Evolved Packet Core
LTE system core voice and data network.
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Product
THIN 1U Embedded PC - Intel® 13th/14th Generation Desktop Core™ I3/i5/i7
EPC-T228A
Embedded PC
Thin design with 44.2mm in height.Support Intel® 13th/14th Gen. Desktop Core i platform.Easy/ quick installation for additional peripherals.Support Wall/VESA/Rack mounting Kit.Lock type DC power jack.CE (No RED certification)Support SUSI, WISE-DeviceOn and Edge AI Suite.
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Product
Thermal Imaging Core
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Zhejiang ULIRvisionTechnology Co., LTD
Infrared thermal imaging technology is now more and more widely used in many different areas around the world, such as the security monitoring, industrial detection, the autonomous vehicle auxiliary market, iron industry and so on. Choosing the most suitable thermal imaging core is choosing half the right Infrared thermal imager. Therefore, how to choose the highly qualified infrared thermal imaging core is very important.
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Product
12-Bit, 20MS/s, 8/4-Ch AI Platform With Intel® Core™ I5/Celeron® Processor
MIC-1842
Platform
8 x Simultaneously Analog Inputs, up to 20 MS/s, 12-bit resolutionSupports digital and analog triggers32-ch TTL digital I/OOnboard FIFO memory (16 K samples)2 x RS-232 ports2 x 10/100/1000 Base-T RJ-45 LAN ports2 x USB 2.0 and 2 x USB 3.0 portsiDoor expansion supported
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Product
SMARC Short Size Module with Freescale i.MX6 Solo, DualLite, Dual or Quad Core Processor
LEC-iMX6
Computer on Module
The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
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Product
End Point IP Core
PCIe
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The highly configurable PCIe End point IP core supports x1, x2, and x4 lane with a selection of 32/64-bit data path. Depending on design requirements, a maximum of 8 VCs and 8 TCs are supported. The IP core consists of many useful features that can be included to enhance system performance and to address special design needs in different applications. The data link layer allows the configuration of infinite credits to boost the flow control efficiency. By-pass mode, cut-through mode, and store-and-forward mode are other optional items. The transport layer features include configurable ECRC generation and checking, support for up to 64 configurable outstanding non-posted requests, and configurable payload size from 128 to 4 Kbytes
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Product
Value Series Industrial ATX Motherboard For 10th Gen Intel® Core™ I9/i7/i5/i3 Processors
IMB-C46H
Motherboard
The ADLINK IMB-C46H motherboard redefines efficiency, combining robust performance with cost-effectiveness. Designed specifically for industrial environments, this motherboard is built on the reliable H420E chipset, supporting 10th Generation Intel Core processors. It offers enhanced system stability and simplified integration, making it ideal for a variety of applications from warehousing and industrial automation to smart manufacturing. With features like PCIe 4.0 for faster data transmission, DDR4 memory support for optimal cost-performance balance, and comprehensive I/O capabilities including 2.5GbE LAN for superior connectivity, the IMB-C46H is tailored to meet the diverse needs of modern industries. Dive into a new era of industrial computing with the IMB-C46H, where performance meets affordability.
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Product
Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
COM-HPC-cRLS
Computer on Module
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.
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Product
LV Iron Core Shunt Reactors
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Iron core Shunt Reactors act as an absorber of reactive power to increase energy efficiency of the power system. Shunt Reactors are used in order to compensate capacitive reactive power generated by long and lightly loaded transmission lines as well as underground cables, thus allowing the flow of more active power through the system and avoiding over voltages. Shunt Reactors can be directly connected to the power line or to a tertiary winding of a three-winding power or distribution transformer.
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Product
Air Core Test Lab Reactors
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Test Laboratory Reactors are designed for high voltage and high power test laboratories. They are designed to withstand the most extreme electrical service conditions during test periods. Design techniques are implemented in accordance with the most demanding service conditions. These reactors are used for various purposes in test laboratories such as current limiting and synthetic testing of circuit breakers, capacitor testing, artificial line simulation etc.
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Product
PCIe End Point IP Core
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The Arasan PCI Express End Point is a high-speed, high-performance, and low-power IP core that is fully compliant to the PCI Express Specification 1.1 and 2.0. The IP core is designed for applications in computing, networking, storage, servers, wireless, and consumer electronics. The feature-rich IP core is highly configurable that allows a target design to be implemented with the least number of gates and highest performance.
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MVP-6000 Series
Industrial Computer
ADLINK's newly introduced MVP-6000 Series of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor (Code name: Skylake), provides one PCIe Gen3 x16, one PCI slot, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost-effective price point.
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Product
Cavium CN63xx Packet Processor AMC
AMC730
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The AMC730 is a a 10-Gigabit Ethernet (10GbE) AdvancedMCTM(AMC) module which includes an on-board line rate multi-core packet processor based on Cavium CN63XX CPU. VadaTech offers this product in a mid size (full size optional) form factor with the AMC.1, AMC.2 and AMC.4 specifications. The AMC730 is based around the Cavium OCTEON CN63xx processor which has been specifically designed to intelligently process Ethernet packets at line rate.The processor can be loaded via the PCIe/SRIO interface or via an optional flash memory. The number of processor cores, speed grade, and amount of DDR3 memory is customizable based on customer needs. The module has 2GB of HFA for pattern matching for deep packet inspection, etc. The SDK for the processor as well as additional software stacks are available from Cavium or third party.
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Product
25Gbps Ethernet Packet Generators
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Axtrinet (AXTRINET IS A TRADING NAME )
Full wire-speed 25Gbps/10Gbps/1Gbps ports.
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Product
Intel® Core™ I3, N Series And Atom® X7000E/x7000RE Series Processor
AIMB-219
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Intel® Core™ i3, N series and Atom® x7000E/x7000RE SeriesUp to 32GB DDR4 3200MT/s SODIMMTriple independent display with 1 DP(over USB-C), 1 HDMI, 1 LVDS(or eDP)Abundant I/O expansion: 1 M.2 B-key & 1 M.2 E-key, 3 USB 3.2 Gen2x1, 5 USB 2.0, 1 USB Type-C and 6 COMTHIN Mini-ITX low profile I/O stack design, fanless thermal solutionExtend operating temperature: -20C~70°C (-4 ~ 158 °F)
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Product
11th Gen Intel® Core™ I5-Based Fanless Embedded Computer
EMP-510 Series
Box PC
- 11th Gen Intel® Core™ i5 BGA SoC processor- DDR4 SODIMM up to 64GB- FHD/4K/8K up to 4x independent displays- 2x GbE, 1x COM, 4x USB ports- M.2 2280 SSD- Wi-Fi 6/LTE compatibility
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Product
Industrial ATX Motherboard With 10th Generation Intel® Core™ I9/ I7/ I5 /i3 Processor
IMB-M46
Motherboard
The ADLINK IMB-M46 Industrial ATX Motherboard supports lines of the 10th Generation Intel® Core™ i desktop processors, an Intel® Q470E Chipset, and 5 PCIe expansion slots to provide a cost-competitive embedded computing solution.
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Product
Tilera GX72 Processor, 72 Core, Mid-size, AMC
AMC741
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The AMC741 is ideal for packet filtering, intelligent networking, multimedia, video transcoding, cloud and other applications. The device includes 72 identical processor cores (tiles) interconnected with Tilera’s iMesh™ on-chip network.
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Product
Streamlined, Fanless, Expandable Edge Computing Platform With 13th Gen Intel® Core™ Processor
MXE-310 Series
Industrial Computer
The MXE-310 is a streamlined, fanless, expandable edge computing platform powered by the 13th Gen Intel® Core™ i7/i5/i3 processors. Designed for high performance in a compact form factor, the MXE-310 supports up to 64GB of DDR5 4800MHz memory and operates efficiently within a temperature range of -20°C to 60°C. It offers extensive connectivity options, including three monitor outputs (Type-C, DisplayPort, HDMI) and up to six LAN ports, making it versatile for various industrial applications.
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Product
12/13/14th Gen Intel® Core™ Processor LGA1700 NVIDIA Quadro MXM GPU Integration
AIMB-288E B1
Motherboard
12/13/14th Gen Intel® Core™ Desktop Processors (LGA1700), with H610ESupport NVIDIA Quadro Embedded MXM GPUUp to 96GB DDR5 5600 MT/s with two SO-DIMMTriple displays with 2 DP and 1 eDP, up to 4KAbundant Expansion: 1 M.2 M-key & 1 M.2 E-key, 4 USB 3.2 Gen2x1 & 2 USB 3.2 Gen1x1, 1 SATA IIISupport Windows 10 LTSC & Ubuntu 22.04 LTS; SUSI API, and WISE-DeviceOn for quick AI deployment at scale
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Product
Core I7 Processor AMC, 10/40GbE
AMC727
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The AMC727 is a Processor AMC (PrAMC) in a single module, mid-size AdvancedMC (AMC) form factor based on the Intel® next generation CoreTM i7 Processor (Haswell) with QM87PCH.
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Product
COM Express Compact Size Type 6 Module with Up to Quadcore Intel® Core™ and Celeron® Processors
cExpress-WL
Computer on Module
ADLINK introduces its latest COM Express Type 6 modules to fulfill the needs of size, weight, and power (SWaP)-constrained edge computing applications. ADLINK’s cExpress-WL modules feature the 8th generation Intel® Core™ and Celeron® processors (formerly codenamed Whiskey Lake-U) with up to 4 cores and up to 64GB memory capacity, offering edge computing applications uncompromising performance and responsiveness despite SWaP constraints. The cExpress-WL is suited for applications such as data acquisition and analysis, image processing, and 4K video transcoding and streaming at the edge.
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Product
Industrial ATX Motherboard with 8th/9th Gen Intel® Core™ i9/i7/i5/i3 Processor
IMB-M45H
Motherboard
ADLINK IMB-M45H ATX industrial motherboard supports the 8th/9th Generation Intel Core i9/i7/i5/i3 processor in the LGA1151 package, and the Intel H310 chipset. This model supports ubiquitous high-speed data transfer interfaces PCIe Gen3, USB 3.1 Gen1 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2400/2666 MHz memory up to 64 GB in two DIMM slots.
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Product
21.5" Fanless Widescreen Panel PCwith Intel® 13th Gen Core™ I7/i5/i3 Processor
PPC-421W
Panel PC
21.5" true-flat Full HD LCD panel with projected capacitive touchscreen, anti-glare coatingIntel® Core™ i7-1365URE/i5-1345URE/i3-1315URE processor with fanless system designSupports PCIe x4 or PCI expansion1 x isolated RS-422/485 with auto flowWide input power range (9 ~ 32 VDC)Dual 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technology3 x Independent displays1 x M.2 bay (2242/2280) for storage onlySupport TPM2.0 hardware security
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Product
Core I7 Processor AMC With PinoutPlus, PCIe
AMC728C
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The AMC728C is a Processor AMC (PrAMC) in a double module, mid-size AdvancedMC (AMC) form factor based on the Intel next generation Core i7 Processor (Haswell) with QM87 PCH. The module follows AMC.1 (PCIe), AMC.2 (GbE) and AMC.3 (storage) specifications.
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Product
High-Performance 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXC-6400 Series
Industrial Computer
The Matrix MXC-6400 series is a line of high-performance fanless embedded computers, integrating 6th generation Intel® Core™ i7/i5/i3 processors and the QM170 chipset for more powerful computing and graphics performance with minimal power consumption.
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Product
Intel® Core™ / Celeron® Embedded Controller
AMAX-5580
Embedded Controller
Optimized BIOS & Embedded OS for 1ms real-time control (Windows and Linux)Achieve 64-axis motion control with 1ms EtherCAT cycle time under Windows (applies to AMAX-5580 Core i processor)OPC UA and Modbus TCP/RTU as IT connectivity enabled by CODESYSEtherCAT, PROFIT, Ethernet I/P, CANopen as OT connectivity enabled by CODESYSUnlimited I/O points, fieldbus networks, and visualization variables for CODESYS applicationsCODESYS Visualization (Target and Web), SoftMotion and CNC/Robotics support by different packageAdvantech Data Connect (ADC) Library provides flexible and highly efficient data connection with 3rd party application software through symbols (PLC Handler) & shared memory (C++/C#)Intel® Core™ i7/i5/Celeron® with 8GB/4GB DDR4 memorySystem I/O with 2 x GbE, 4 x USB 3.0, 2 x COM, 1 x HDMI, 1 x VGA, 1 x 7 pin terminal (dual power input with alarm output)
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Product
11th Gen. Intel® Core U-Series I7/i5/i3/Celeron 3.5" SBC W/ MIOe
MIO-5375
Single Board Computer
11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W/ 28WDual Channel DDR4-3200 up to 64GB4 simultaneous displays: LVDS/ eDP*, HDMI, DP, USB Type-C2 GbE, 4 USB3.1, CAN Bus, DC-in 12-24VExpansion: M.2 E-Key/B-Key/M-Key (supports NVMe) , MIOeSupports iManager, WISE-PaaS/RMM, SW API, and Edge AI Suite
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Product
Metal Cored PCB
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Teledyne Labtech is at the forefront of complex metal-cored PCB design and manufacture. The PCB use a thin metal core <2 mm, which acts as isolation between the RF/Microwave circuit and the Analogue/Digital circuitry and creates an excellent thermal path.The major advantages are reduced size and no need for complex microwave feed-thru's. The ability to laser cut pockets allows the designer engineer to mount the high power MMIC directly on to the metal core.
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Product
Multi-Sensor Core Logger
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The Geotek Multi-Sensor Core Logger (MSCL) systems enable a suite of geophysical measurements to be obtained rapidly, accurately and automatically on sediment or rock cores. The rugged nature of the equipment makes it suitable for use in either an onshore laboratory/repository environment or onboard survey and drilling vessels. All of Geotek’s core loggers accept core between 50 mm and 150 mm in diameter and up to 1.55 m in length. Geological cores and materials come in a variety of sizes therefore the MSCL and X-ray CT systems are designed for a full range of core material in a variety of liner compositions. To accommodate varying customers’ requirements (both operational and scientific), we provide a range of different core loggers and X-ray CT systems:
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Product
Diagnostic Cores
VersaCore™
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The diagnostic cores are uniquely designed in the VC20 format. Using the customizable PCB, components can be added to create a "golden core" to quickly troubleshoot your system Test SMUs, Test Motherboard, Test Pogo pins, Test Relay matrix.
