Image Processors
algorithmically enhances image characterization.
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Product
Particle Image Velocimetry (PIV)
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Particle Image Velocimetry (PIV) is a non-intrusive laser optical measurement technique for research and diagnostics into flow, turbulence, microfluidics, spray atomization, and combustion processes.
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Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processor, With Support For MXM GPU Module With Embedded NVIDIA RTX GPU And Thunderbolt™ 4 Port
MLB-3100 with NVIDIA MXM GPU
Industrial Computer
- ADLINK MXM graphics module support (type A/B, up to 120W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller
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Product
COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-TL
Computer on Module
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
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Product
Thermal Image Plates
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No longer are the firebricks and smoldering paper "tools of the trade" for researchers working with CO2 lasers. Now it''s possible to see IR laser beams in real time and with high resolution using a Thermal Image Plate from Macken Instruments. The characteristics of this instrument enable it to solve a wide range of problems. For example:
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Product
COM Express Type 6 Compact Module With 6th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor
CEM501
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The CEM501 COM Express Compact Type 6 module is based on the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (codename: Skylake) with support for up to 32 GB dual channel DDR4 SO-DIMM memory. Featuring improved processing and graphics performance compared to the previous generation Intel® processor, the compact-size system on module CEM501 offers intense graphics performance and multitasking capabilities, making it ideal for telecommunication, medical imaging, digital signage, gaming machines, military, and IoT related applications.
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Product
PPC8315 Processor AMC W/ 2.5” SATA Drive
AMC715
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The AMC715 is a Processor AMC (PrAMC) with an on board 2.5" SATA hard disk drive in a single-module, mid-size AdvancedMCTM (AMC) form factor based on the AMC.1, AMC.2 and the AMC.3 specifications. The module is ideal to be used for data flow management within a chassis. The AMC715 provides a low cost solution with an integrated high capacity disk. With a storage capacity of over 320 GB and data transfer rates of 150 Mbyte/s the AMC715 is the ideal AdvancedMCTM smart storage. The PCIe interface is configurable as Host or Agent mode. The module has 512 MB of DDR2 memory on board.
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Product
Configurable Processor Modules
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Cyclone FPGA based configurable processor modules for embedded control and measurement applications.
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Product
Processor AMC, Intel® Xeon E5-2648L V4, PCIe Gen3 With PinoutPlus™
AMC750
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The AMC750 is a Processor AMC (PrAMC) in a double module, full-size AdvancedMC (AMC) form factor based on the Intel® Xeon E5-2648L v4 which has 14 Cores @ 1.8 GHz. The module follows the AMC.1 and AMC.3 specifications.
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Product
Passive Imaging & Radiometers
PMMW
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A low attenuation atmospheric window from 80-110 GHz (W Band) makes this band an ideal candidate for PMMW systems. Passive imagers operate by detecting naturally emitted thermal (black body) radiation from an object. Products available up to 345 GHz.
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Product
COM Express Type 6 Compact Module With Intel® Pentium® Processor N4200 & Celeron® Processor N3350
CEM313
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The CEM313, a COM Express® Type 6 compact module, is built with the 14nm Intel® Pentium® N4200 and Celeron® N3350 quad-core/dual-core processors (codename: Apollo Lake). Integrated with Intel® Gen 9 graphics, the COM Express® type 6 module prevails in its excellent graphics performance while supporting DX12.0, OCL 2.0, OGL 4.3 with resolution up to 4K (3840 x 2160 @ 30 Hz). Furthermore, two 204-pin SO-DIMM DDR3L-1600 have been deployed in the CEM313 up to a maximum of 8 GB Overall. With the innovative design of low power consumption, wide temperature range, and seismic resistance, the CEM313 can be served as an excellent solution for graphics-intensive applications over the IIoT, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.
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Product
4D Imaging Radar Chipset Solution
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Through enhanced FMCW technology, Arbe’s chipset technology transmits and receives signals from multiple antennas. By converting information from time to frequency domains (FFT), Arbe provides a 4D image with unparalleled element density in high azimuth and elevation resolution while simultaneously sensing the environment in long range with a wide field of view in real time. Additionally, Arbe technology reduces sidelobe occurrence levels close to zero, resolving range-doppler ambiguities and avoiding interference from other radars.
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Product
Image Sensor Test System
IP750
Test System
Teradyne's IP750 series dominates the image sensor tester market with its superior performance and low cost of test. The IP750 delivers high throughput and high parallel test efficiency, broad device test coverage from CCD and CIS, analog and digital capture, and concurrent image sensor and logic testing. In addition, Teradyne's IG-XL software environment provides easy, shorter test program development and easy maintenance.
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Product
3.5" Embedded SBC With Intel® Atom® Processor E3845/E3827, LVDS/VGA/HDMI, Dual LANs, Audio And ZIO
CAPA840
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The CAPA840, a fanless 3.5-inch embedded single board computer, is based on the latest generation of Intel® Atom® processor E3845 or E3827 featuring 1.91/1.75GHz clock speed. Two DDR3L SO-DIMM slots support system memory up to 8 GB. Moreover, the fanless embedded board delivers better level of processing and graphics performance than previous generation Intel® Atom™ SBCs, while consuming less power. In addition to rich onboard I/Os, the CAPA840 adopts an ZIO connector on the rear-side that integrates PCIe x1, USB, LPC and SMbus expansion. With excellent thermal design, the 3.5” embedded board is able to run fanless and works smooth between -20°C to 70°C environments.
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2U Rackmount Network Appliance Platform With Dual LGA2011 Socket Intel® Xeon® E5-2600 V3/v4 Family Processors, Intel® C612 And Up To 42 LAN
NA850
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The NA850 offers cutting edge performance for networking applications with dual high performance 12-core Intel® Xeon® E5-2600 V3 series processors and Intel® C612 chipset, 16 high bandwidth DDR4 memory slots and two hot swappable 3.5” SATA HDD bays. For greater flexible and easy maintenance, the NA850 can be fitted with up to five Ethernet modules, supporting up to 42 Gigabit LAN ports or 20 10GbE LAN ports. Two PCIe x16 standard expansion slots are available for optional network security cards. The superior network appliance platform also supports the Intel® Data Plane Development Kit (Intel® DPDK), a set of software libraries that can improve packet processing performance by up to ten times. It could achieve over 80 Mbps on a single Intel Xeon processor and double with a dual-processor configuration. With its friendly design and high capacity, this powerful network appliance is suited for IDS/IPS, VPN, content filtering, UTM, network security applications, and cloud computing solutions.
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Product
IC-3172, 1.80 GHz Intel Core i5 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784228-01
Controller
The IC‑3172 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3172 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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Product
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
Computer on Module
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Fixed-Mount Thermal Imaging Camera for Condition Monitoring and Fire Prevention
FLIR A310 f
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FLIR A310 f thermal camera can be installed almost anywhere to monitor the condition of your critical equipment and other valuable assets. Designed to help safeguard your plant and measure temperature differences, they allow you to see problems before they become costly failures—preventing downtime and enhancing worker safety.
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COM Express Type 2 Basic Module With Intel® Celeron® Processor J1900/N2807
CEM841
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The CEM841 computer on module is based on the ultra-low power Intel® Celeron® processor J1900/N2807 which provides impressive CPU and graphics performance improvements. The CEM841 is equipped with double deck DDR3L SO-DIMM sockets supporting system memory maximum up to 8 GB. Coming with 8 PCI Express lanes, the power efficient system module is designed with all necessary components and offers the most updated bus interfaces targeting at POS and kiosk systems, gaming, medical PCs and HMI and industrial automation controllers.
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Digital Imaging
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No one camera does it all. ACCU-SCOPE offers a wide selection of cameras for a variety of applications, and our experts can help you find the best match for your specific need. We have solutions from brilliant brightfield to low-light fluorescence, and from imaging living, moving specimens to fixed stained sections on slides. Need help deciding? Just ask!
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FPGA Signal Processor
376
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The Model 376 is designed around the Texas Instruments ADC12D1600 12-bit ADC. The 1.6 GHz sample clock is supplied by either the on-board frequency synthesizer or an external source. The frequency synthesizer can be phase locked to the local 10 MHz TCXO or an external reference can be used to achieve system-wide phase coherence.
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Image Processing and Analysis Software Deep Learning Module
ENVI® Deep Learning
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L3Harris Geospatial Solutions, Inc
L3Harris Geospatial has developed commercial off-the-shelf deep learning technology that is specifically designed to work with remotely sensed imagery to solve geospatial problems. The ENVI Deep Learning module removes the barriers to performing deep learning with geospatial data and is currently being used to solve problems in agriculture, utilities, transportation, defense and other industries.
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Image Processing and Analysis Software
ENVI
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L3Harris Geospatial Solutions, Inc
ENVI is the industry standard for image processing and analysis software. It is used by image analysts, GIS professionals and scientists to extract timely, reliable and accurate information from geospatial imagery. It is scientifically proven, easy to use and tightly integrated with Esri’s ArcGIS platform.ENVI has remained on the cutting edge of innovation for more than three decades due in part to its support of all types of data including multispectral, hyperspectral, thermal, LiDAR and SAR. ENVI makes deep learning accessible to people through intuitive tools and workflows that don’t require programming. ENVI geospatial image analysis can also be customized through an API and visual programming environment to meet specific project requirements.
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Radar Video Processor
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Curtiss-Wright Defense Solutions
Radar Video Processor (RVP) is a family of high-performance radar acquisition, tracking and distribution servers that are designed to address a broad range of radar processing requirements, from network radar video servers to ruggedized naval tracking solutions. RVP servers are designed to work with our extensive range of radar client solutions for video and track display.
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Intel® Smart Display Module Large (Intel® SDM-L) With 8th Gen Intel® Core™ I7/i5/i3 Processor, HDMI And LAN
SDM500L
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The SDM500L is powered by the onboard 8th generation Intel® Core™ i7/i5/i3 processor with the Intel® Generation 9 HD Graphics chipset. The Intel® Smart Display Module-Large (Intel® SDM-L) measures just 175 x 100 mm and a maximum z-height of 1.6 mm, which is well-suited for ultra-slim displays. It can be easily connected to an SDM-compliant display via a high-speed PCIe x8 edge connector - which supports 4K resolution displays and video capture and has built-in USB 3.0, HDMI 2.0, DisplayPort 1.2, Serial TX/RX and I2C signals. With its excellent graphics performance and installation flexibility, the incredible signage module can satisfy diverse industry requirements and support a wide range of digital signage applications such as bedside terminals for hospital patients or factory automation solutions.
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Advanced Digital Imaging System
C-Cell Colour
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The C-Cell Colour is an advanced digital imaging system that provides comprehensive quality analysis for bread and baked products. Provides analytical results for repeatable, reliable quality .Removes human error in quality control environmentsCalibrations can be tailored to meet manufacturers needs.Bread scoring system provides consistent results across sites.Over 50 different quality results relating to bakery products.Quantifiable results helps to easily score against targets.Helps to show the impact in structure when making slight changes in process/production/ingredients
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Video Line Insertion Processor
VIP472
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The VIP472 is a line switcher that will insert any one video test signal line onto your NTSC video path so that you can monitor the trasmission signal quality. This process allows the video test signal to pass through all digital compression systems to verify that your video is being delivered accurately without distortion.
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Pico-ITX SBC With Intel® Atom® Processor E3845/E3827, LVDS/ VGA (HDMI), LAN And Audio
PICO840
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The PICO840 ultra-small Pico-ITX embedded SBC supports the quad-core Intel® Atom® processor (code name: Bay Trail-I) and supporting DDR3L-1066/1333 MHz system memory up to 8 GB. Considering different environments, this industrial-grade Pico-ITX mainboard is built to withstand extreme temperature, ranging from -40°C to +70°C (-40°F to +158°F). Moreover, with superior integration and power efficiency, this compact size single board computer enables system developers and OEMs to create smaller, lighter, quieter devices than ever and embrace the new possibilities across POS systems, mobile medical monitor, compact panel PCs as well as multiple embedded computer, system and appliance segments.
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ATX Motherboard With LGA1151 Socket 8th Gen Intel® Core™, Xeon® E Processor, Intel® C246, USB 3.1 Gen2, SATA 3.0, PCI Express Mini Card Slot, VGA, DisplayPort, DVI-D, And HDMI
IMB525
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*LGA1151 socket 8th gen Intel® Core™ i7/i5/i3, Xeon® E, *Pentium® or Celeron® processor (Coffee Lake)*Four 288-pin DDR4-2666/2400 ECC DIMM for up to 64GB of memory*DisplayPort, DVI-D, HDMI and VGA with triple-view supported*6 SATA-600 with RAID 0/1/5/10*1 PCI Express Mini Card slot (optional)*2 USB 3.1 Gen2 and four USB 3.1 Gen1*TPM 2.0 supported (optional)
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Pico-ITX SBC With Intel® Atom® Processor E3845/E3827, LVDS/VGA, LAN And Audio
PICO841
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The PICO841, an extreme compact embedded pico-ITX motherboard, is designed to support the latest 22nm quad cores Intel® Atom® processor E3845 or dual cores E3827 (codename: Bay Trail) with one DDR3L system memory maximum up to 8 GB. With its compact size and ultra-low power consumption, it is perfect for space-limited and power saving environments. Otherwise, the energy-efficient embedded board is built to withstand wide temperature conditions, ranging from -20°C to +70°C (-4°F to +158°F). Integrated with Intel® HD graphic engine, the PICO841 supporting VGA and 18/24-bit dual channel LVDS in dual-view provides faster and better graphic performance. Furthermore, to increase the connectivity and reliability, the rich feature of I/O interfaces are integrated to allow flexible cabling. Coming with two PCI Express Mini Card sockets, the pico-ITX mainboard offers excellent extensibility.
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PMIC Solutions For Intel® Atom™ Processor Z6xx Series Families
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Renesas has partnered with Intel to develop leading PMIC solutions for Intel's Atom Processor Z6xx platforms (formerly code named "Moorestown" and "Oak Trail"). With an optimized BOM (Bill of Materials), Renesas PMICs support a variety of mobile handheld, tablet, sleek netbook, and embedded form factors with proven OS support for Android™, Windows® and MeeGo™.





























