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Deposition
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High Power Microwave Plasma Source
The High Power Microwave Plasma Source can be combined with a 6kW microwave generator for a high concentration of radicals providing a high productivity manufacturing solution. The High Power Microwave Plasma source is capable of igniting in multiple process gases, over a wide operating range with performance benefits in current and emerging applications such as, high throughput photoresist removal, advanced surface cleaning and conditioning, as well as, advanced deposition applications at the atomic level.
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Particle Size Standards
Whether testing for particle size, count, or composition, it is imperative to use reliable particle suspensions to calibrate your surface scanning equipment or particle counters. A particle standard consists of a specific size range and number concentration of solid particles suspended in ultra-pure water (UPW). This suspension is dispersed into clean air or nitrogen and deposited onto wafers and reticles in specific patterns and sizes.
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PLD Systems
Pulsed Laser Deposition
Is a versatile thin film deposition technique. A pulsed laser (~20 ns pulse width) rapidly evaporates a target material forming a thin film that retains target composition. This unique ability of stoichiometeric transfer of target composition into the film was realized first by the research team led by Dr. Venkatesan at Bell Communications Research, NJ, USA, nearly 30 years ago while depositing high temperature superconducting (YBa2Cu3O7) thin films. Since then, PLD has become the preferred deposition technique where ever thin films of complex material compositions are considered. Another unique feature of PLD is its ability for rapid prototyping of materials. The energy source (pulsed laser) being outside the deposition chamber, facilitates a large dynamic range of operating pressures (10-10 Torr to 500 Torr) during material synthesis. By controlling the deposition pressure and substrate temperature and using relatively small target sizes, a variety of atomically controlled nano-structures and interfaces can be prepared with unique functionalities.
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Conductivity Electrode
As current-carrying and potential difference measuring electrodes, platinum was deposited on a quartz glass substrate. Voltage terminal distance can be varied by changing the connection pin. In-situ measurement of the metal transition produced in a conductive polymer insulator doping, 4 terminal electrode is used, where for insulator layer with low doping side 2 terminal method and for metal layer with high doping side 4 terminal method is used for the measurement. With this electrode, become possible to have measurement in 15 distances by combining the connection terminal.
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Multichamber PECVD/Etch System
IsoLok 5000
Load locked cluster toolCassette to cassette processingUp to 4 coatings can be deposited without breaking vacuumSubstrate sizes: 125 x 125mm,156 x 156mm and200mm dia. (smaller sizes can be processedusing a carrier)Typical coatings: SiOx & SiNx - doped & undoped & a- SiR&D, Pilot production and production capabilitiesRIE chambers availableFull computer controlProcess chamber is modular and interfaced with 200mm slot valve
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X-Ray Detector
XRT Detector Onyx
ONYX 1412-X is a performance-leading X-ray detector comprising a proprietary 2768 × 2376 active pixel sensor array of 50 × 50 µm pixels. This detector consists of a high-speed, low-noise, radiation-tolerant, 14 × 12 cm, 6.6M pixel CMOS image sensor, with a directly deposited high-resolution CsI scintillator on Fibre Optic Plate. The highly configurable sensor is accessed through a software interface, connected via a 10 GbE SFP+ hardware interface.
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ICP Plasma System
The AXIC IsoLok® Inductively Coupled Plasma (ICP) Load-Locked Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD) plasma processing. The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch or deposition bottom electrodes available for easy installation into the chamber unit combined with a load-lock. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma product in the market.
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Digital mammography system
AMULET
The new format FPD has a proprietary panel structure with a double layer of amorphous selenium that has high X-ray absorption properties, and was developed by combining Fujifilm''s "Device Development Technology" and "Vacuum Deposition Technology." The first layer efficiently converts X-rays into electrical signals, while the second layer employs the unique "Direct Optical Switching Technology," that captures higher resolution and lower noise image electrical signals rather than using electrical switches such as conventional TFTs. By achieving both "50µm fine pixel size (higher resolution) and low noise," the AMULET system can show microcalcifications and tumors in greater detail, both significant indicators for early diagnosis of breast cancer.
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Electrostatic Precipitator
HIGHVOLT Prüftechnik Dresden GmbH
Electrostatic precipitators are used for clean process and exhaust gases, for example, in the cement and building materials industry, in steel mills, in conventional power plants, and in waste incineration plants. The dust particles are discharged electrostatically charged by a spray electrode, deflected by a DC electric field and deposited on the electrode.
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Electron Sources
SPECS Surface Nano Analysis GmbH
To our customers in research and industry we offer a variety of sources for deposition, excitation and charge neutralization as well as analyzers and monochromators. Most of our sources originate from product lines which we have taken over from Leybold AG, Cologne, and from VSI GmbH. The X-ray monochromator Focus 500 and the UV monochromator TMM 302 are original developments by SPECS.Compliance with industry standards, a good price-performance ratio, stability, and longevity are the guidelines for our product development. We focus on standardized easy handling, user-friendliness, standardized software interfaces and safety.
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Solder Past Inspection
From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
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Multi-Element Standards
These multi-element standards consist of multi-layer thin film coatings, one on top of the other, upto a maximum of 6 elemental coatings. It is generally recommended to have coating thicknesses < 20 µg/cm2, so as to cause negligible notable matrix effects, in particular absorption of X-rays emitted in lower deposits by those covering them.
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Handheld Ultrafine Particle Size Distribution Measurement.
partector 2 Pro
Naneos Particle Solutions gmbh
The naneos partector 2 Pro version is a further development of the well-established Partector 2. The Pro version of the partector 2 can additionally switch through different deposition voltage levels and therefore scan an 8-channel size distribution of an aerosol of interest.
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Scintillation Counter
G-Explorer
Highly sensitive, reliable and innovative radiation measurement technology. Explore and discover radioactive radiation in the environment with reliable accuracy! Use the graphical data preparation to find underground mineral deposits, such as water, caves and geological disturbances, even on large areas.
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Ceramic Process Carrier Pallets
Ceramic engineering specializing in Silicon Carbide, Boron Carbide, Alumina, Zirconia and Lead Zirconate Titanate (PZT) based ceramics, composites and thin films for High Strength, high temperature, semiconductive ceramic designed for use in wafer fabrication or hybrid circuits in vapor deposite ovens. Test Electronics will precision drill and customize pallets for your circuit board. Click on the Quote tab on the left then click on the Carrier Pallets tab to get an instant quotation on your process carrier pallets.
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Pure Boron Foils
MICROMATTER™ boron foils are also produced by laser plasma ablation; however, the deposition process is much more complex and time consuming than that for diamond-like carbon. Accordingly, only thin films, mainly designed for beam stripping of heavy ions in electrostatic accelerators, are available. All films are generally delivered on glass substrates coated with a release agent.
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Duct Deposit Measuring System
The Elcometer 456 Duct Deposit Measuring System has been specifically designed to meet the requirements of the DTT (Deposit Thickness Test) in HVCA’s (Heating & Ventilation Contractor’s Association) Guide to Good Practice, for the measurement of dust and grease deposits within ventilation systems and kitchen ducts made of ferrous metals.
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Excitation Sources
SPECS Surface Nano Analysis GmbH
o our customers in research and industry we offer a variety of sources for deposition, excitation and charge neutralization as well as analyzers and monochromators. Most of our sources originate from product lines which we have taken over from Leybold AG, Cologne, and from VSI GmbH. The X-ray monochromator Focus 500 and the UV monochromator TMM 302 are original developments by SPECS.
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Lens Measurement Spectrophotometers
LINZA 150
LINZA 150 spectrophotometer is designed for broadband transmittance and reflectance measurement of lenses and lens assemblies (objectives) ensuring that only perfect lenses are approved for lens assemblies, delivered to customers or meet specs provided to your lens supplier. The instrument is perfectly suited for both routine lens measurements and sophisticated improvement of lens production technology: Fast on-axis transmittance measurement of individual convex/concave lenses. Fast on-axis transmittance measurement of lens assemblies (objectives). Unattended on-axis and off-axis reflectance measurement of individual lenses providing measurement data virtually from any area on lens surface (both convex and concave). Ideal for fine-tuning of deposition technology used to produce coatings on lenses.
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Process Particles Suspensions
Process Particles™ Suspensions are used as particle material standards. They represent real-world contaminant particles encountered in semiconductor device fabrication processing. Deposition of these particles on wafers and reticles enables characterization of the material-dependent response of a surface inspection system when accurate particle size or particle sphericity are of secondary importance. They consist of broad size distributions of irregularly shaped solid particles suspended in ultra-pure water (UPW). Each bottle contains a suspension volume of 100 mL.
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Vaporizers
Vaporizers are the backbone of gas phase processes, serving as the catalyst for converting liquids into essential gases. This transformative process is indispensable in a myriad of applications, ranging from precision thin film deposition to critical procedures like metal etching and doped epitaxial growth.
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Optical Fiber Type Hot Phosphoric Acid Concentration Monitor
CS-620F
In 3D NAND manufacturing process, dozens of layers of SiO2 and SiN are deposited, and the SiN layer is selectively removed using hot phos.In this process, the desired etching rate can be achieved by controlling the concentration and temperature of the chemical solution.Previous products have difficulty to measure high temperature chemicals, but the CS-620F is able to measure at high temperatures up to 170 C degrees.
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Oil In Water/Soil Analyzer
InfraCal 2 TRANS-SP
The InfraCal 2 TRANS-SP is recommended for measuring oil in water, TPH in soil or FOG in wastewater concentration levels using the traditional EPA methods 413.2 and 418.1 or ASTM method D7066-04 and Freon-113, hydrocarbon-free grade of perchloroethylene, AK-225, S-316 or other spectroscopic infrared transparent solvent as the extracting solvent. Since the extract is deposited into a 10 mm quartz cuvette cell with Teflon stopper, light end volatile components are retained for measurement. Accurate down to 0.1 ppm.
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Dynamic Ultra Micro Hardness Tester
DUH-210/DUH-210S
A new evaluation system for measuring the material strength of micro regions, such as semiconductors, LSI, ceramics, hard disks, vapor deposited films, and thin coating layers, not addressed by previous hardness testers. It can also be used to evaluate the hardness of plastics and rubbers. This instrument uniquely measures dynamic indentation depth, not the indentation after the test. This in turn permits measurement of very thin films and surface (treatment) layers that are impossible to measure with conventional methods. Additionally, this same method supplies the data needed to calculate elastic modulus on the test specimens.
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A Highly Versatile R&D Bell Jar Thin Film Coating System.
MODEL VES-3000
TEK-VAC's VES-3000 coater station model offers a modular concept for thin film deposition. Common PVD techniques which can be employed in this compact unit include thermal and electron beam evaporation. A 2KVA SCR controlled filament evaporation power supply is provided. Optional ion deposition and magnetron sputtering devices can be incorporated in the system.
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Chip Manufacturing
KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
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Custom Sensing And Imaging Solutions
Micro Magnetics has a proven track record of excellence in designing and developing new products and solutions based on our knowledge of magnetic devices and materials. We offer specialized solutions to meet our customers? unique needs. These solutions include single magnetic sensors, sensor arrays, custom electronics and packaging solutions, sensor processing (polishing, dicing, and lapping), and custom film and device deposition.
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Metal-Organic Compound Chemical Vapor Deposition
Model MOCVD-500-A
For Experimental growth of quality epitaxial layers III-V, II-VI compounds. Multi-Layer structures. Directly heated silicon carbide coated, high purity graphite or PBN susceptor. Low mass thermocouple probe immersed into susceptor. Broad temperature and pressure application. Highest quality materials utilized throughout.
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PICO Pµlse Contact Dispense Valves
This contact dispense valve provides many of the same benefits of the PICO Pµlse jet valve, including high-speed dispensing at up to 1000Hz continuous*. It also delivers more accurate contact dispensing with less turbulence for greater fluid deposit consistency, placement, and process control.
