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COM Express Type 6 Compact Module With Intel® Atom® X5 And X7 Processor
CEM312
The CEM312 supports Intel® Atom® x5 and x7 processors in a board size of 95 x 95 mm. It has two 204-pin DDR3L-1600 SO-DIMMs with up to 8GB of system memory and an optional eMMC for a maximum of 64GB memory. The COM Express Type 6 module is integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for immersive graphics and media performance with a resolution up to 4K. Moreover, the industrial grade system on module can operate under wide temperature ranging from -40 to 85°C (-40°F to 185°F). The Intel® Atom®-based computer module also offers diverse comprehensive I/O interfaces to meet requirements for a variety of industrial applications. The CEM312 can serve as an excellent solution for graphics-intensive, industrial IoT applications such as industrial control, medical imaging, digital signage, gaming, military, and networking.
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SD Host Tester / SD / EMMC Analyzer / SD Card Tester
SGDK350A (SD card / eMMC tester)
This product is compatible with SD Memory Card Physical Layer Specification Version 3.01. Supports UHS-I interfaces (SDR12,25,50,104,DDR50). There is a SpeedClass measurement mode that measures SpeedClass that supports SDXC, and a simple performance measurement mode that performs sequential / random access to any address. In addition, the SD card access library (for Visual Studio) is open to the public, and any command can be executed on the SD card in any pattern.
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Pico-ITX
RSB-3410
*NXP ARM Cortex-A9 i.MX6 Dual Lite 1 GHz high performance processor*Onboard DDR3 1 GB, 4 GB eMMC Flash*Supports OpenGL ES 2.0 and OpenVG 1.1 hardware accelerators, full HD 1080p video codecHDMI 1920x1080*Single Channel 18/24 bit LVDS*Dual mini-PCIe for WIFI/3G support*1 USB 2.0, 1 USB OTG client*Multiple OS support in Linux/Android
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Digital Signage Player With Intel® Pentium® Processor N4200 & Celeron® Processor N3350, DisplayPort++, HDMI, 2 GbE LAN And 4 USB
DSP300-318
The DSP300-318 is powered by the onboard Intel® Pentium® processor N4200 and Celeron® processor N3350 (code name: Apollo Lake). It can deliver dazzling visual images and video advertising in 4K resolution. Measuring only 20 mm in thickness, the ultra slim DSP300-318 is sleek enough to fit in a small area behind signage displays and its fanless and cable free design enables easy installation without any environment limitation. The super slim DSP300-318 is designed to be fanless and cableless, which ensures solid reliability and easy maintenance. It supports HDMI and Dual-Mode DisplayPort (DP++) outputs with support for dual displays. The system also has one M.2 Key E 2230 for Wi-Fi and Bluetooth modules, one M.2 Key B 3042 for 4G LTE and one SIM card slots for 3.5G radio connectivity. Additionally, one M.2 Key M 2280 and one optional 64GB eMMC 5.0 are available for storage. The Intel® Apollo Lake-based DSP300-318 offers a cost-effective, compact yet powerful computing platform that allows plenty of digital signage solutions for advertising, brand promotion and digital menu board applications.
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SD Card
SD Card v.3.0 / eMMC v.4.51 IP Family
Designed for embedded applications that require high performance, small form factor, and high storage capacity, eMMC provides the support for embedded mass storage memory on embedded host systems. The eMMC protocol simplifies the access to NAND flash memories (such as MLC) to the host by hiding the functional differences among suppliers. Compliant to the latest JEDEC eMMC specifications, Arasan’s eMMC IP supports power-on-booting without the upper level software driver. The explicit sleep mode allows the host to instruct the controller to directly enter the sleep mode. The interface supports interface voltage of either 1.8V or 3.3V.
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SMARC® 2.1 Short Size Module With Intel® Core™ I3 Processors, Intel® Processors N Series And Intel® 7th Gen Atom® X7000E Processors
LEC-ALN
The ADLINK LEC-ALN is a SMARC module that supports up to 8 cores Intel® Core™ i3 (i3-N305, i3-N300) Processors, Intel® Processors N Series (N97, N50) and Intel® Atom® x7000E (x7425E, x7213E, x7211E) Processors (formerly Alder Lake-N) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ALN modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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SOM Module
TEO820-ZU2CG
Sundance Multiprocessor Technology Ltd.
Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784EZU2, 784 Pin Packages4 x 5 cm form factorRugged for shock and high vibration2 x 512 MByte 32-Bit width DDR4 SDRAM2 x 32 MByte (2 x 256 MBit) SPI Boot Flash dual parallel4 GByte eMMC Memory (up to 64 GByte)B2B Connectors: 2 x 100 Pin and 1 x 60 Pin
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SMARC V1.0 SoM Evaluation Kit With Quad/DualLite 800 MHz (Industrial) SoC,1GB Memory, 4GB EMMC, Gigabit Ethernet, Audio, CAN, MIPI And PCAM
SCM120-120-EVK
*Ultra low power consumption Cortex™-A9*2 CAN 2.0B*24-bit TTL LCD*LVDS/HDMI 1080P*10/100/1000 Mbps Ethernet*Open GL ES2.0*Linux3.0.35/Android 4.3*Audio
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Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, LAN, DIO 2-in/2-out (Sink Type) And 2 PCIe Mini Card Slots
IRU131-SI
*RISC-based (i.MX 6UltraLite) processor 528 MHz*512MB DDR3 SDRAM onboard*8GB eMMC flash onboard*2 PCI Express Mini Card slots (Wi-Fi, 3G/4G or LoRa)*1 isolated COM port*1 isolated DIO 2-in/2-out (Sink Type)*Power input range of 9V to 48V DC with terminal block*Embedded Linux operating system (Yocto)*Wide operating temperature range from -40°C to +70°C*Supports OPC UA
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Robust Din-rail Fanless Embedded System With RISC-based (i.MX 6) Processor 4 COM, 2 CAN Bus And DIO
rBOX630
*Fanless design*RISC-based module (i.MX 6) processor*1 GB DDR3 SDRAM onboard*4 GB eMMC onboard*Completed industrial AP development software*Wide range DC power input (12 - 48V) with terminal block*Ready-to-run embedded Linux operating system*Wide temperature operation of -40°C ~ +70°C
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eMMC
These sockets are specifically designed for standard 153 & 169 Ball eMMC devices. Custom probing sockets also available.
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SMARC V2.0 SoM Evaluation Kit With I.MX8M Quad/Dual 1.5 GHz/1.3 GHz (Industrial) SoC, 4GB Memory, 64GB EMMC, CAN, MIPI CSI/DSI, And HDMI 2.0
SCM180-180-EVK
*Ultra-Low Power i.MX8M Dual/Quad A53 Core*Single M4 Core*HDMI 2.0a up to 4K*Dual Channel LVDS*MIPI CSI*10/100/1000 Mbps Ethernet*USB3.0, USB OTG*PCIe 2.0*CAN 2.0B*Audio
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Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, SPI, I2C, 2 LANs And DIO (2-in/1-out)
IFB125
The IFB125 is powered by the low-power Freescale i.MX6UL processor in the ARM® Cortex™-A7 micro architecture. It supports extended operating temperature ranging from -40°C to 70°C, and can withstand vibration up to 5G. Its flexible wide voltage range 9V - 48V DC power input with a lockable terminal block type connector also enhances its reliability in harsh environments. To meet most of Industrial IoT needs, the IFB125 supports multiple communication interfaces for maximum flexibility, including LAN, serial, USB, and digital I/O ports. The Industrial IoT gateway has 256MB onboard memory that features data transfer rates of DDR3-1600, as well as 4GB eMMC flash memory onboard for storage. This embedded IoT gateway platform is equipped with one PCI Express Mini Card slot and one SIM card slot. Additionally, it supports DB9 connectors with both SPI and I2C function as communication protocols to suit for specific applications
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IP Solution
eMMC 5.1
Demand for mobile content capacity and bandwidth for video, pictures and music is ever increasing. To address this demand in the next generation of smartphones, tablets, and portable devices, the eMMC 5.1 Specification from JEDEC, improves the current HS400 speeds operating at 3.2Gbps, with "command queuing" making the data transfers highly efficient by offloading the software overhead into the controller. eMMC 5.1 further improves the reliability of operation by utilizing an "enhanced strobe" at the PHY layer. The eMMC5.1 is backward compatible with the existing eMMC 4.51 and eMMC 5.0 Devices.
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Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, LAN, DIO 2-in/2-out (Source Type) And 2 PCIe Mini Card Slots
IRU131-SO
*RISC-based (i.MX 6UltraLite) processor 528 MHz*512MB DDR3 SDRAM onboard*8GB eMMC flash onboard*2 PCI Express Mini Card slots (Wi-Fi, 3G/4G or LoRa)*1 isolated COM port*1 isolated DIO 2-in/2-out (source type)*Power input range of 9V to 48V DC with terminal block*Embedded Linux operating system (Yocto)*Wide operating temperature range from -40°C to +70°C*Supports OPC UA
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EMBEDDED MMC (EMMC)
SD 3.0 / eMMC 4.51 IP Family
The eMMC Host IP is an RTL design in Verilog that implements an MMC / eMMC host controller in an ASIC or FPGA. The core includes RTL code, test scripts and a test environment for full simulation verifications. The Arasan MMC / eMMC Host IP Core has been widely used in different MMC applications by major semiconductor vendors with proven silicon.
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SMARC V1.0 SoM With IMX6 Quad/DualLite 800 MHz (Industrial) SoC, 1GB RAM, 4GB EMMC, GbE LAN, Audio, CAN, MIPI And PCAM
SCM120
*SMARC 1.0 (82 x 50 mm)*Ultra low power consumption Cortex™-A9*2 CAN 2.0B*24-bit TTL signal*LVDS/HDMI 1080P*10/100/1000 Mbps Ethernet*Linux3.0.35/Android 4.3*Audio
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SMARC V2.0 SoM With I.MX8M Quad/Dual 1.5 GHz/1.3 GHz (Industrial) SoC, 4GB RAM, 64GB EMMC, CAN, MIPI CSI/DSI And HDMI 2.0
SCM180
The SCM180 is a SMARC v2.0 system on module with a choice of quad- or dual-core Arm® Cortex®-A53 processors. The ultra low power, high performance, RISC-based module measures only 82 x 50 mm and utilizes the powerful i.MX 8M processor. Its scalability, optimized pinout schematic and low profile design offers high level of versatility to help system integrators drive their important projects forward. The SCM180 is unique among other SMARC modules of its kind because it features Trusted Platform Module (TPM) for optimum security. With a discrete, dedicated microcontroller designed to support hardware encryption and decryption, the SCM180 delivers enhanced security for an added layer of protection. It also offers a choice of operating temperature ranges and can operate reliably in harsh environments. The SCM180 is suitable for a wide range of smart, portable/mobile-integrated IoT applications including robotics, automotive, factory automation, smart agriculture, casino gaming, medical, retail, surveillance and more. With its NXP artificial intelligence core technologies-enabled capabilities, the SMARC module can be programmed to support smart automation and machine-learning application requirements.
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RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, LAN, DIO (2-in/2-out), 4 AI Channels (16-bit, 250 KS/s) And 2 PCIe Mini Card Slots
IRU152
The IRU152 is powered by the low-power NXP i.MX 6 UltraLite processer. It can withstand an extended operating temperature range of -40°C to +70°C and up to 2G of vibration for operating in harsh environments. Furthermore, it supports NI LabVIEW to allow users to design graphical user interfaces for their measurement applications quickly and efficiently. In order to provide data collection and device control, the IRU152 comes with various I/O connectors, including four analog input (AI) channels, one isolated RS-232/422/485 port, one isolated LAN and one isolated DIO (2-in/2-out). The four analog input channels have differential input configuration and overvoltage protection of 55V DC. The maximum sampling rate of IRU152 is up to 250 kS/s with a 16-bit resolution for low-speed high-resolution sensor monitoring and signal measurements. Apart from the abovementioned features, the IRU152 comes in two PCI Express Mini Card slots and one SIM card slot for Wi-Fi, 3G/4G and LoRa connections. The DIN-rail embedded system is equipped with onboard 512MB DDR3 SDRAM; besides, they have an 8GB eMMC flash memory. The extremely low power industrial IoT gateway has passed the Heavy Industrial certification and FCC part 15 to ensure the excellent quality and highly reliable performance.
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Qseven Module With Intel® Pentium® Processor N4200 & Celeron® Processor N3350
Q7M311
The Q7M311 has adopted the 14nm Intel® Pentium® N4200 and Celeron® N3350 quad-core/dual-core processors (codename: Apollo Lake). The extremely small embedded module supports 4GB (or optionally up to 8GB) DDR3L memory onboard and 32GB eMMC flash memory (optional). With a seismic design and for industrial-grade temperatures, both the CPU and the DDR3L RAM are soldered to deliver reliable and excellent computing performance. With rich features embedded in all the components built in a small form factor, the industrial-grade computer-on-module is aimed for industrial IoT applications, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.
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COM Express Type 10 Mini Module With Intel® Pentium® Processor N4200 & Celeron® Processor N3350
CEM311
The CEM311 is designed to support the Intel® Pentium® N4200 quad-core and Celeron® N3350 dual-core processors (codename: Apollo Lake). Integrated with Intel® Gen 9 graphics, the CEM311 with the support of DX12.0, OCL 2.0, OGL 4.3 delivers outstanding graphics computing, 4K resolutions and media performance. The rugged system on module supports a wide operating temperature range from -20°C to +70°C to ensure stable operation in harsh environments. The embedded platform offers onboard 4GB or 8GB of DDR3L memory and an optional eMMC flash up to 64GB. Overall, the CEM311 can be served as an excellent solution for graphics-intensive applications over the Industrial IoT, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.
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SMARC Short Size Module with NXP i.MX 6 Multicore Arm® Cortex®-A9
LEC-iMX6R2
- NXP SoC i.MX6 ARM Cortex A9 Solo, DualLite, Dual or Quad processor- Integrated 2D/3D graphics processors, 3D 1080p video processing, power management- Onboard DDR3L-1600 system memory from 512 MB to 2 GB- Supports up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s- Extreme Rugged operating temperature: -40°C to +85°C (optional)- 15 year product availability
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19” Rackmount Data Collection System
DCS-211
- Intel Atom® x5-E3930 processor- Up to 8x DI and 6x DO with two 2A relays- 3x M12 GbE, 1x RJ-45 GbE, 2x isolated RS232/422/485, 2x USB and one lockable HDMI port- Up to 3x PCI Express mini slots with one USIM card slot each- Storage: up to 64GB eMMC 5.0, 1x 2.5” SATA drive bay
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SOM Module
TEO820-ZU3EG
Sundance Multiprocessor Technology Ltd.
Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784EZU3EG (optional ZU5EV) 784 Pin Packages4 x 5 cm form factorRugged for shock and high vibration2 x 512 MByte 32-Bit width DDR4 SDRAM2 x 32 MByte (2 x 256 MBit) SPI Boot Flash dual parallel4 GByte eMMC Memory (up to 64 GByte)B2B Connectors: 2 x 100 Pin and 1 x 60 Pin
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Fanless Edge AI System With NVIDIA® JETSON™ TX2 Series SoM, 1 HDMI, 2 GbE LAN, 2 USB, 2 COM Or 2 CAN And 12 Or 24 VDC
AIE500-901-FL
The AIE500-901-FL is an advanced Artificial Intelligence embedded system for edge AI computing and deep learning applications. The high-performance embedded system employs an NVIDIA Jetson™ TX2 module which has a powerful 64-bit ARM® A57 processor; NVIDIA® Pascal™ GPU with 256 CUDA cores; and 8GB of 128-bit LPDDR4 memory. To withstand the rigors of day-to-day operation, the AIE500-901-FL has an extended operating temperature range of -30°C to +60°C and vibration of up to 3 Grms with its strong construction. This fanless Artificial Intelligence edge system is dedicated to achieving operational excellence, efficiency, reliability in smart manufacturing and intelligent edge applications. The edge computing device provides solutions as Edge AI embedded system, specifically designed for video analysis, object classification, computer vision, quality control and more. Under the ultra-compact enclosure design, the AIE500-901-FL comes with 32GB eMMC onboard and is equipped with one M.2 Key M 2280 SSD slot with PCIe and SATA signal and one Micro SD slot for massive data processing and AI applications. Besides, this reliable embedded system has one full-size PCI Express Mini Card slot and one SIM slot for 3G/4G, GPS, Wi-Fi and Bluetooth connections.
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Rugged IP67-rated Fanless Edge System With NVIDIA® Jetson™ TX2, HDMI, GbE LAN, 1-CH PoE, USB 2.0 And 100 To 240 VAC Power Input
eBOX800-900-FL
The Artificial Intelligence (AI) embedded system, eBOX800-900-FL, adopts a full IP67-rated extruded aluminum and heavy-duty steel case for dust protection and water resistance. Moreover, the AI embedded system comes with a wide operating temperature range of -30°C to 60°C (-22°F to +140°F) and a vibration endurance for up to 3Grms. The embedded system is powered by the NVIDIA Jetson™ TX2 module which has a powerful 64-bit ARM A57 processor and 256-core NVIDIA® Pascal GPU. It features M12 type I/O connectors and four N-jack waterproof antenna openings for operational stability in rugged environments. The eBOX800-900-FL is ideal for AI edge computing and deep learning applications, such as smart city, smart manufacturing, smart transportation, and much more. The eBOX800-900-FL has 8GB of LPDDR4 memory and 32GB eMMC onboard. It comes with a wide range of 100 to 240 VAC power input with 10kV surge protection. The rugged edge computer also features one M.2 SSD PCIe 2.0 x4 socket which supports high-performance NVM Express interface for extensive storage needs. Furthermore, the embedded box PC is equipped with a PoE port to support the applications that require the use of IP cameras or any PoE device, i.e., traffic flow monitoring, license plate recognition, vehicle recognition, machine vision.
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EMMC
Device driver for controlling MultimediaCard using MultimediaCard Interface (MMCIF) built-in the MCU
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Qseven V1.2 SoM Evaluation Kit With I.MX287 454 MHz (Industrial) SoC, 128MB Memory, 4GB EMMC, Gigabit Ethernet, Audio, CAN And BSP
Q7M100-100-EVK
*Ultra low power consumption ARM9*High flexibility Qseven v1.2 compliant design*5 UART*2 CAN*24-bit TTL LCD*10/100 Mbps Ethernet*Linux 2.6.35
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OSM Size-L Module With NXP® I.MX8M Plus Series
OSM-IMX8MP
The OSM-IMX8MP is an OSM R1.1 Size-L module featuring NXP® i.MX 8M Pluss series processor with 4-core Arm Cortex-A53 and M7, up to 8GB LPDDR4L memory and up to 128GB eMMC storage. With its in-SoC 2.3 TOPS NPU and Vivante GC7000UL graphics, the module is made for edge solutions needing on-device AI processing at ultra-low power.
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Fanless Embedded System With I.MX 8M Processor, COM, LAN, USB, DIO (2-in/2-out), 2 PCIe Mini Card Slots, Optional CANBus, Power Design With ACC Ignition And E-Mark Certification For Vehicle Box PC
Agent336
The Agent336 is a RISC-based fanless embedded box PC certified with E-Mark for a variety of in-vehicle applications. The Agent336 measures only 164 x 118 x 44 mm and weight about 1.0kg. The cost-efficient embedded computer can withstand harsh operating environments with a wide operating temperature range of -40°C to +70°C and power input of 9 to 36V DC. This low power yet high-quality In-vehicle box computer is powered by the NXP i.MX 8M processor with the ARM® Cortex™-A53 microarchitecture and has a 3GB onboard LPDDR4 memory. Concerning the reliability and durability, the Agent336 comes with intelligent power management for ACC on/off delay, shutdown delay and over/under voltage protection. It runs on Linux (Yocto) and Android 8.1 operating systems. This IP40-rated RISC-based embedded gateway with strict certification is definitely the top choice for in-vehicle solutions, such as devices controller, fleet management, surveillance, and gateway. The newest RISC-based Agent336 supports two RS-232/422/485 ports, one isolated DIO, one HDMI port, two USB 3.0 A-type ports, one console port, one Gigabit LAN port, one RTC battery, one reset button, and five antenna openings. One onboard 8GB eMMC and one Micro SD card socket are available for extensive storage needs. Additionally, the rugged embedded computer has high integration ability with two full-size PCI Express Mini Card slots and one SIM card, which makes it a professional embedded system for transportation applications.
