Evolved Packet Core
LTE system core voice and data network.
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Product
10Gbps Ethernet Packet Generators
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Axtrinet (AXTRINET IS A TRADING NAME )
Designed to meet the needs of testing the infrastructure behind theInternet of Things, the AxtrinetTM APG Ethernet Packet Generatorsprovides compact and affordable 40Gbps and 10Gbps/1Gbps Ethernet Packet Generator/Analysers with a simple to use Graphical User Interface and an open API for third party scripting.
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Product
Core Loss Tester
VCL
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Core loss testing has become most important test for quality assurance in Electrical industry. Core loss tester determines that whether a Core is damaged or not.
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Product
Ultra-compact, Uncooled Thermal Imaging Core
Dione S 640 CAM Series
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The Dione S 640 CAM series is based on an uncooled 12 μm pitch microbolometer detector with a 640 × 480 resolution and NETD of less than 40 mK (available upon request) and 50 mK. The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione S 640 CAM is lightweight and small with mechanical shutter. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione S 640 versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione S 640 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M24/M34 lens (optional).The ultra-compact Dione S 640 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Product
Core I7 Processor AMC, 10/40GbE
AMC727
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The AMC727 is a Processor AMC (PrAMC) in a single module, mid-size AdvancedMC (AMC) form factor based on the Intel® next generation CoreTM i7 Processor (Haswell) with QM87PCH.
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Product
2U Intel Core Series
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2U Rackmount Network Appliances with Intel® Core™ Series Family for Gateway and NGFW.
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Product
AC/DC Split Core Current Sensor CT1000S
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This AC/DC split core current sensor is designed for measuring large DC and AC currents in applications such as electric vehicles, renewable energy systems, inverters, and motors. It facilitates high-current measurements by clamping around existing current connections. With its voltage output, this sensor is compatible with power analyzers (WT series and PX8000) and waveform measurement instruments (ScopeCorders and DLM series), making it a versatile tool for various high-current measurements.
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Product
Split Core Current Transformers
LZCK-55
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Beijing GFUVE Electronics Co.,Ltd.
Outdoor waterproof current transformers are applicable for AC power system 35kV and measurement of current of power supply equipment below 10KV also can be used for microcomputer protection. This type of current transformer employs imported silicon steel which with high permeability as magnetic material, has the characteristics of Small magnetic circuit loss and can be split, its semicircular core and secondary windings employ high quality epoxy resin vacuum, casting in plastic-case(ABS or PC) which is flame retardance anti-moisture, stable performance, no maintenance.
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Product
Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
COM-HPC-cRLS
Computer on Module
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.
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Product
Intel® 8th. Gen. Core I7/i5 Processor Fanless Embedded System
EPC-C301
Embedded PC
Intel 8th. Gen. Core Processor with Quad/Dual Cores (i7/i5), TDP 15W.Semi-Industry Fanless slim systen, Din Rail or Wall mount design.HDMI + DP* (Support vai MIO) dual display.4 GbE, 4 USB3.1, 4 USB 2.0, CAN Bus, M.2 M-Key 2280 supports NVMe, M.2 E-key 2230, M.2 B-key, 1 full size of mini PCIe, DC-in 12V.-20 ~ 60 degree extend temperature operating.Supports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite.No RED certification.
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Product
23.8" Fanless Panel PC With Intel® Core™ I7/i5/i3 Processor
PPC-324W TGL
Panel PC
Industrial-grade 23.8" LCD panel with 30k backlight lifetimeTrue-flat touchscreen with multi-touch projected capacitive controlHigh-performance, fanless 11th generation Intel® Core™ i processorDual channel memory slots, max 64GCompact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external HDMI)1 x M.2 bay (2242/2280 NVME or SATA Interface) for storage and support SATA RAID 0, 11 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technology
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Product
12.1" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-312S(W) RPL
Panel PC
True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware security
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Product
3U Intel® Core™ i7-4700EQ Quad-Core Processor-Based PXI Express Controller
PXIe-3985
Controller
The ADLINK PXIe-3985 PXI Express embedded controller, based on the fourth generation Intel® Core™ i7 processor is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications.
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Product
COM Express Type 6 Basic Module With 5th Gen Intel® Core™ I7 & 4th Intel® Core™ I7/i5/i3 & Celeron® Processor And Intel® QM87
CEM880
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The CEM880 COM Express Type 6 basic module features 5th generation Intel® Core™ processor (H-processor line), one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB. With outstanding computing performance, low power consumption, wide temperature range, and seismic design, the rugged basic-size SoM (system on module) drives Internet of Things innovation and is ideal for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, digital signage, gaming machines, military, and networking.
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Product
Intel® Core™ IPC Controller
AMAX-7580 V2
Controller
Optimized BIOS & Embedded OS for 1ms real-time control (Windows and Linux)Achieve 128-axis motion control with 500 μs EtherCAT cycle time under LinuxOPC UA and Modbus TCP/RTU as IT connectivity enabled by CODESYSEtherCAT, PROFIT, Ethernet I/P, CANopen as OT connectivity enabled by CODESYSUnlimited I/O points, fieldbus networks, and visualization variables for CODESYS applicationsCODESYS Visualization (Target and Web), SoftMotion and CNC/Robotics support by different packageAdvantech Data Connect (ADC) Library provides flexible and highly efficient data connection with 3rd party application software through symbols (PLC Handler) & shared memory (C++/C#)13th Generation Intel® Core™ i7/i5 Processor with 8GB DDR5 memoryPort isolation for 8 x DI, 8 x DO, 4 x COM
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Product
Modular TPC - Computing Box Module With Intel® Core™ I3-N305 Processor
TPC-B520L
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Modular Computing Box powered by Intel® Core™ i3-N305, octo-core processorModular Front Panel modules ranging from 12.1" to 23.8" with P-CAP multi-touch in selection (12.1", 15", 15.6", 21.5" with high brightness panel option)Single DDR5 Memory slot supports up to 16GBSupport expansion via three M.2 slots (PCIe, Wifi, 5G)LAN, POE, isolated serial port and isolated digital I/O via iDoor technologySupport Type-C connector with USB 3.2, DP 1.4a, 15W power deliverySupport fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technologyPerformance, fanless embedded system with chassis grounding protection
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MVP-6000 Series
Industrial Computer
ADLINK's newly introduced MVP-6000 Series of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor (Code name: Skylake), provides one PCIe Gen3 x16, one PCI slot, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost-effective price point.
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Product
IC-3173, 2.20 GHz Intel Core i7 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784970-01
Controller
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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Product
COM Express R3.1 Type 6 Compact Size Module Based On Intel® Core™ Ultra Processors
cExpress-MTL
Computer on Module
Featuring Intel’s latest Intel® Core™ Ultra processors (formerly “Meteor Lake-U/H”), the cExpress-MTL, a COM Express® COM.0 R3.1 Type 6 Compact size module, presents Intel’s modular architecture that combines CPU+GPU+NPU all-in-one to the embedded market. It provides up to 8 GPU Xe-cores (128 EUs), an 11pTOPS/8.2eTOPS NPU, and 14 CPU cores at 28W TDP.
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Product
Cavium CN67xx Packet Processor
AMC734
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The AMC734 is a 10-Gigabit Ethernet (10GbE) AdvancedMCTM (AMC) module which includes an on-board line rate multi-core packet processor based on Cavium CN67XX CPU. VadaTech offers this product in a mid size form factor with AMC.2 specification (option full size design, see ordering options).The AMC734 is based on the Cavium OCTEON CN67xx processor which has been specifically designed to intelligently process Ethernet packets at line rate. The number of processor cores, speed grade, and amount of DDR3 memory is customizable based on customer needs.The module has an RTC on board.The SDK for the processor as well as additional software stacks are available from Cavium or third party.
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Product
6U CompactPCI 9th/8th Gen Intel® Core™ I3/i5/i7 Processor Blade
cPCI-6640 Series
Processor Blade
The ADLINK cPCI-6640 is a 6U CompactPCI® processor blade featuring an 8th/9th Gen Intel® Core™ (formerly Coffee Lake-H) with Mobile Intel® CM246 Chipset. Dual SO-DIMM slots provide up to 64GB of DDR4-2666 dual-channel memory (2x 32GB modules). ECC memory is also available when paired with a supporting CPU.
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Product
Air Core Shunt Reactors
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Shunt Reactors act as absorbers of reactive power to increase energy efficiency of the power system. Shunt Reactors are inductors that are used in order to compensate capacitive reactive power generated by long and lightly loaded transmission lines as well as underground cables, thus allowing the flow of more active power through the system and avoiding over voltages. The shunt reactors provide inductive compensation.
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Product
Modular Embedded Box PC With Intel® Core™ Ultra CPU (Series 2)
UNO-2484V3
Box PC
Intel® Core™ Ultra Processors (Series 2), including Ultra 5 225U & Ultra 7 255U (formerly Arrow Lake)Wide operating temperature: -20 ~ 60 °C; power input: 10 ~ 36 VDCUp to four display outputs (DP + HDMI + 2 x Type-C)4 x LAN, 3 x USB 3.2 Gen2, 1 x USB 2.0, 2 x Type-C4 x RS-232/422/4852 x M.2 M-key, 1 x M.2 E-key, 1 x M.2 B-keyUser-friendly design: side-extractable SIM card, easy RAM & logo replacement, reserved punch-out holes for antennasOptional DDR5 slots x2, each channel supporting up to 32GB, enabling flexible memory expansion and optimized system performance
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Product
Intel® 6th/7th Generation Core™ I3/i5/i7 Performance Embedded PC
EPC-B2205
Embedded PC
Supports Intel® 7th & 6th Gen Core™ i processor (LGA1151) with Intel Q170/H110 chipset.Two 260-pin SO-DIMM up to 32GB DDR4 2133 MHz SDRAM.Supports triple display of VGA/DP/DVI.One expansion slot (low profile).Two Shock Resistant 2.5" drive bays.Support SUSI, WISE-DeviceOn and Edge AI Suite.
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Product
18.5" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-318SW RPL
Panel PC
Industrial-grade true-flat touchscreen with IP66-rated front panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware securitySupport iDoor, PCI or PCIe
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Product
Shortwave Infrared Camera Core
Tau® SWIR
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FLIR Tau® SWIR provides outstanding short-wave infrared image quality and performance over a wide range of imaging and light level conditions. It is the ideal OEM SWIR imaging module for applications like hyperspectral instrumentation, silicon inspection, electro-optical payloads, art restoration, and portable imaging. The Tau SWIR camera incorporates the FLIR high resolution 640×512 ISC1202 Indium Gallium Arsenide (InGaAs) 15-micron pitch focal plane array (FPA) and includes several advanced camera controls features.
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Product
Micro Computer, Intel® Processor N97 And Core
AIMC-200
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Micro Computer, Intel® Processor N97 and Core™ i3-N305 Processor (SoC), 2 x HDMI, 6 x COM, 6 x USB. Supports iDoor technology with sufficient IO ports, 2 x GbE, 2 x USB3.2, 4 x USB2.0, 1 x RS232/422/485, 5 x RS485, 2 x HDMI. Compact size with fanless design, Optional 4G/GPS/GPRS/Wi-Fi communication.
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Product
9th/8th Gen. Intel® Xeon®/Core™ Processor, 3.5" SBC W/ MIOe
MIO-5393
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9th/8th Gen. Intel® Xeon®/Core™ Processor, up to 6 cores, and TDP 45W/25WDual channel DDR4-2400, up to 64GB, ECC for Xeon SKUTriple simultaneous displays with 48-bit LVDS+HDMI+DPUSB 3.1 Gen2 (10 Gbps), TPM 2.0 & NVMe/PCIe Gen3x4 SSDDual GbE, SATAIII, RS-232/422/485, CANBus, SMBus, I2CM.2 B-Key 2280/3042, (optional M-Key 2280) & M.2 E-Key 2230Supports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite
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Product
Air Core Smoothing Reactors
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Smoothing Reactors are serially connected reactors inserted in DC systems to reduce harmonic currents and transient over currents and/or current ripples in DC systems.
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Product
High-Performance 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXC-6400 Series
Industrial Computer
The Matrix MXC-6400 series is a line of high-performance fanless embedded computers, integrating 6th generation Intel® Core™ i7/i5/i3 processors and the QM170 chipset for more powerful computing and graphics performance with minimal power consumption.
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Product
Mini-ITX M/B Support 12th/13th Gen Intel® Core™ Processors, H610E, 3 X LAN For PPC-600
PPC-MB-620
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Supports Intel® 12/13th Gen Core™ i processor (LGA1700) with Intel Q670E/ H610E chipsetTwo 262-pin SO-DIMM up to 64GB DDR5 4800 MHz SDRAMSupports triple display of DP/HDMI/LVDSSupports PCIe x16 (Gen 5), 1 x M.2 M key & 1 M.2 E key, 6 USB 3.2Supports 2 x SATA 3.0 (Raid 0, 1) (only for PCH Q670E)Supports TPM 2.0Supports 4 RS-232,1 RS-232/422/485Supports 1 GPIO(8 channels)
