Tokyo Seimitsu Co., Ltd.
Manufactures and sells semiconductor manufacturing equipment and measuring instruments.
- 042-642-1701
- 042-642-1798
- 2968-2, Ishikawa-machi
Hachioji-shi, Hachioji-shi 192-8515
Japan
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Product
Dedicated Measuring Machine
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We offer measurement systems optimized for various production sites. We design and manufacture high precision, stable specialized measuring instruments to match requested specifications and requested performance.
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Product
High Rigid Grinder
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High-rigidity grinder is the device to grind the hard and brittle materials such as sapphire and Sic substrates that are considered to be hard-to-cut materials.
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Product
For Machining Center
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We offer the ATC Run-Out Detection System and the Wireless Bore Gauge. We will boost the realization of increased productivity with high precision measurement technology.
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Product
Auxiliary Equipment For Probing Machines
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We have a lineup of products that support the probing process.
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Product
*CNC Surface Texture Measuring Instrument
Surfcom C5
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SURFCOM C5 allows customization of the workpiece feed unit and jig production to suit particular needs.Basic specifications are Type-C (mainly for cylinder heads, cylinder blocks, and other workpieces wherea 5-direction approach is required) and Type-S (for camshafts and other shaft workpieces that require arotary axis).
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Product
Polish Grinders
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The polish grinder is a single machine that can both slice various device wafers and remove damage,which has been developed from a unique idea of ACCRETECH-Tokyo Seimitsu. In recent years, the grinder also contributes to various grinding and polishing processes required for advanced packaging technologies such as laminated memory and FO/2.5D/3D.
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Product
Auxiliary Equipment For Dicing Machines
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We have a lineup of package singulation machines, automatic cleaning systems, chillers, etc. that support the dicing process.
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Product
Precision ACCRETECH Dicing Tools
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Precision ACCRETECH Dicing Tools for precision cutting are derived from our unique development technology as well as our diverse application technology. We offer products that can cut a variety of materials, cover diverse cutting applications and satisfy today's requirement of "high quality & low cost".
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Product
X-ray CT System
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The surface and the internal parts, in one measurement. We provide “Dimensional X-ray CT System” that does not only observe the interior of the workpiece, but that can also perform high precision, contactless measurements.
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Product
Coordinate Measuring Machines
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Tokyo Seimitsu is the pioneer that developed “Japan’s first coordinate measuring machine.” We respond to every need with a varied lineup to which we have added Carl Zeiss products linked to our products.
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Product
Dicing Machines
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Dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
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Children
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Tosei Engineering Corp.
Repair and technical services for measurement testing equipment, precision equipment, industrial tools, jigs, gauges and electrical equipment. Sale of system products and provision of related repair and technical services. Manufacture and sale of automation and labor saving devices for industrial processes such as measurement, automated measurement, automated assembly, and automated sorting. Manufacture and sales of semiconductor manufacturing equipment. Provision of comprehensive services in all the foregoing areas.
