3D SPI
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
See Also: 3D Solder Paste Inspection
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3D Verification Station
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Omron’s 3D verification systems provide high-quality imagery to ensure the best results in post-solder inspection.
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Product
TTL/I2C/SPI* Expansion Kit
OP-SB5GL
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OP-SB5GL is the interface expansion kit that has a port to measure RS-232C(V.24) and a port to measure the TTL / CMOS signal level communications. The port for TTL / CMOS supports the measurement of TTL / CMOS level communications that power supply system is from 1.8V to 5V. It is suitable for monitoring the communications between the LSI and the interface IC on the printed circuit board by directly probing into the lines. It supports the protocol of not only UART and HDLC but also I2C and SPI* on monitoring and simulating.
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3D Audio Servers
GoldSeries
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AuSIM offers a growing number of prepackaged configurations, designed to meet a broad spectrum of R&D and deployment needs. These standard packages are generically called GoldSeries, and have a range of options to tune them to the needs of a specific project. If none of these are appropriate to your application, AuSIM will gladly develop a custom package for your specialized needs.
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Desktop 3D Scanners
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Automated 3D Scanning for small to medium sized parts. Desktop scanners offer a more compact solution with great accuracy.
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3D Antennas
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A 3D capable printing technology designed to create printed electronics directly on 3D surfaces using modern software controlled digital process.
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3D Solder Paste Inspection (SPI)
TR7007 SII
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Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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Borehole 3D Geophones
GFA 50/100
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3D borehole geo-phone is realized with 3x high sensitive geophones (nat.freq.10 Hz- 1 vertical and 2 horizontal sensors) oriented according to a triad of orthogonal Cartesian axes XYZ. Delivered with a cleat assembly to sustain its weight at the requested depth (GFA cable is graduated in meters), this borehole geophone has a pneumatic-mechanical clamping system.
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3D Software
Geomagic Control X
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Combined with the powerful and highly precise Artec 3D scanners, Geomagic Control X is a fantastic solution for anyone looking for speed, accuracy and a large variety of tools to choose from. Easily get the data required for extensive quality control in no time at all with Artec’s advanced 3D scanning solutions. Acquire precise measurements and carry out inspection and data analysis on the spot, using Geomagic Control X and an Artec 3D handheld scanner. Compare 3D scans to the reference CAD model to minimise assembly flaws and increase productivity.
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Affordable 3D Scanner
Metron E
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Professional desktop 3D scanner for generating digital 3D models from physical objects at an affordable price. Metron E 3D scanner is the perfect solution if you are looking for a practical desktop 3D scanner. It’s effective at getting the job done to make you more productive.
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Product
3D Compliance SAR System
cSAR3D
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Schmid & Partner Engineering AG
cSAR3D is our newest and most advanced system for fast, high-precision SAR measurements of wireless devices. We have realized a system concept that has been developed over the last years to meet the demands of our highly valued customers. The system uses a novel sensor concept and advanced reconstruction algorithms. The measurement system has high absolute accuracy due to the determination of all field components in a large region of the head and body phantoms.
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Benchtop 3D Optical Profilometers
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Compact, non-contact metrology instruments used for high-precision, sub-nanometer to micrometer-level measurement of surface topography, roughness, and step heights.
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3D CMOS Image Sensors
Flash
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High-resolution in a rectangular format, specifically designed for 3D laser triangulation - Very high frame rate and throughput combined with high power efficiency, delivering outstanding sampling resolution and speed with a high Gbps/W ratio - HDR feature embedded on-chip, to measure all kinds of surfaces - Feature-rich sensors, to perfectly meet application challenges.
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Dimensional Inspection (3D Inspection)
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The 3D measurement data from our scanners and PCMMs offers a comprehensive definition of a physical object that is used for measurement, inspection, comparison and reporting. When a part is defined by millions of points, you can see subtle deviations, slight variations and fine details, which gives you the confidence that a part (or mold) meets your specifications. To deliver the best of both worlds, we combine 3D scanning with our contact, touch-probe measurement tools to deliver precise dimensions on geometric shapes.
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Product
High-Speed Multi-IO SPI Host Adapter
BusPro-S™
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The BusPro-S High-Speed Multi-IO SPI Host is designed with speed, versatility, and value in mind. Featuring a 60 MHz clock rate with up to 200 Mb/s throughput and support for standard, dual, quad, and 3-wire modes, the BusPro-S is the right tool for all SPI debugging applications-present and beyond.
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3D RF Noise Measurment System
EMI-360
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3D RF Noise Measurement System EMI-360 to realize the new EMC measurement.EMC measurement is possible to realize a low-cost and time reduction.
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Product
eviXscan 3D Suite 2.0
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eviXscan 3D Suite 2.0 is a comprehensive software platform that delivers the most powerful and user-friendly tools for scanning and mesh processing within straightforward workflow.With eviXscan 3D Suite 2.0 the scanning process is more easy to use and faster than ever before.The clear workflow will guide the user in all scanning steps from basic configuration to the final mesh processing and will enable to achieve significant productivity gain in work with eviXscan 3D products.
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3D Automated Optical Inspection System
EAGLE 3D 8800 SERIES
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EAGELE 3D 8800 AOI applies 8-way projection for 3Dmeasurements to all models, minimizing shadow effectserrors and performing 100% 2D&3D examinations simultaneouslyin all FOV areas.
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3D Acceleration Logger Sensor
NUL-227
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This is a 3D (three dimensions) acceleration sensor which displays each dimension one at a time. It allows measuring the acceleration of moving bodies such as a body oscillating in a spring or in a moving vehicle.
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Product
3D Microscope
BVM-5006
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BVM-5006 Electric 3D Microscope features the quality optical system, high resolution, large field of view, high zoom ratio, novel design and one-up technology, easy and automatic operations. Includes: Motorized zooming, motorized observation angle for changing and optional motorized focusing. The speed can be adjusted while changing observation angle. With the angle attachment, the microscope can realize 3D image effects for observing the components and deep holes. The LED lights can generate high brightness. Theoretically the service life of LED lights can reach 20,000 hours. The LED lights with area control function can illuminate from different angles for convenient multi-angle inspections. The M-N3D Microscope can be widely used in micro-electronics, automated monitoring and testing industries. By selecting the appropriate objectives and video couplers, different magnification, field of view and depth of field can be acquired. Digital and Analog video systems can meet the different users' demands.
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Academic Suite of 3D Measurement Solutions
Creaform ACADEMIA™
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Provides a complete and collaborative skill-nurturing academic solution. The suite let’s you choose from our full line of 3D scanners and portable CMM, free application software, complimentary add-ons as well as useful tools tailored to get you started with industrial 3D measurement solutions.
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Automated 3D Scanner
HDI Compact
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The HDI Compact 3D scanning system eliminates the tedious work involved with manually scanning an object. Save time and get stunning results everytime. The HDI Compact is an automated 3D scanning solution. The rotary table automatically spins the object and stops at predetermined intervals. The scan head captures high resolution, accurate 3D scans of an object each time. Once the object spins a full 360 degrees, all the scans are then automatically cleaned up and merged together to create a full digital 3D model.
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3D Form Measurement
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Ensure that components function and can be fitted correctly with efficient form monitoring. ISRA’s 3D form measurement systems capture component geometries down to the nanometer level while ensuring the shortest cycle times.
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3D Flexible Scanner
HDI Advance
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The HDI Advance 3D scanner offers the flexibility of scanning objects of different shapes and sizes. Simply move the camera positions to change the scanner’s field of view (FOV). The 3D scanner comes with three preset camera slots to quickly modify the field of view from 165mm up to 600mm, depending on the scanner model.
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3D Semiconductor & MEMS Process Modeling Platform
SEMulator3D
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SEMulator3D® is a powerful 3D semiconductor and MEMS process modeling platform that offers wide ranging technology development capabilities. Based on highly efficient physics-driven voxel modeling technology, SEMulator3D has a unique ability to model complete process flows. Starting from input design data, SEMulator3D follows an integrated process flow description to create the virtual equivalent of the complex 3D structures created in the fab. Because the full integrated process sequence is modeled, SEMulator3D has the ability to predict downstream ramifications of process changes that would otherwise require build-and-test cycles in the fab.
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3D Optical Profiler
7503
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Chroma 7503 uses the technology of white light interfaces to measure and analyze the surface profile of micro-nano structures with sophisticated scanning system and innovative algorithms.
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ROBOT-MOUNTED OPTICAL CMM 3D SCANNERS
METRASCAN-R
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Part of the MetraSCAN 3D line-up, the robot-mounted MetraSCAN-R optical CMM 3D scanning systems are fast and accurate scanning solutions designed for 3D automated inspection of parts on the production line and on the shop floor. In combination with industrial robots, the MetraSCAN-R series increases the reliability, speed and versatility of on-line inspection and quality control (QC) process.
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3D Solder Paste Inspection system
PI Series
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PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results.
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3D Scanners
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The process of analyzing a real-world object or environment to collect three dimensional data of its shape and possibly its appearance (e.g. color).
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3D Surface Texture Analysis Software
TrueMap 6
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Rendering styles: solid, wireframe, wireframe + pointsFull control of surface lighting, including direction, and ambient shadingRendering options including side walls, grid lines, and countour linesEdit the z exaggeration to help visualize surface deviationsRender the axes labels relative to the surface mean, maximum, minimum, or unchanged from the values stored in the fileRender the surface using a gradient to represent the surface heights, or use a solid color, or even use the true color values from the data file if they are availableMultiple options for gradients and even an optimization feature to use the height distribution
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Product
3D AOI
Zenith2
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Zenith 2 AOI platform, which provides the AI-driven Auto Programming for rapid job programming. The Zenith 2 also combines Koh Young’s advanced vision algorithms with innovative high-resolution optics. The latest platform expands inspection capabilities, delivering best-in-class performance, functionality, and accessibility. Koh Young’s side-view solution allows Zenith 2 to quickly detect and analyze defects on a wide range of mounted components and chips.





























