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Thermal Expansion
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Horizontal Dilatometers
TA Instruments’ unique True Differential configuration makes our dilatometers the preferred choice for the most accurate measurement of Coefficient of Thermal Expansion (CTE). The high precision linear position sensor, the thermostat equipped measuring head housing, and the use of thermally ultra-stable materials all contribute to the outstanding displacement resolution, and ensure the most accurate measurement of low CTE values.
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Coupler Workstations
Workstations using pure hydrogen gas from a tabletop generator, tank supply, or oxygen, can achieve high enough temperatures to develop Fused Biconic Tapered devices, Power Combiners, Wavelength Division Multiplexers, Thermal Core Expansion devices, and many other products.
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Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
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Thermal Testing
At E-Labs, Inc., we support thermal cycling and thermal bakeout vacuum testing requirements. During thermal cycling, the unit experiences repeated heating and cooling as it would when exposed to the harsh environment of space. During thermal bakeout, flight equipment is subjected to an outgassing reduction process so as to decrease the chance of molecular contamination of the spacecraft instrumentation.
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Thermal Shock
Trialon routinely test products for the automotive, military, medical, aerospace, heavy truck and customer markets in our facilities in Michigan and Indiana.
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Expansion Module For CompactRIO
The Expansion Module for CompactRIO connects to the processor I/O, such as USB and Ethernet, of a controller to expand its functionality. This module works with CompactRIO Controllers, Industrial Controllers, CompactRIO Single-Board Controllers, and PXI Controllers to expand the capabilities of the system, such as adding additional storage for saving more data and increasing the number of USB or time-sensitive networking (TSN) Ethernet ports of the system. Additionally, the Expansion Module for CompactRIO features the same rugged shock and vibration ratings as other CompactRIO modules, and you can can mechanically connect it to a controller for integration using mounting accessories.
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USB Expansion Kit
OP-SB84
OP-SB84 is an expansion board for monitoring USB2.0 and measuring VBUS power, inserting into a slot of portable communication analyzer (LE-8200A/LE-8200). It is a stand-alone USB analyzer, exchanging the measurement board and line state sheet for USB signals. This equipment runs without a PC and useful not only for developing USB devices but also trouble shooting and after-supporting of USB devices.
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Expansion I/O Module.
SI-MOD66xx
The SI-MOD66xx is a family of high resolution, multi function data acquisition and control modules that plug into any SI-CxDSP carrier processor card for the PCI bus.
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Thermal imagers
Thermal imagers sensitive in MWIR and LWIR spectral bands are one of crucial surveillance technologies for defense/security sector. These imagers have also found mass applications outside defense sector. Testing thermal imagers is needed for both manufacturers, maintenance workshops and final users for a set of different and important reasons. Hi-tech test equipment can help significantly in manufacturing, maintenance, training, purchase optimization, and optimal use of these expensive imagers.
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TTL/I2C/SPI* Expansion Kit
OP-SB5GL
OP-SB5GL is the interface expansion kit that has a port to measure RS-232C(V.24) and a port to measure the TTL / CMOS signal level communications. The port for TTL / CMOS supports the measurement of TTL / CMOS level communications that power supply system is from 1.8V to 5V. It is suitable for monitoring the communications between the LSI and the interface IC on the printed circuit board by directly probing into the lines. It supports the protocol of not only UART and HDLC but also I2C and SPI* on monitoring and simulating.
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Air and Thermal Management
Honeywell Aerospace Technologies
Honeywell's range of electronic and electro-pneumatic systems for air and thermal management are proven to deliver highly reliable and efficient operation with lower total costs of ownership for aircraft operators.
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Semiconductor Thermal Analyzers
Analysis Tech Semiconductor Thermal Analyzers measure semiconductor junction temperatures using the electric method of junction temperature measurement on all types of semiconductor devices.
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Thermal Imaging Cameras
IRDL708 Series
The IRDL708 thermal imaging cameras are the new developed uncooled detector cameras, which have high resolution of 640x480 pixels, multi-rotary touch screen, normal and infrared image fusion, high brightness LED light, recording in H.264 format or normal format, images in JPEG format, light and sound alarm, voice and text annotations, network interface, built-in laser pointer, etc.
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SM / Expansion Unit
A testing procedure designed to thoroughly test the electrical characteristics of a wire or cable, may require additional test points to connect the end points of all conductive paths. The changing and alteration of Test Adapter Cables (TACs) would become obsolete when having access to one or several expansion units. Increased testing efficiency alleviates the long, drawn out down times of the disabled aircraft while improving product readiness. Additional time can be spent on troubleshooting and problem identification and will not require the user to unhook and connect TACs to different matrices. Adding additional expansion units will save the user time, money, and effort.
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Thermal Imaging Sensor
3550 FC
Condition monitoring sensor to visualize thermal patterns on multiple assets. Maintenance managers can now collect a more comprehensive variety of key-indicator data — thermal imaging, voltage, current, temperature, and power — on critical equipment to build a real-time picture of an asset's condition. With the right mix of data all in one place, managers can implement planned maintenance and decrease the frequency of preventive rounds.
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Isolated Digital Expansion Board
MSXB 078
The Microstar Laboratories Isolated Digital Expansion Board, part number MSXB 078, provides isolated digital expansion for Data Acquisition Processor (DAP) systems. Use these boards to eliminate ground currents – a potential source of noise in your measurement and control signals – and eliminate timing errors from high-channel count digital I/O.
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Thermal Imager with App
testo 871
The testo 871 thermal imager combines high infrared resolution with professional measuring performance and easy handling. Its high-quality pixel detector, an integrated digital camera and, last but not least, the innovative functions are the features that impress. The testo Thermography App enables the testo 871 to offer smart thermography to meet professional requirements in industry and trade. The case supplied with the thermal imager means it can be conveniently transported, so it is always there for you when needed.
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Thermal Desorption
Scientific Instrument Services, Inc.
The SIS Short Path Thermal Desorption units sit directly on top of a GC injection port to provide for the direct desorption of both volatile and semi-volatile samples into the GC injection port and column. Due to the "short path" of sample flow, these new systems overcome the shortcomings of previous desorption systems by eliminating transfer lines, which are easily contaminated by samples, and by providing for the optimum delivery of samples to the GC injector via the shortest path possible--the direct, syringe-like injection into the GC.
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PCI Expansion Card
4624-3
VECTOR Electronics and Technology, Inc.
120 contacts (60 each side) on 0.050" centers. Overall GND plane, Pad-Per-Hole, Peripheral Buses. Isolated pads around each hole. 32-bit ISA format. Universal tab fits both 3.3V and 5V tab notch patterns. Mounting bracket included.Peripheral buses for voltage and ground distribution.I/O mounting area for D-sub and ribbon cable connectors.
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Frequency Expansion Modules
bsw TestSystems & Consulting AG
Up To 1.5THz For Network Analyzers Modern communication standards, like for instance 5G, place high demands on components (mixers, amplifiers, antennas, etc.), which have to be examined in high frequency bands (millimeter waves); the requirements include: broad frequency coverage, sufficient output power to operate the components under compression, high dynamic range and stability as well as a reduced dynamic content within the spectrum.
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Thermal Imaging Cameras
Thermography tools are indispensable when it comes to non-contact detection of thermal differences. Thermal imagers can be used to find defects in buildings, discover damage during maintenance, or analyze thermal processes.
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XMCspan XMC Expansion Board
XMCspan
The XMCspan allows users to customize and expand I/O options when coupled with VMEbus SBCs, adding up to 4 XMC or PMC slots.
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Handheld Thermal Cameras
Exx-Series
Troubleshoot more efficiently, create detailed reports easier, and share images and findings faster with FLIR's latest E-Series thermal imagers. Featuring a fresh array of imaging, communication, and productivity tools to help you get more done in a day.
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Thermal Insulation Demonstrator
Shenzhen Linshang Technology Co., Ltd.
Linshang Technology offers three sales kits to demonstrate the thermal insulation performance and UV blocking performance of glass and window films, two solar film temperature meters LS300 and LS301 to demonstrate thermal insulation performance through temperature test, two power meter: infrared power meter and UV power meter.
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Thermal Profiler
KIC K2
The latest-generation mobile-friendly profiling technologyThe KIC K2 Thermal Profiler features a compact and robust design that allows it to fit through the tight, heated chambers of lead-free reflow ovens. A plug-and-play hardware and graphical user interface makes profiling both quick and easy. The profile data measured by the K2 can now be viewed on either a PC or on a mobile device using the Profile Viewer App.
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Serial I/O Expansion
PCM-CAN
WINSYSTEMS’ PCM-CAN-2-ISO is a PC/104-compliant, isolated Controller Area Network (CAN Bus) peripheral module. This board uses two NXP SJA-1000 CAN controller ICs with advanced features for use in automotive and industrial applications.
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Expansion Board
MSXB 044
The MSXB 044 expansion board works with the iDSC 1816 to add signal conditioning to the data acquisition and anti-aliasing capabilities. Four MSXB 044 boards are included in each MSSC-8 module. Purchase the MSXB 044 as part of a complete SCS system: an enclosure and 1, 2, 3, or 4 MSSC-8 modules, for a total of 8, 16, 24, or 32 channels.
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Smartphone Thermal Cameras
Smartphone thermal cameras are small sized and light weight in design, converting your mobile devices into a professional portable infrared thermal imager. A user friendly Mobile App is also included for image viewing, download, and analysis.
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Thermal Test Boards
Thermal Engineering Associates, Inc.
TEA offers a series of thermal test boards for package characterization and design comparison that conform to to the JEDEC JESD51 standards. The board family, referred to as the TTB-1000 series, consists of two different standard sizes designed to cover a wide range of package sizes. These boards, also referred to as test coupons, provide a well defined mounting environment, will withstand temperatures to 125 oC, and have lead lands terminated in eyelets to allow for hand-wired connection to the board edge contacts. The board mates with a dual 18-pin, 3.962 mm (0.156") pitch edge-card connector.
