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Memory Test Systems
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Memory Test Systems
T5503HS2
Semiconductor memories are in high demand to meet the needs of fast-growing end markets such as portable electronics and servers. It has been forecasted that applications ranging from mobile devices and data centers to automobiles, gaming systems and graphics cards will consume an estimated 120 billion gigabits of DRAM capacity. To meet this market demand, new generations of memories with data-transfer speeds of 6.4 Gbps and higher are being developed. Advantest’s second-generation T5503HS2 tester is designed to handle these ultra-high-speed memory ICs.
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Memory Test Systems
ICs that record and retain data are called memory devices. Our memory test systems are optimized for volume production of memory semiconductors, a market where low-mix high-volume production is the norm, and feature industry-best parallelism (the ability to test a large number of semiconductors at the same time).
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Memory Test System
T5830/T5830ES
Highly flexible tester which has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories
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Flash Memory Test System
T5830
T5830 memory tester, the latest member of its T5800 product family, optimized for testing a wide range of flash memory devices used in mobile electronic devices. The highly flexible T5830 tester has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories.
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Memory Test System
T5230
T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST). The system can perform on-wafer test of 1,024 memory devices per test head in parallel, delivering high productivity and enabling floor space savings of up to 86%. Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell. The test cells can be stored in a general multi-wafer prober while minimizing the test cell floor space, and the tester can be docked with probers in both linear and multi-stack configurations. For functional tests at a maximum test rate of 125MHz/250Mbps, the T5230 assures high timing accuracy, repeatability, and failure detection capability.
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Memory Test System
T5835
The new T5835 has full testing functionality, from package testing to high-speed wafer testing, for any memory ICs with operating speeds up to 5.4 Gbps, including all next-generation memories from NAND flash devices to DDR-DRAM and LPDDR-DRAM. It can handle 768 devices simultaneously for final package-level testing. It additionally features functions such as an enhanced programmable power supply (PPS) for advanced mobile memories, and a real-time DQS vs. DQ function to improve yield.
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Memory Burn-In Test
The N3500 is Neosem Technology’s fourth generation memory test system. Specifically designed for Flash Components and Flash Cards, the N3500 tester-on-a-board architecture targets the broadest range of DUT technologies in various form factors and packages. Each Tester Board (or “Blade”) contains 288 I/O pins and 32 DPS supplies.
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Memory Test System
T5511
Offering Multi-functionality and Industry's Top Test Speed of 8Gbps.
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Memory Test System
T5833/T5833ES
T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wide array of memory devices is an obstacle for chipmakers, which urgently require solutions that can deliver high functionality, high performance and low cost of test (COT). Advantest's new, multifunctional T5833 memory test system meets these needs, delivering both wafer sort and final test capabilities for a full range of memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-generation non-volatile memory ICs.
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Memory Test System
T5801
Capable of Testing Ultra-High-Speed DRAM Devices, Supporting Next-Generation GDDR7, LPDDR6, and DDR6 Technologies
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Memory Test System
T5851/T5851ES
The T5851 system is designed to provide a cost-effective test solution for evaluating high-speed protocol NAND flash memories including UFS3.0 universal flash storage and PCIe Gen 4 NVMe solid-state drives (SSD), both of which are expected to be in high demand for the LTE 5G communications market.
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Memory Test System
T5221
The T5521 is a memory test system that supports wafer test and wafer burn-in test of non-volatile memory devices such as NAND flash, housed within a multi-wafer prober to reduce test floor footprint.
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Mixed Signal Battery Test System
The Mixed-Signal Battery-Test System is an automated test platform designed to meet today’s advanced battery test requirements. The platform is ideal for testing a range of battery cells and packs, and can be used in applications such as research and design, quality control, and end-of-line manufacturing. Its distributed architecture provides a scalable solution with configurable system components to accommodate specific applications.
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Custom Test System Solutions
No time to think about test? One-size-fits-all testers not ideal? Existing solution no longer fits your needs? Then count on integrated test solutions from Astronics. We’ll assist you with your test strategy and your test system, setting you on the path to market at a pace and ROI that ensures your program success.
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VLSI Test System
3380
The 3380 VSLI test system equipped with a maximum of 1280 I/O channels, 256 VI sources, flexable architecture and comprehensive optional function boards (ADDA/Hi-voltage DPS) can meet the high parallel multi-test tendency.
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NI Semiconductor Test Systems
The STS delivers the openness and flexibility of the NI PXI platform to the semiconductor production environment. For easy integration into the production test cell, the STS comes with features such as handler/prober integration, spring probe device under test interfacing, STDF data reporting, and system calibration.
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PXI Test System Dev, Debug & Monitor Software
InstrumentStudio
InstrumentStudio is free application software that provides an integrated approach to interactive PXI measurements. InstrumentStudio helps you to unify your display, export instrument configurations to code, and monitor and debug your automated test system. You can view data on unified displays with large, high-resolution monitors, and then capture multi-instrument screenshots and measurement results.
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Photodiode Burn-in Reliability Test System
58606
The Chroma 58606 PD/APD Burn-in system is a high density, multifunction and temperature controlled module based system for photo diode burn-in and lifetime test. Each module has up to 256 Source Measurement Unit channels which can source current and measure voltage in various scenarios such as one described below. The system can accommodate 7 modules for a total of 1,792 device channels.
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VLSI Test System
3380D
The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (256 I/O pins to test 256 ICs in parallel) that can meet the upcoming higher IC testing demands.
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Regenerative Battery Pack Test System
17020E
Charge/discharge modes (CC, CV, CP)Power Range: 10kW / 20kW per channelVoltage Range: 60V/ 100VCurrent Range: 100A/200A/300A/400A/ 500A/600A/700A/800A per channelRegenerative battery energy discharge, efficiency 85%Channels paralleled for higher currentsDriving cycle simulationFast current conversion without current interruptHigh precision measurementSmooth current without over shootTest data analysis functionData recovery protection (after power failure)Independent protection of multi-channel
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In-Circuit Test System Calibrations
Regular calibration is essential to ensure accuracy and reliability in testing. Forwessun offers precise calibration services tailored to your test systems, verifying that all components meet industry standards. Our calibration services maintain peak accuracy and compliance, so you can be confident in your system’s performance for any testing application. Choose from one-off calibrations or scheduled service contracts to meet your needs.- HP3070 - Agilent- Keysight - GenRad- Teradyne
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OLED Lifetime Test System
58131
The 58131 Lifetime Test System is designed specifically for the OLED industry. Model 58131 provides twoquadrant constant current (CC) and constant voltage (CV) stimulus to each OLED panel and acquires electrical and optical characteristics automatically. Two independent and isolated precision source-and-measure units (PMU) are incorporated in one modular card, which is capable of testing two OLED panels. Additional instrument cards are added to expand test capacity. Hot plug and play is a key feature of 58131. When a UUT fails or an instrument card needs to be replaced, 58131 does not have to be shutdown and testing continues for other UUTs. Hot plug and play obviates life test cycle restarts due to isolated faults and significantly improves life test efficiency. We firmly believe that hot plug and play capability should be mandatory for all lifetime test systems.
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Regenerative Battery Pack Test System
17040
Conforms to international standards for battery testing: IEC, ISO, UL, and GB/T, etc.Regenerative battery energy discharge (Eff. >90%, PF >0.95, I_THD <5%)Multiple voltage and current ranges for auto ranging function to provide optimum resolutionHigh accuracy current/voltage measurement (0.05%FS/0.02%FS)2ms current slew rate (-90% ~ 90%)Dynamic (current/power) driving profile simulation tests for NEDC, FUDS, HPPCTest channel parallel functionTest data analysis functionData recovery protection (after power failure)Automatic protection for error conditionBattery simulator (option)High power testing equipment- Voltage range : 80~1000V - Current range : 0~750A - Power range : 0~300kWCustomized integration functions- Integrated temperature chamber - BMS data analysis - Multi-channel voltage/temperature recording
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Advanced SoC Test System
3680
The Chroma 3680 is an advanced SoC test system with data rate up to 1Gbps. The Chroma 3680 is capable of conducting parallel tests on multiple chips to meet the digital and analog IC testing requirements, with applications including MCU, digital audio, digital TV, set-top box, DSP, network processor, field programmable gate array (FPGA) and consumer electronics.
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Battery Management (BMS) Environmental Test System
The BMS Environmental Test System is a configurable platform simulating the essential signals used by Battery Management Systems (BMS) and cell-monitoring modules with the ability to perform environmental testing on multiple BMS units simultaneously. The system implements single-point value testing to evaluate specific BMS functions such as cell over and under voltage scenarios, cell leakage current, lost communications, or faulty system IO.
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Advanced SoC/Analog Test System
3650
Chroma 3650 is an SoC tester with high throughput and high parallel test capabilities to provide the most cost-effective solution for fabless, IDM and testing houses.
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Automatic Test System
Automatic Test system is the ultimate solution for power electronic testing. The system includes a wide range of hardware choice such as AC/DC Sources, Electronic Loads, DMM, Oscillate Scope, Noise Analyzer and Short /OVP Tester. This flexibility combined with its open architecture software platform-PowerPro III, gives users a flexible, powerful and cost effective test system for almost all types of power supply testing.
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Test System Replication/Build-to-Print
Need to manufacture test stations? For more than 15 years we have sourced, assembled, tested and shipped fleets of robust, cost-effective solutions. We produce them at our high-volume facilities and deploy them around the world.
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Benchtop Communication Test System
ATS3000A
The ATS3000A is designed using Astronics Test Systems’ proven Synthetic Instrumentation architecture. Featuring 23 instruments, and both Automated and Standalone modes to test, record, and diagnose faults, the unit provides complete RF, Analog and Digital capabilities. The ATS3000A also includes the sophisticated IF and baseband I/Q Digital Signal Processing required for modern radios. The fieldupgradeable, software-defined architecture features easy-touse graphical user interfaces and enables testing with minimal operator intervention. Test Program Sets areavailable for a full range of tactical radios, or you can create new TPSs easily using the included TestEZ® software suite.
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Mezzanine System
5658
ECM P/N 5658 provides eight channels of 16 bit current measurement in the 0 to 25 milli-amp range. Each channel allows independent common mode voltages from -100 volts to +100 volts. Current detection is accomplished with a precision 100 ohm current sense resistor, creating a voltage drop of 2V in the current loop at 20 milli-amps.
