Tokyo Seimitsu Co., Ltd.
Manufactures and sells semiconductor manufacturing equipment and measuring instruments.
- 042-642-1701
- 042-642-1798
- 2968-2, Ishikawa-machi
Hachioji-shi, Hachioji-shi 192-8515
Japan
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Product
Laser Interferometers
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Measurements of the length displacement or yawing and pitching, measurements of rotation angles, measurements of overshoots during vibrations or when stopped and of uneven speed, etc. can be handled. Length measuring instruments can be used for a variety of purposes, including precise inspection of heavy duty equipment.
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Product
Discharge Test System
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The automated testing equipment automatically performs charge and discharge of energy devices such as the rechargeable batteries(cells, modules, packs) that are installed in PHV/ EV and mobile devices, while measuring the voltage, current, temperature, and impedance.
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Product
Probing Machines
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Probing machine is a wafer transfer and positioning device used for testing the electrical characteristics of chips formed on wafers. This wafer test is used to sort out good and defective chips.
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Product
Dedicated Measuring Machine
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We offer measurement systems optimized for various production sites. We design and manufacture high precision, stable specialized measuring instruments to match requested specifications and requested performance.
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Product
Optical Shaft Measuring System
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The measurements and shape of the shaft or rotating partsare measured in an overwhelmingly short time. In our lineup, we can handle inspection and automation during production processes, so we can contribute to increased productivity at your company.
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Product
Non-contact Displacement Sensors
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This is a flexible sensor that can be installed anywhere and is equipped with high environmental resistance enabling use in harsh environments.
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Product
Edge Grinding Machines
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The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
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Product
*CNC Surface Texture Measuring Instrument
Surfcom C5
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SURFCOM C5 allows customization of the workpiece feed unit and jig production to suit particular needs.Basic specifications are Type-C (mainly for cylinder heads, cylinder blocks, and other workpieces wherea 5-direction approach is required) and Type-S (for camshafts and other shaft workpieces that require arotary axis).
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Product
Non-contact Surface Texture And Contour Measuring Instruments
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From sub-nano level surface roughness to milli level profile with 3D.Tokyo Seimitsu provides non-contact type surface roughness and contour measuring instruments with the confidence born out of many years cultivating know-how of surface roughness measurements.
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Product
Surface Texture And Contour Measuring Instruments/Systems
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We provide high performance, easy-to-use systems from highly efficient hybrid types that can measure the surface roughness and the contour in one trace, to portable types that can be used even on the production site.
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Product
For Grinder And Lathe
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We offer an abundant lineup such as the PULCOM series for in-process and post-process measurements, and the SBS products for the grinding wheel’s automatic balance system.
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Product
Roundness And Cylindrical Profile Measuring Instruments
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We respond to a variety of needs with our lineup including both rotating table types that enable high precision measurement of cylindrical workpieces, and rotating type detectors that handle eccentric or heavy workpieces.
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Product
Wafer Demounting And Cleaning Machines
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Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
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Product
X-ray CT System
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The surface and the internal parts, in one measurement. We provide “Dimensional X-ray CT System” that does not only observe the interior of the workpiece, but that can also perform high precision, contactless measurements.
Children
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Tosei Engineering Corp.
Repair and technical services for measurement testing equipment, precision equipment, industrial tools, jigs, gauges and electrical equipment. Sale of system products and provision of related repair and technical services. Manufacture and sale of automation and labor saving devices for industrial processes such as measurement, automated measurement, automated assembly, and automated sorting. Manufacture and sales of semiconductor manufacturing equipment. Provision of comprehensive services in all the foregoing areas.
