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SPI
assures volume and area of paste application.
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SPI Isolators
SPI (Serial peripheral interface) is one of the most widely used interfaces between microcontrollers and peripheral ICs such as sensors, ADCs, DACs, shift registers, SRAM, and others. Analog Devices has your isolated SPI bus covered with our dedicated SPI digital isolators which support this synchronous, full duplex master-slave-based interface. Options include devices built with ADI's proven iCoupler® technology and offering a small footprint, simple design-in, fast speeds, and high data integrity, as well as integrated µModules which require no external components. Our SPI isolator solutions increase performance and reduce board space. This simple, compact solution is ideal for isolated SPI data requiring communication across different ground potentials or through large common mode transients often found in Industrial PLCs (programmable logic controllers) and Instrumentation and data acquisition systems.
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SOM Module
TEO820-ZU2CG
Sundance Multiprocessor Technology Ltd.
Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784EZU2, 784 Pin Packages4 x 5 cm form factorRugged for shock and high vibration2 x 512 MByte 32-Bit width DDR4 SDRAM2 x 32 MByte (2 x 256 MBit) SPI Boot Flash dual parallel4 GByte eMMC Memory (up to 64 GByte)B2B Connectors: 2 x 100 Pin and 1 x 60 Pin
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SparkFun MicroMod GNSS Carrier Board (ZED-F9P)
With GNSS you are able to know where you are, where you're going, and how to get there anywhere on Earth within 30 seconds. This means the higher the accuracy the better! GNSS Real Time Kinematics (RTK) has mastered dialing in the accuracy of their GNSS modules to just millimeters, and that's why we had to put it on this board! With the flexibility of the MicroMod's M.2 connector, you can easily test and swap out different MicroMod processor boards for your application. Simply match up the key on your board's beveled edge connector to the key on the M.2 connector and secure the boards with a screw. This means solderless access to the ZED-F9P modules features via UART1, UART2, SPI, and I2C ports!
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MIPI I3C Sensor Controller
I3C
The main purpose of MIPI I3C is to standardize sensor communication, reduce the number of physical pins used in sensor system integration and support low-power, high-speed and other critical features supported by I2C and SPI.
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Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, SPI, I2C, 2 LANs And DIO (2-in/1-out)
IFB125
The IFB125 is powered by the low-power Freescale i.MX6UL processor in the ARM® Cortex™-A7 micro architecture. It supports extended operating temperature ranging from -40°C to 70°C, and can withstand vibration up to 5G. Its flexible wide voltage range 9V - 48V DC power input with a lockable terminal block type connector also enhances its reliability in harsh environments. To meet most of Industrial IoT needs, the IFB125 supports multiple communication interfaces for maximum flexibility, including LAN, serial, USB, and digital I/O ports. The Industrial IoT gateway has 256MB onboard memory that features data transfer rates of DDR3-1600, as well as 4GB eMMC flash memory onboard for storage. This embedded IoT gateway platform is equipped with one PCI Express Mini Card slot and one SIM card slot. Additionally, it supports DB9 connectors with both SPI and I2C function as communication protocols to suit for specific applications
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AOI & SPI, Test Systems
SigmaX SPI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The SigmaXs inspection technology is unaffected by varying materials, surface conditions, or colors. The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
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USB-8451, 250 kHz I2C, 12 MHz SPI I2C/SPI Interface Device
779553-01
The NI USB‑8451 is a master interface for connecting to and communicating with inter-integrated circuit (I2C), System Management Bus (SMBus), and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8451 is a portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices or toggling LEDs. The USB‑8451 can be physically located more closely to I2C/SPI devices than PCI interfaces, reducing I2C bus length and minimizing noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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Ultra-Low Power Computing Module
CM22303
LinkedHope Intelligent Technologies Co.,Ltd.
CM22303 uses Intel® 7th generation Kaby Lake-Y platform and Core M Ultra low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.6 GHz and the display output resolution can be up to 4K. CM22303 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. SPI BIOS is designed on board to support dual-channel low voltage on board memory (up to 16GB), Gigabit Ethernet, TPM module and other functions. With high-performance and low power consumption, it can be widely used in the field of low power embedded systems. Meanwhile, CM22303 adopts COM Express standard and is compatible with Type10 pin out definition, and also provides rich peripheral interfaces such as USB3.0/2.0, PCIe, SATA, HD Audio etc.
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Embedded Serial Triggering and Analysis for InfiniiVision DSOX1000 Series Oscilloscopes
DSOX1EMBD
The IC, SPI, and UART/RS-232 serial decode option for InfiniiVision 1000 X-Series oscilloscopes (DSO models) displays responsive, time-aligned, on-screen decode of Inter-Integrated Circuit (IC), 3-wire Serial Peripheral Interface (SPI), and UART/RS232 serial communication buses. Because it is hardware-based, this option provides the fastest throughput solution for triggering on and analyzing IC, SPI and UART/RS-232 serial buses found in a wide variety of embedded designs.
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3D SPI Series
MS-15
- Exclusive 15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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USB/RS232/SPI Programmable Attenuator
RUDAT-13G-90
Mini-Circuits’ RUDAT-13G-90 is a general purpose programmable RF attenuator supporting frequencies from 10 to 13000 MHz with attenuation from 0 to 90 dB in 0.5 dB steps. Its unique design maintains linear attenuation change per dB, even at the highest attenuation and frequency settings. The attenuator is controlled via USB, RS232 or SPI. It comes housed in a compact, shielded metal case with SMA(F) input/ output RF ports (RF ports are interchangeable), a USB type Mini-B socket, and a 9-pin D-sub(F) RS232 and SPI port. Power can be supplied via either USB or the D-sub port. The RUDAT-13G-90 is supplied with our easy-to-install, user-friendly GUI software, API objects for Windows® environments, and complete programming instructions for 32 and 64 bit Windows® and Linux® operating systems. See p. 9 for a complete list of included accessories.
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Bi-Directional Level Translator
IFB-10001
Easily connect Arduino or other 5V microcontrollers to ~3.3V sensors. Based on the TI TXB0108 auto-sensing, bi-directional level translator, this module provides access to all 8 channels of the TXB0108 and has a built-in 300mA LDO with 200mV max dropout voltage at full load. Regulated 3.3V output allows this single board to both interface withandpower 3.3V sensors. An important feature of this module is the ability to operate SPI and other digital lines (not including I2C) at high-speed, whereas the 'NXP level shifter' maxes out at 400kHz and resistor dividers fail much earlier. The TXB0108, integrated with the LP3981 LDO, provide a fast, reliable solution to mismatched interface voltages that exceeds the performance of other solutions.
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Multipurpose Debug Board
DB40-HPC Debug Module
The DB40-HPC Debug Card is designed for debugging of COM-HPC modules with FFC (FlexFoil Cable) debug connector. It includes an 80 port for Power on and Self-test (POST) via I2C interface, interface to SPI Flash for BIOS update, interface to EC for Embedded Controller (EC) update, Power and Reset buttons, and Status LEDs and Test Point for various debug tests.
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Digital Temperature Sensors
Analog Devices offers a broad selection of digital temperature sensors with I2C, SPI, and mark space interfaces. For more intricate system design applications, some of these sensors have integrated D/A converters, A/D converters, references, and limit alarm register. All of these sensors possess a broad range of uses, including scientific, medical, and aerospace applications, in test and measurement equipment, and in industrial automation.
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3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
Saki's 3D SPI identifies critical defects and assists with process improvement.
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ARINC 429 Card
SET-1623
The SET 1623 ARINC Card has 32 Tx/Rx Channels. These 32 Tx/Rx channels are structured in 4 banks (P0.x to P3.x) 8 channels each. Each bank is controlled by a dedicated SPI (SPI0 to SPI3) located on RTI.
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SPI Flammability Tester (Vinyl Material)
TF318
TESTEX Testing Equipment Systems Ltd.
SPI Flammability Tester (Vinyl Material), to determine the ignition properties of vinyl plastic film material according to CFR 16 Part 1611 U.S.A. Flammable Fabrics Act for flammability of apparel vinyl plastic film.The rate of burning shall not exceed 1.2 in./s as judged by the average of five determinations lengthwise and five determinations transverse to the direction of processing, when specimen is placed at an angle of 45 degree and expose to the standardized flame (22# fire nozzle, 1/2 inch. In length).
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Process Improvement Software for SPI & AOI
SIGMA Link
SIGMA Link software suite links altogether solder paste inspection (SPI), automated optical inspection (AOI) and manufacturing execution system (MES). For Smart Factories, SIGMA Link is the essential element to connect inspection machines to Manufacturing Execution System. This real-time interface ensures full traceability and enables interlocking of machines to automate SMT lines while driving yield to new levels.
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Arduino CAN Shield
IFB-10003-IWP
CAN (Controller Area Network) communication has become ubiquitous in industry. It is used in automotive applications (part of OBD and many other datalinks), on-highway trucks (J1939), industrial machinery and instrumentation, and equipment applications (factory automation). This shield is designed to provide a CAN 2.0 front-end interface for 5V Arduino modules (Uno, Mega, etc). The module uses SPI to communicate to the Arduino, and requires an aditional chip select pin. An optional interrupt line to the MCP2515 and two LEDS are also provided. The chip select and interupt lines are selected via zero ohm resistors and have several configuration options for flexibility stacking additional shields. A set of stackable headers is included with this board, not installed. An optional on-board voltage regulator may be used to supply 7.5V to the Arduino's 'Vin' pin (which is regulated to 5V by the Arduino's on-board LDO). The CAN shield regulator supports a wide input range of 9V to 32V. This makes it possible to cleanly build a stand-alone CAN node (remote sensor) without the need for a separate Arduino power supply!
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Linux-based Development Platform For The GridARM™ ΜController
PEAK gridARM Evaluation Board
The ARM7 microcontroller gridARM™ was developed by Grid Connect® as a system on a chip solution (SoC) for the implementation of embedded applications with a focus on industrial communication. The Evaluation Board PEAK-gridARM is a Linux-based development platform for the gridARM™ microcontroller. It has connections for Gigabit Ethernet, high-speed CAN, USB 2.0, RS-232, SPI and I²C. The digital and analog inputs of the evaluation board can be manipulated with buttons and potentiometers. The states of the microcontroller, the supply and the message traffic are displayed via LEDs. A board support package for Linux enables access to the hardware resources of the PEAK-gridARM evaluation board.
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Channelized Up-Converter
UPCV Series 5” x 2.5” x 0.6”
*Connectorized Package *Wide Choice of Frequency Ranges *IF to Ka-Band Solutions Available *Integrated Filters *Gain Control *USA, RS232 or SPI Control *Internal / External References *Low Power Consumption *Low Phase Noise *Low Spurs
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Interface Adapter
U2C-12
Dimax U2C-12, all-in-one USB-I2C, USB-SPI and USB-GPIO Bridge device, converts PC USB transactions to the I2C Master, SPI Master transactions and GPIO functions. U2C-12 turns your PC running Windows, Linux or MacOS into comprehensive I2C/SPI Bus master.
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SparkFun MicroSD Transflash Breakout
Breakout board for the microSD socket that is not much bigger than your fingernail. Compatible with the SPI interface found on any SD card, this tiny form factor was created for cell phone storage and is perfect for your next MP3 project! Board comes fully assembled and tested.
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VVDI Programmer
MC9S08 series secured and unsecured , MC68 HC series (9) 12 secured and unsecured, MC9S12 series secured and unsecuredV850 series, H8X series, R8C series, R5F series, PCF79XX, EEPROM SPI, I2C, & mu WIRE, PIC 12F, 16F, 18F, Infineon TRICORE, Infineon XC2xxxx, Infineon XC164CS, ST10F series, ST7 series, STM8 series, ATMEL- Atmega 8, 48, 16, 32, 64, 128, 256, MPC560 series, SPC560 series, Fujitsu MB91F
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SPI | AOI | AXI
Suitable for a wide variety of SMT applications, Omron’s automated inspection solutions are designed to ensure the highest degree of quality and consistency in PCB production.
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Dual Band Block Up-Converter
DBUC Series
*Connectorized Package *Wide Choice of Frequency Ranges *Dual Band *Integrated Filters *Gain Control *CAN, RS-232, I2C, or SPI Control *Internal / External References *Low Power Consumption *Low Phase Noise *Low Spurs
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
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72 channel FPGA Logic Module
XLM72
XLM72 is a FPGA based logic module with 72 I/O ports. Featuring two 64 Mbit SPI (Serial Peripheral Interface) memories, from one of which its FPGA boots upon power-up, complex logic operations can be programmed and saved on-board.
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I²C/SPI Interface Device
The I²C/SPI Interface Device is a master or slave interface for inter-integrated circuit (I²C), or master interface for serial parallel interface (SPI) devices. With plug-and-play USB connectivity, the I²C/SPI Interface Device is a portable solution to communicate with consumer electronics and integrated circuits. The I²C/SPI Interface Device can be physically located more closely to I²C/SPI devices than PCI interfaces, reducing I²C bus length and minimizing noise problems. The I²C/SPI Interface Device supports I²C rates up to 250 kHz and SPI rates up to 50 MHz, and it also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I²C devices or toggling LEDs.
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ARM 9 System on Module
MS 1515
- Processor: LPC3250 processor with ARM 9 core running at 266 MHz SDRAM- Memory: DDR2 256 MB (scalable to 512 MB)- Flash Memory: NAND flash 512 MB- Display & Graphics: Programmable color LCD controller supports up to a TFT interface- Touch screen: Integrated touch screen controller- Network Support: 10/100 Base-T Ethernet PHY- PC Interface: One USB 2.0 high-speed On-the-Go interface- Serial Interfaces: Up to four external UARTs- + CAN 2.0B controller- + Three I2C ports- + Three SPI ports- GPIO: Programmable I/O depending on peripheral requirements- Mechanical: 60 mm wide x 60 mm long x 5.4 mm high
