry, extremely small defects and discontinuities on the surface. Sensors with different measurement areas are available. This enables the inspection of the finest of structures on components as well as shape deviations on large-area attachments. Powerful software packages are available for evaluation and parameter setting.
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3D Solder Paste Inspection system
PI Series
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PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results.
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3D Scanning Software
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Software is a comprehensive component to any advanced metrology system. Combined with laptops and portable equipment, 3D scanning and measurement is now possible virtually anywhere. 3D scanner software plays a critical role in every stage from the creation of a concept design to the manufacturing and inspection of prototypes. Below is a look at some of the Laser Scanner Software and 3D Scanner Software providers and platforms we represent and handle.
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Floor-Standing 3D Optical Profilometers
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High-precision, non-contact metrology systems designed for rapid, automated, large-area surface characterization in industrial and R&D settings.
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3D Scan Systems
intelliWELD
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The intelliWELD is a 3D scanning unit for remote laser welding applications. While a robot leads the scan system along the processing line, the scan unit ensures the fast and precise positioning of the laser spot.The intelliWELD scan unit allows elimination of complex robot movements and fast repositioning, reducing the repositioning time between the welds to a few milliseconds.
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3D Ground Penetrating Radar data processing & Interpretation software
Condor
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Condor is modern processing, visualisation and interpretation software for the efficient management of Raptor 3D GPR array data.Boost performance and improve workflows.- Efficient sub-surface imaging- Effective workflows- Simple and intuitive- Dedicated to processing Raptor data- Modern Windows software (64-bit)
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Direct 3D RightMark
D3D RM
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D3DRightMark is an independent non-commercial open-source graphics card benchmarking project developed by iXBT.com. It's called to help users estimate graphics cards performance and quality in synthetic tests and real apps, e.g. games. Synthetic tests allow estimating performance and capabilities of separate graphics cards subsystems in order to forecast their behavior in either applications, both existing (that is overall estimation of suitability and prospects for an entire application range) and developing, provided that a given accelerator demonstrates peculiar behavior under such applications.
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3D Cameras
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*Visual assessment of distance, level or volume*Time-of-flight measurement principle*Illumination, measurement and evaluation in one unit*Output of distance and grey values*Integration by means of intuitive parameter setting software
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3D EarthWork Estimation Software
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ScienceGL offers virtual cut-and-fill excavation software for earthwork and material takeoff estimation. The software is based on latest 3D technology that lets you to accelerate your construction earthwork estimation. The most natural perception of the whole cut-and-fill process makes your job faster, easier and more accurate. Unlike of the standard software packages for estimation we provide you new realistic "virtual presence" interactive environment. Powerful estimating package for construction earthwork and material quantity calculations.
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DIgital 3D Image Correlation System
Q-400
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The Digital 3D Image Correlation System Q-400 is an optical measuring device for true full-field, non-contact, three-dimensional measurement of shape, displacements and strains on components and structures made from almost any material.The Q-400 system is used for determination of three-dimensional material properties in tensile, torsion, bending or combined tests. In addition, deformation and strain analysis can be applied to fatigue tests, fracture mechanics, FEA validation, and much more.
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Non-contact 3D Optical Profilers
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LuphoScan platforms are interferometric, scanning metrology systems. They are designed to perform ultra precision non-contact 3D form measurements mainly of rotationally symmetric surfaces such as aspheric lenses.
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Benchtop 3D Optical Profilometers
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Compact, non-contact metrology instruments used for high-precision, sub-nanometer to micrometer-level measurement of surface topography, roughness, and step heights.
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USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-02
Interface Module
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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Mek Selective 3D AOI
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Every one of our desktop AOI and inline AOI systems is optimised for the demands of today’s advanced SMT applications and critical manufacturing environments. All are capable of delivering Selective 3D, using our unique stereoscopic imaging from the 9 cameras of the GTAz /GDAz optical heads.
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TTL/I2C/SPI* Expansion Kit
OP-SB5GL
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OP-SB5GL is the interface expansion kit that has a port to measure RS-232C(V.24) and a port to measure the TTL / CMOS signal level communications. The port for TTL / CMOS supports the measurement of TTL / CMOS level communications that power supply system is from 1.8V to 5V. It is suitable for monitoring the communications between the LSI and the interface IC on the printed circuit board by directly probing into the lines. It supports the protocol of not only UART and HDLC but also I2C and SPI* on monitoring and simulating.
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USB/RS232/SPI Programmable Attenuator
RUDAT-13G-90
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Mini-Circuits’ RUDAT-13G-90 is a general purpose programmable RF attenuator supporting frequencies from 10 to 13000 MHz with attenuation from 0 to 90 dB in 0.5 dB steps. Its unique design maintains linear attenuation change per dB, even at the highest attenuation and frequency settings. The attenuator is controlled via USB, RS232 or SPI. It comes housed in a compact, shielded metal case with SMA(F) input/ output RF ports (RF ports are interchangeable), a USB type Mini-B socket, and a 9-pin D-sub(F) RS232 and SPI port. Power can be supplied via either USB or the D-sub port. The RUDAT-13G-90 is supplied with our easy-to-install, user-friendly GUI software, API objects for Windows® environments, and complete programming instructions for 32 and 64 bit Windows® and Linux® operating systems. See p. 9 for a complete list of included accessories.
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Areal Confocal 3D Measurement
µsurf
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The measuring system of the µsurf-product line enable automated 3D surface measurements of roughness, topography, layer thickness and volume. µsurf-measuring systems are available in different designs: from compact mobile systems and laboratory solutions up to multisensor setups on granite portal for use near production lines.
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3D Micro Coordinate Measurement Machine and Surface Roughness Measurement Device
InfiniteFocusSL
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With the InfiniteFocusSL you are able to measure form and roughness of your components with only one system. In addition, color images with high contrast and depth of focus are achieved. The robust frame and the intelligent illumination technology provide fast and high-resolution measurement in the laboratory and a production near environment. The measurement system is particularly attractive due to its cost effectiveness, measurement speed and usability. The long working distance in combination with the above average measurement field allows a wide range of applications. Measurements are achieved within seconds, and features, such as a coaxial laser for quick and easy focusing, enhance its usability.
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3D CMOS Image Sensors
Flash
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High-resolution in a rectangular format, specifically designed for 3D laser triangulation - Very high frame rate and throughput combined with high power efficiency, delivering outstanding sampling resolution and speed with a high Gbps/W ratio - HDR feature embedded on-chip, to measure all kinds of surfaces - Feature-rich sensors, to perfectly meet application challenges.
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3D Helmet Coil
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With the 3D Helmholtz coil system, 3-dimensional magnetic field vectors can be generated. By superimposition, it is possible to create a field-free space or an artificial earth magnetic field vector inside the coil arrangement. The coil arrangement was developed for the calibration of magnetic field sensors.
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Trusted Platform Module Compliant With TCG 1.2 / 2.0 Specification And TCG Software Stack 1.2 / 2.0 Via SPI Connector On CPU Card.
PCA-TPMSPI
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Trusted platform module compliant with TCG 2.0 specification and TCG software stack 2.0 via SPI connector on CPU cardHardware based data protection solution for storage device encryption and decryptionDimensions (L x H) : 20 x 22 mm (0.79" x 0.87")Support Model: PCE-5033/5133
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High-Speed Multi-IO SPI Host Adapter
BusPro-S™
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The BusPro-S High-Speed Multi-IO SPI Host is designed with speed, versatility, and value in mind. Featuring a 60 MHz clock rate with up to 200 Mb/s throughput and support for standard, dual, quad, and 3-wire modes, the BusPro-S is the right tool for all SPI debugging applications-present and beyond.
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Solid Optical 3D Measurement Instrument
IF-SensorR25
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The IF-Sensor25 is a solid optical 3D measurement instrument for automated form and roughness measurement in production. The sensor is integrated into a production line and delivers you high resolution, repeatable and traceable results when measuring surface characteristics in the m or sub-m range. This resolution can hardly be achieved by conventional 2D solutions or tactile techniques.
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3D Software
Geomagic Control X
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Combined with the powerful and highly precise Artec 3D scanners, Geomagic Control X is a fantastic solution for anyone looking for speed, accuracy and a large variety of tools to choose from. Easily get the data required for extensive quality control in no time at all with Artec’s advanced 3D scanning solutions. Acquire precise measurements and carry out inspection and data analysis on the spot, using Geomagic Control X and an Artec 3D handheld scanner. Compare 3D scans to the reference CAD model to minimise assembly flaws and increase productivity.
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Reverse Engineering 3D Scanner
peel 3.CAD
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peel 3.CAD is your go-to fully integrated 3D scanning solution for all your reverse engineering needs. Extract all the information you need and send them right to your preferred CAD software.
