Filter Results By:
Products
Applications
Manufacturers
Solder Ball
-
product
BGA SMT Adapters
Giga-snaP™
Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
-
product
Socket Accessories (SMT Options)
The SMT adapter consists of standard high temperature FR4 with plugged via technology, eutectic SN63PB37 solder balls or SAC lead free solder balls and threaded inserts for mounting the socket. The top side of adapter has SMT pads to receive socket interconnect and the bottom side has appropriate solder balls for corresponding pitch. This FR4 adapter with balls can be soldered to the SMT pads in the target board. Then socket can be mounted to the threaded insert on the FR4 adapter.
-
product
Grypper "Y"
Ironwood Electronics Grypper Y contact is design to work with BGA devices with solder balls/bumps with no equator or small exposure where the standard Grypper cannot reliably hold on to the solder ball. The Y shape, working with the sliding lid, allows reliable contact and ensures device retention in high vibration application. Lower forces, <25 grams, makes insertion easier too and the less aggressive contacting allows 40+ insertions of the same device. The Sliding Lid can be configured to include heat sinking. The Y contact designs cover BGA devices from 0.35mm pitch and larger and the short electrical length has superior electrical performance.
-
product
Grypper G35 / G40
*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*Oxide cutting wipe action: The contact design wipes the side of the solder ball during insertion, breaking through solder oxides ensuring a good electrical connection between contact and solder ball*Signal integrity: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection*Test socket has solder balls attached: The G40 contacts have solder balls reflowed onto the contacts to ensure reliable solder volume at the PCB to test socket solder interface.
-
product
Soldering Inspection Video Microscope
MS-1000
The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
-
product
Silver Ball Matrix Sockets
SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
-
product
Copper Pillar Bump
Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
-
product
Tool, Solder Kit, Mini Coax with Solder Sleeve
910121144
Used to solder Mini Coax Solder Sleeve contacts.
-
product
Solder Past Inspection
From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
-
product
Soldering Test
The soldering tests are conducted to determine if materials can withstand soldering effects, such as resistance to soldering heat, as well as the solderability of components during the manufacturing process.
-
product
Solder Cup Connector Kit
Y1139A
Used to build custom cables for 34921/23/25/31/32/33/37/38 –50-pin Dsub female – 125 V
-
product
Ball Rebound Tester
Hildebrand Prüf- und Meßtechnik GmbH
The ball rebound tester is used to determine the resilience of foam materials in accordance with DIN EN ISO 8307 and ASTM D 3574.
-
product
Ball Pressure Apparatus
BP-20
Is designed to perform tests specified in many standards where resistance of insulating materials to elevated operating temperatures is to be determined. It is used to test insulation materials used in Electrical Appliances, Electrical wiring accessories, luminaires, motors, connectors, etc. The test ensures that external parts of insulating material, the deterioration of which might cause the appliance to fail to comply with the relevant standards, are sufficiently resistant to heat.
-
product
3D Solder Paste Inspection system
PI Series
PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results.
-
product
SparkFun Solder-able Breadboard
Mini
This is the Mini SparkFun Solder-able Breadboard. A bare PCB that is the exact size as our mini modular breadboards with the same connections to pins. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
-
product
SparkFun Solder-able Breadboard
This is the SparkFun Solderable Breadboard. A bare PCB that is the exact size as our regular breadboard with the same connections to pins and power rails. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
-
product
Ball Pressure Tester
4710
The ball pressure tester is used to test the thermal properties of insulating materials. The test sample is placed in an oven and a steel ball is pressed against the surface. The impression of the steel ball is measured to see if it meets the requirements.
-
product
Ball Pressure Test Apparatus
CX-Q03
Shenzhen Chuangxin Instruments Co., Ltd.
The Ball Pressure Apparatus is used to check the integrity of dielectric materials by exerting 20N force. The BPA10 is called out in IEC 60335, 60950, 61010, UL, CSA and European Norms. It is used to check the integrity of dielectric materials by exerting 20N force. The Ball Pressure Apparatus is made of stainless steel for long life. Since accelerated life procedures are used for this oven test, more than one apparatus may be useful for parallel testing.
-
product
37-Pin D-Type Female Solder Pin HV
92-960-037-F-HV
This accessory is designed to allow users to directly terminate a cable with soldered connections. When the product is used without a backshell users should make their own cable strain relief arrangements and ensure appropriate electrical safety precautions are observed.
-
product
9-Pin D-Type Female, Solder Bucket, HV
40-960-009-F-HV
9-Pin Female D-Type Connector, High Voltage, Solder Bucket - With Backshell
-
product
Wave Soldering Machines
Shenzhen Leadsmt Technology Co.,Ltd
A bulk soldering process used for the manufacturing of printed circuit boards.
-
product
Solder Wettability Tester
5200TN
Amid the rapid progress in miniaturization of electronic components in high-density mounting, a long-established company that has been manufacturing solder wettability testers for about 40 years has developed a solder wettability tester compatible with the latest micro electronic components. and is the top model in the history of solder checkers with improved operability. * Wetting stress is proportional to the circumference of
-
product
Connector, 104-Pin D-Type Male, Solder Bucket, 5A
40-960-104-M
This 104-pin male D-type connector allows users to create their own cable assemblies. Cable connection is via solder buckets - supplied with rear cable entry backshell.
-
product
Solder Cup Connector Kit
Y1140A
Used to build custom cables for 34922, 34924 – 78-pin Dsub female – 60 V
-
product
68-Pin SCSI Micro-D Female Solder Bucket
40-962-068-SB-F
This connector is designed to allow users to directly terminate with soldered connections to the 68-Pin SCSI Style Micro D connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
-
product
Solderability Tester
ZHX-35
Shanghai Dean Electrical Co., Ltd
Executive standard: GB/T4074.4-2008/IEC60851-4; Inspection standard: JB/T4279.14-2008Used to detect the self-solderability of enameled round wires and wire harness;Set variable temperature range and automatically maintain constant temperature;Under mechanical driven, samples would be withdrawn by the action of automatic insertion and lateral movement, free from vibration and noise;
-
product
Replacement Solder tip lead set for D420/D620
Dx20-SI
- Choice of 4 GHz or 6 GHz bandwidth models- Up to 5 Vpk-pk dynamic range with low noise- ±3 V offset range- Low loading and high impedance for minimal signal disturbance- Ideal for DDR2, DDR3, LPDDR2- Deluxe soft carrying case- Innovative QuickLink architecture- Wide variety of tips and leads-- Solder-In Lead-- Optional Positioner (Browser) Tip-- Quick Connect Lead-- Square Pin Lead-- HiTemp Solder-In Lead
-
product
POGO-1 High Performance Bias Ball Probe
POGO-1
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
-
product
3D Solder Paste Inspection (SPI)
TR7007 SII
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
-
product
9-Pin D-Type Male, Solder Bucket, HV
92-960-009-M-HV
9-Pin Male D-Type Connector, High Voltage, Solder Bucket - Without Backshell
