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Semiconductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
See Also: iJTAG
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SOI Bonding Systems
An accurate wafer bonding process is the key factor in obtaining high quality single crystalline silicon films on insulating substrates. The EVG850 SOI/Direct Wafer Bonding systems are designed to fulfill a wide range of fusion/molecular wafer bonding applications, with main focus on SOI substrates manufacturing. Ultra clean handling of wafers throughout the bonding process assures high-yield and void-free bonds. All essential steps, from cleaning and alignment to pre-bonding and IR-inspection are combined in one high volume production system. EVG850 is the only production bonding system built to operate in high throughput, high-yield environments and guarantees void-free SOI wafers up to 300 mm.The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield. Wafer Bonding is a process which is strongly affected by particles: each particle on the wafer surface produces a void orders of magnitude larger than its diameter, contributing to a dramatic yield loss.
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Semiconductor Assembly
With the know-how that we have cultivated over many years in the semiconductor manufacturing process, we respond to the diverse needs of our customers regardless of prototype production and mass production.
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Software to Simulate Large Area Semiconductor Devices
Laoss
Laoss is a powerful software to simulate large area semiconductor devices (OLED, thin-film PV), taking into account the voltage drop in the electrodes due to important resistive effects when the size of the device increases.Simulation of large area semiconductor devices (OLED, thin-film PV)Coupling law input: analytical or tabulated (experimental or simulated) IV curveDevice optimization (electrode material, device geometry etc...)High speed computation
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Genmark Integration Framework and Technology Development Kit
GIFT Server
The Genmark Integration Framework and Technology (GIFT) development kit is a set of software components, tools and techniques used for rapid development of equipment automation applications. It offers off-the-shelf factory host-computer interface, which are compliant with all related SEMI standards. The product features advanced user interface, broad range of supported automation hardware and presets for many 300mm semiconductor factories.
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Interface Solutions
Cohu is the market leader in semiconductor test sockets and has 50+ years of semiconductor test expertise providing optimal test contactor and probe pin solutions for every type of application and challenge, using innovative and sophisticated R&D methods.We offer a full suite of test contactors that provide the electrical interface between the tester and the semiconductor device presented by the test handler; optimizes signal performance via an array of consumable probe pins.
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Trusted Semiconductor Die/Wafer Source
To offer a complete Turn-Key Solution requires the ability to source both leading edge high density and older die/wafer products. DPACI has factory direct access to Static Ram, Flash and DRAM Die/Wafer. For obsolete parts, DPACI can assist you with sourcing or recommend an upgrade. DPACI has access to roadmaps, data sheets and die maps to assist you with your choices.
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Steam Aging Test Chambers
Dongguan Amade Instruments Technology Co., Ltd
Steam aging test chamber is a climatic test machine used to judge the products performance to resist extreme circumstance under high temperature, high humidity and high pressure during the transportation, storage and usage. The principle is very simple, water in the tank is heated turning into steam to form a simulated test environment under specified temperature and humidity. Specimens are placed into the drawers of machine to carry out test lasting for preselected time. It is applicable to electronic connectors, semiconductor IC, transistor, LCD, diodes, resistances etc.
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1.3 MP Global Shutter Camera (Monochrome / Color (RAW Bayer))
See3CAM_10CUG
The See3CAM_10CUG is a 1.3 MP Custom Lens CMOS USB Global Shutter Camera Module. This is a S/CS/C Mount global shutter camera and is UVC-compliant SuperSpeed USB 3.0 Camera. It is based on the Aptina / ON Semiconductor AR0134 CMOS sensor. See3CAM_10CUG is also backward compatible with USB 2.0 host ports and does not require any special camera drivers.
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ESD Device Testing
Barth Electronics, Inc. offers complete ESD Testing to the semiconductor industry. Nothing is outsourced – all testing is performed at our factory in Boulder City, Nevada.
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PROBE CARD
the electrical characteristics of the individual CHIPs in WAFER that have been completed through the FAB stage during the semiconductor fabrication process
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Conductivity Type Tester
HS-HCTT
It is strictly designed according to the requirements of the hot-probe thermal EMF conductivity type test in standard ASTM F42: Standard Test Methods for Conductivity Type of Extrinsic Semiconductor Materials. A temperature controlling heating element is installed inside the hot probe so that the hot probe is heated automatically and its temperature is maintained in the range 40-60℃.
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Impulse Semiconductor High Current Integrated
Transmission Line Pulse Test System
The Impulse Semiconductor High Current Transmission Line Pulse (TLP) test system is the tool of choice for extracting ESD parameters for transient protection devices in a package, or at wafer level. With accuracy better than 100 milliohms at 40 amps peak current, the Impulse high current TLP is specially tailored to the needs of today's ESD device designers who must accurately measure low values dynamic resistance irrespective of breakdown voltage.
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High Speed & Precision Pressure Insensitive Mass Flow Module
D700MG
Critical semiconductor manufacturing processes continuously desire precision gas flow control devices that enable both future innovation, and lab to fab transition of leading edge memory and logic device. HORIBA's propose the new pressure based MFC D700MG, the upper compatible model of the D500MG to support customer’s challenges.
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Total Reflection X-ray Fluorescence (TXRF) Services
A highly surface-sensitive technique, TXRF is optimized for analyzing surface metal contamination on semiconductor wafers.
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PXI 12 Channel High Voltage Multiplexer
40-320-001
The 40-310/320 Range of High Voltage Switching Modules will hot switch up to 750V peak and cold switch up to 1000V peak in either general purpose relay (40-310) or multiplexer (40-320) configurations. These modules contain high-quality reed relays with switching ratings comfortably higher than the 40-310/320 specification. Applications for the 40-310/320 series modules include; circuit board isolation testing, relay testing, semiconductor breakdown monitoring and cable harness insulation testing.
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DSP-Based 4/8-Axis Advanced Pulse-Train Motion Controllers
AMP-204C/AMP-208C
ADLINK"s new AMP-204C/AMP-208C DSP-based 4/8-axis advanced pulse-train motion controllers incorporate up-to-date floating-point DSP and FPGA technology, enabling high pulse output and encoder input frequency up to 6.5 MHz and 20 MHz respectively. Leveraging ADLINK" s Softmotion technology, the AMP-204C/AMP-208C offer impressive comprehensive and application-oriented motion functionality to reduce development time while maintaining superior throughput and accuracy. Superior synchronous motion control performance combines with point-table function integrating multi-dimensional interpolation, such as 3D linear/circular/spiral interpolation with enhanced trajectory and velocity planning, for contouring applications in semiconductor, display and conventional manufacturing industries. The AMP-204C/AMP-208C also support PWM control with three different control modes for frequency or duty cycle, benefiting laser engraving/marking/cutting applications. Moreover, hardware-based position comparison and trigger output are applicable in AOI applications.
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PXI Switched Guard Reed Relay Module, 13x SPST
40-121-002
The 40-121-002 provides 13x SPST switches in a single slot PXI module and designed to provide an isolation resistance in excess of 1013Ω. It has been designed to ensure high isolation resistance through the use of switched guards, making it ideal for low level measurements and semiconductor test.
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Industrial Resistivity Meter
HE-480R(W)
The HE-480R industrial resistivity meter features the high-precision temperature compensation function.Its high-performance temperature compensation makes it ideal for sequential monitoring of ultra-pure water used in manufacturing processes in the semiconductor field, and many other fields, including the areas of electrical goods, foods and medicines. The measurement range is from 0 to 100.0 MΩ・cm.
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Machine Vision Systems
BCO uses National Instruments hardware and software tools for image acquisition and processing to address applications such as quality and process control, automated testing for semiconductor, automotive and electronics, intelligent monitoring, and medical imaging.
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Metrology System
Echo
The Echo system is a comprehensive in-line metal film metrology tool for single and multi-layer metal film measurements in leading-edge logic, memory, advanced packaging, and specialty semiconductor devices.
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Sheet Resistance Measurement
The Filmetrics® R54-series and R50-series sheet resistance measurement instruments have been developed based on over 45 years of KLA sheet resistance measurement innovation. The R50 measures metal layer thickness, sheet resistance and sheet conductance. The R54-series adds a light-tight enclosure, along with 300mm support, to provide metal thickness measurement solutions for semiconductor and compound semiconductor manufacturing.
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Ultrasonic Transducers
Sonix S-series ultrasonic NDT transducers are designed in-house to meet the demanding nondestructive testing requirements of semiconductor manufacturing. We offer the collaborative expertise to help customers choose the best ultrasonic NDT transducer for their application, based on three primary considerations.
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Semiconductor Test Software Solutions
The test engineering staff at Test Spectrum has developed hundreds of test software projects on all major ATE platforms for numerous product technologies.Whether you need to optimize a current test platform, convert to a lower cost test platform, or design a brand new program for a cutting edge product within incredible time constraints, the Test Spectrum team will exceed your program expectations with quality products and excellent results.
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0.1 Micron Portable Particle Counter
3950
This revolutionary 0.1-0.3 micron 2-channel semiconductor particle counter comes in one of the lightest form-factors available today; clocking in at only 7.5lbs (3.4kg). It is designed for high-end contamination control environments, such as semiconductor manufacturing facilities and cleanrooms, and can be used for standalone operation or integrated into an existing monitoring system to accommodate a vast array of applications.
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Reticle Manufacturing
An error-free reticle (also known as a photomask or mask) represents a critical element in achieving high semiconductor device yields, since reticle defects or pattern placement errors can be replicated in many die on production wafers. Reticles are built upon blanks: substrates of quartz deposited with absorber films. KLA’s portfolio of reticle inspection, metrology and data analytics systems help blank, reticle and IC manufacturers identify reticle defects and pattern placement errors, thereby reducing yield risk.
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Auto Macro Wafer Defect Inspection
EagleView
EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
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Semiconductor Technology, Micro Scriber + Meters For Contact Angle And Surface Tension
SURFTENS WH 300
Optik Elektronik Gerätetechnik GmbH
The leading equipment for professional use in 200 and 300 mm wafer processing in semiconductor technology. SURFTENS WH 300 is equipped with a 3 axis wafer robot, wafer scanner, loadport for 200 and/or 300 mm wafers, fan filter unit, notching system. Suitable for any cleanroom class it features the automatic mapping of contact angles on wafers for up to 25 wafers.New: with SECS/GEM Interface!
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Analytical Probe Station with Laser Cutting System
LCS- 4000 Series
The LCS-4000 Probe Station with Integrated Laser Cutting System gives the user maximum flexibility in semiconductor diagnostic cutting, failure analysis, trimming, marking and topside layer removal. All of these functions can be performed on a microscopic level, all on this one system which provides a high level of performance that is remarkably easy to use.
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Vacuum Handling Systems
RECIF Technologies history started in 1982 offering its first wafer handling solution: Vacuum handling Systems.Based on this historical technical mastery, Recif Technologies provides today a full range of single wafer manual vacuum handling solutions adapted to our customers’ and current Semiconductor industry’s’ requirements.
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Low-leakage Switch Matrix Family
Conducting all the parametric measurements necessary for the numerous test structures on a semiconductor wafer can be a time-consuming and expensive process. With the cost of end-user devices continuing to drop, even laboratory characterization environments must reduce the cost of test. Until now engineers and scientists working on current and future semiconductor process technologies were faced with a difficult choice: either use a semiconductor parameter analyzer with positioners on a wafer prober, which limits the ability to perform automated test, or use a switching matrix and probe card, which reduced the analyzer's measurement resolution. Utilizing a switching matrix with a semi-automatic or fully-automatic wafer prober enables characterization tests to be automated, eliminating the need to have an operator manually reposition the probes each time a new module needs to be tested. This reduces both test time and cost. Due to the many price/performance points available, Keysight's switching matrix solutions provide the flexibility to choose exactly what your testing needs require, without overspending.
