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Silicon
atomic number 14 tetravalent metalloid chemical element.
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Silicon Based Thermopile Detector: 4 Channels
ST150 Quad
A four-channel silicon-based thermopile detector in a TO-8 package. Each active area size is 1.5mm x 1.5mm. Affordable four-channel design with strong output and a very low Temperature Coefficient of Responsivity of -0.04%/C. This detector has a very short thermal shock response to ambient temperature change.
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SOI Bonding Systems
An accurate wafer bonding process is the key factor in obtaining high quality single crystalline silicon films on insulating substrates. The EVG850 SOI/Direct Wafer Bonding systems are designed to fulfill a wide range of fusion/molecular wafer bonding applications, with main focus on SOI substrates manufacturing. Ultra clean handling of wafers throughout the bonding process assures high-yield and void-free bonds. All essential steps, from cleaning and alignment to pre-bonding and IR-inspection are combined in one high volume production system. EVG850 is the only production bonding system built to operate in high throughput, high-yield environments and guarantees void-free SOI wafers up to 300 mm.The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield. Wafer Bonding is a process which is strongly affected by particles: each particle on the wafer surface produces a void orders of magnitude larger than its diameter, contributing to a dramatic yield loss.
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Digital Solutions
Digital ST60 Dual Thermopile (Preliminary)
A two channel silicon- based thermopile in a TO-5 package that includes integrated electronics which incorporate an industry standard digital SMBus interface. Each small active area size is 0.61mm x 0.61mm.
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Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Manual Four Point Probe Sheet Resistance/resistivity Measurement
RT70V series
• Combinational measurement system by Measurement tester(RT-70V) & Stage.• Thickness input with easy JOG dial operation (RT-70V Tester)• Tester self-test function/Auto change-over measurement range function• Thickness & Temperature correction function for Silicon sample
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Switches-DPDT
Macom Technology Solutions Holdings Inc.
At MACOM we offer an extensive collection of switches covering multiple commercial and aerospace and defense markets. Our product portfolio has a broad frequency spectrum from DC to 70 GHz. Our silicon Heterolithic Microwave Integrated Circuit (HMIC) PIN diode process is ideal for high power and broadband switches operating from 50 MHz to 26 GHz. Our AlGaAs PIN diode process can extend the upper frequency range of our switch die beyond 70 GHz and is ideal for instrumentation and radar applications. Our GaAs pHEMT and MESFET technology is ideal for fast switching and low control voltage switches optimized for both narrow band and broadband applications. Our 75 Ohm absorptive switches are designed specifically for demanding CATV, FTTx and DBS Infrastructure and CPE applications.
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Surface & Volume Low Resistivity Meter for Conductive Materials
Loresta GP
The Loresta GX Meter is an intelligent, multi purpose low resistivity meter equipped with software that calculates resistivity correction factors. A variety of 4 pin probes are available for use with the Loresta GX. The instrument is typically used in Product Engineering, R&D, and Quality Control. Applications include measurement of conductive paint, conductive plastics, conductive rubber, conductive film, silicon wafers, antistatic materials, EMI shield materials, conductive fiber, conductive ceramics, etc.
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NanoModeScan M² Measuring System
This scanning slit M² measurement system accurately analyzes lasers with wavelengths from UV to Far Infrared with its silicon, germanium, or pyroelectric head. It features a compact portable design, immediate results, ISO compliant measurements, and operates in CW or kHz Pulsed modes which makes it ideal for comprehensive analysis of lasers of most wavelengths.
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Light-to-Analog Sensors (Voltage)
Renesas' light-to-voltage silicon optical sensors combine a photodiode array, a non-linear current amplifier and a micropower op amp on a single monolithic IC. Applications for these devices include display backlight control, keypad dimming, anti-glare mirror systems, and industrial and medical light sensing applications.
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Photo Detector Laser Power Meters
11PD100-Si
Silicon detectors provide a generous aperture for laser beams up to 10 mm in diameter. The threaded aperture allows you to install filters, attenuators, fiber optic adapters or other optics that suit your specific needs.
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Software Solutions
AuSIM is a technology company where the technology manifests itself in software. AuSIM has some of the brightest software developers in Silicon Valley. AuSIM software is light-weight, extremely efficient, and very high-performance. Since humans are in the middle of all AuSIM technology experiences, AuSIM optimizes for perceptual-based design, usability, and the lowest latency anywhere.
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Blackbody System
IR-563/301
Infrared Systems Development Corp.
IR-563 is a ideal source for the Near (1-3 um), Mid (3-8) and Far (8-30+ um) infrared bands. The IR-563 has been the industry standard 1000º C blackbody for more than 30 years, and continues to provide excellent service to infrared applications throughout the industry. The IR-564 extends the temperature range of the IR-563 to 1200º C by changing cavity materials to Silicon Carbide and high purity Alumina ceramics, otherwise the two units are virtually identical.
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Step Recovery Diodes
SemiGen’s SSR series of Step Recovery Diodes are epitaxial silicon varactors which provide high output power and efficiencies in harmonic generator applications. Using custom epitaxial wafers, our process ensures high reproducibility. The silicon dioxide passivation process assures greater stability and low leakage currents over temperature. Uniform capacitance ensures repeatability from device to device. These diodes are available in chip or packaged form.
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Full-spectrum Acoustic Logger
AudioMoth
AudioMoth is a low-cost, full-spectrum acoustic logger, based on the Gecko processor range from Silicon Labs. Just like its namesake the moth, AudioMoth can listen at audible frequencies, well into ultrasonic frequencies. It is capable of recording uncompressed audio to microSD card at rates from 8,000 to 384,000 samples per second.
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Barometric Pressure Transmitter
Comptus Barometric pressure sensors utilize an integrated silicon, absolute pressure sensor with internal temperature compensation. The sensor is mounted to the signal conditioner board. A 3/16 inch diameter tube may be attached to the sensor to provide remote pressure sensing. The output of the sensor is scaled to provide the desired output signal.
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Military Solid State Relays
Military Solid State Relays by Teledyne Relays - bi-directional/AC, DC/MSSRs, commercial, high performance relays, military cross reference tool, silicon carbide MSSR, and more.
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PMT Pressure Solutions
AMETEK Sensors, Test & Calibration
PMTs pressure transducers and transmitters are some of the most long term stable units on the market, due to our solid state silicon piezoresistive sensing element. Standard, intrinsically safe, and explosion proof transducers and transmitters are available in off-the-shelf models for quick delivery, or custom configurations.
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DC Input Darlington
DC input/Darlington transistor output photocouplers (optocouplers) are optically coupled isolators containing a GaAs infrared light emitting diode and an NPN silicon Darlington connected phototransistor. This type can operate on a low-current DC input because of its Darlington configuration.
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Turbidimeter
DRK6600-200
Shandong Drick Instruments Co., Ltd.
The main technical parameters:Source: Tungsten halogen lamp 6V, 12WReceiving elements: Silicon photocellMeasuring range NTU: 0.00-50.0; 50.1-200; (automatic range switching)
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4-Port In-System Programmer For Silicon Labs
MPQ-C2
Supports Silcon Labs C8051F series devices with C2 Programming Interface Field Upgradeable - always supporting the latest devices Secure image management - protects your IP In-circuit gang programming of up to four devices at once Can be deployed in arrays to program up to 64 devices in parallel Stand-alone, PC-controlled or ATE-controlled operation Automatic device serialization
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Isolation and Power Solutions
Silicon Labs' innovative digital isolation and power product portfolio includes CMOS digital isolators, isolated gate drivers, isolated current sensors, isolated system products and Power over Ethernet (PoE) families. These mixed-signal IC solutions leverage Silicon Labs' superior isolation and high voltage expertise to enhance power system performance, flexibility and reliability while reducing system size and cost. The entire isolation portfolio supports isolation voltages up to 5 kV.
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Silicon-Microphone 8Ch Auto Test System
BK9015
Based on the BK3011 MEMS Mic Tester, the BK9015 is our fully automatic 8 channel MEMS (Silicon) mic sweep tester. Testing up to 8 DUT's simultaneously, the BK9015 can test 8 mics simultaneously and sort them according to passing grade and cause of failure! Because it uses a sweep test, it can check characteristics for the entire frequency range. Your data can be viewed in real time or stored so you can analyze problems or trends.
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330 System
NSX
With a combination of inspection plus metrology, NSX 330 System measures multiple applications including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load.
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Preset Torque Screwdrivers
FG
Engineered and assembled in the Silicon Valley, the Mountz FG line of preset precision torque screwdrivers are the most advanced hand tools in the world.
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Probes
SHOCONA Probes are designed for non-vibrating, contact mode applications and are compatible with most commercially available SPMs/AFMs. These probes are nanofabricated using highly doped single crystal silicon with unparalleled reproducibility, robustness and sharpness for consistent high resolution imaging capabilities. This is a box of 10 probes.
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R&D Solutions From Teledyne LeCroy Quantum Data
Teledyne LeCroy offers a wide variety of products for engineers in the R&D lab. R&D testing entails functional testing for source and sink devices as well as interoperability testing for diagnosing problems between A/V devices. Solutions for silicon chip manufactures are available for both source and sink devices. Quantum Data solutions are available for testing HDMI, MHL, DisplayPort, HDBaseT and 3G-SDI products.
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Packaging Manufacturing
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Magnetic Field Sensors
Analog Devices magnetic field sensors combine integrated bulk Hall cell technology and instrumentation circuitry to minimize temperature related drifts associated with silicon Hall cell characteristics. The architecture maximizes the advantages of a monolithic implementation while allowing sufficient versatility to meet varied application requirements with a minimum number of components.
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Measurement System
BLS-I/BCT-400
The BLS-I/BCT-400 measurement systems perform lifetime measurement on monocrystalline or multicrystalline silicon (ingots or bricks) without requiring surface passivation.
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Non-contact Sheet Resistance/resistivity Measurement Instrument With PC
NC-10 (NC-20)
*Easy operation and data processing by PC*No damage measurement by non-contact eddy current method*Replaceable probes by meas. range (*Second or more probe is for the option)*1 point measurement of center position*5 types of model for each measuring range*Temperature correction for silicon wafer function
