Discrete Semiconductor
semiconductor typically having one circuit.
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Product
Semiconductor Electrical Test
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We conduct electric property test (final test) of the completed (packaged) LSI products. We will support testing of analog devices, logic devices, other electronic parts, modules, application products and so on. We will test according to customer's specification regardless of evaluation, trial production, mass production, by know-how cultivated with long-time mass production results. Test initial examination ~ From consistent correspondence up to selection and evaluation, individual correspondence such as design only is accepted.
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Product
Enhanced 24 Discrete I/O Channels (0 to 60 VDC, 500 mA/Ch.)
DT4
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The DT4 module (the enhanced version) features 24 programmable channels for either input (voltage or contact sensing with programmable, on-module pull-up/pull down current sources), or output (current source, sink, or push-pull) up to 500 mA per channel from an applied, external 3 – 60 VCC source. These modules can sense broken input connections and whether an input is shorted to +VCC or to ground. Additional features of the DT4 (Enhanced Version) are listed below.
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Product
Semiconductor Test
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Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.
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Product
Semiconductor Test Equipment
IC Tester
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Equipment to determine the pass/fail of devices in the wafer inspection process and the final inspection process after packaging.
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Product
QuadraPaddle Signal Insert, ITA, SIM, 4 Position (not Loaded- For Discrete Wiring Only)
510181101
SIM Insert
QuadraPaddle Signal Insert, ITA, SIM, 4 Position (not loaded- for discrete wiring only)
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Product
16-CH Discrete Input 16-CH Discrete Output Modules
HSL-DO16-UC / HSL-DI16-UC
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- Support 16 DI channels and 16 DO channels- Transmission speeds: 3/6/12 Mbps- RJ-45 phone jack for easy installation- Compact design to meet space limitation and cost-effective requirement- Fuse design to protect digital output channelover-current
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Product
Signal, Insert, Receiver, QuadraPaddle, SIM, 1 Slot (not loaded- for discrete wiring only)
510180101
SIM Insert
Signal, Insert, Receiver, QuadraPaddle, SIM, 1 Slot (not loaded- for discrete wiring only).
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Product
Semiconductor Curve Tracer
CS-5000 Series
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*Max. Peak Voltage : 5,000V（HV mode）*Max. Peak Current : 1,500A（HC mode）*Equipped all models with LEAKAGE mode (Cursor resolution 1pA）*USB port for display hardcopy, waveform data (CSV format) and measurement setup SAVE/RECALL*LAN interface for Remote Control
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Product
Spread Resistance For Slanting Polished Sample Of Semiconductor By Tow Kinematically-mounted Probe Contacting .
SRS-2010
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*Resitivity map along with depth direction, thickness of epitaxial , depth of PN junctin and carier density profiles
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Product
ITA, G18, 18 Module With Discrete Wiring And PCB Capability
410120101
ITA
ITA, G18, 18 Module with Discrete Wiring and PCB Capability
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Product
Semiconductor Technology, Micro Scriber + Flatness, Bow, Warp, Curvature, Glass Thickness
FLATSCAN
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Optik Elektronik Gerätetechnik GmbH
Non contact automated 2D- or 3D measurement of warp, bow, slope and surface curvature with software module for calculation of thin film stress (wafer stress) of wafers and glass substrates.
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Product
NI Semiconductor Test Systems
Test System
The STS delivers the openness and flexibility of the NI PXI platform to the semiconductor production environment. For easy integration into the production test cell, the STS comes with features such as handler/prober integration, spring probe device under test interfacing, STDF data reporting, and system calibration.
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Product
Module, Receiver, RTCASS, Signal, 210 Position, Discrete Wiring
510113146
Receiver Module
Module, Receiver, RTCASS, Signal, 210 Position, Discrete Wiring.
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Product
Automotive Power Discretes
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ST offers a wide portfolio of automotive grade power discrete devices for reliable, robust and power-efficient automotive applications.
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Product
Semiconductor Testing
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Teradyne’s semiconductor test portfolio is transforming the way you test chipsets for automotive, industrial, communications, consumer, smartphones, and computer and electronic game applications. Semiconductor devices span a broad range of functionality, from very simple low-cost devices such as appliance microcontrollers, operational amplifiers or voltage regulators to complex digital signal processors and microprocessors as well as memory devices.
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Product
Discrete Device Test System
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capability to perform parallel testing of power discrete devices. As the standard specifications of mainframe, 341-TT/P has 1.2kV/20A and 351-TT/P has 2kV/50A capabilities. These systems have 2 testing subsystems, each of which has 4-station capability by multiplexing to 4 handler/prober stations for high volume production testing.
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Product
Semiconductor CharacterizationSystem
Keithley 4200
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Materials Development Corporation
The MDC CSM/Win-4200 System integrates the extraordinary power of the CSM/Win softwarewith the power of the new Keithley 4200-SCS. Measure capacitance, voltage, and current down to sub-femtoamp levels.
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Product
Semiconductor Functional Verification Tools
Trek5
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Breker’s solutions enable test reuse across simulation, emulation, prototyping and actual silicon, eliminating redundant effort across the development flow. The Breker “Trek” suite solves challenges across the functional verification process for large, complex semiconductors.
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Product
300 Mm Semiconductor Processes
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With the Center Nanoelectronic Technologies (CNT), the Fraunhofer IPMS conducts applied research on 300 mm wafers for microchip producers, suppliers, equipment manufacturers and R&D partners. In the field of FEoL and BEoL we offer the following technology developments and services at Ultra Large Scale Integration level (ULSI):
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Product
Semiconductors
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Teledyne Lincoln Microwave designs our own proprietary microwave diodes, which underpin many of our performance advantages.Our Semiconductor Technology Centre is located at the School of Physics and Astronomy within the University of Nottingham, UK. Facilities include a 90m2 ISO class 6 process cleanroom with ISO class 5 laminar flow.
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Product
Semiconductor Package Inspection System
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NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA).
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Product
Semiconductor
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With ultra-multi pin count and fine pitch, our general-purpose IC socket lineup corresponds to every need. For semiconductor burn-in sockets for thermal acceleration tests, and test sockets for semiconductor electrical testing, we continue to hold a high market share all over the world.
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Product
6-CH Discrete Input 16-CH Discrete Output Module with UD Type Connector
HSL-DI16DO16-UD
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*Supports 16 DI channels and 16 DO channels*Transmission speeds: 3/6/12 Mbps*RJ-45 phone jack for easy installation*Compact and single board design to meet space limitati
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Product
Signal, Module, Receiver, CASS, 210 Position, Discrete Wiring
510113125
Receiver Module
Module, Receiver, Cass, Signal, 210 Position, Discrete Wiring
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Product
Discrete & Power Modules
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A product portfolio that offers full spectrum of high, medium and low voltage power discrete devices along with advanced power module solutions, including IGBT, MOSFET, SiC, Si/SiC Hybrid, Diode, SiC Diode, and Intelligent Power Modules (IPMs).
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Product
Semiconductor Technology
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Semiconductor technology has maintained exponential performance growth, transforming society at a blistering pace. Now, all eyes are on the industry to keep up that rate – commonly associated with Moore’s law – to accommodate for challenges such as the steeply growing amount of data, low-power edge computing for artificial intelligence and high-performance computing to crack some of the world’s toughest problems.
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Product
Semiconductor Thermal Analyzers
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Analysis Tech Semiconductor Thermal Analyzers measure semiconductor junction temperatures using the electric method of junction temperature measurement on all types of semiconductor devices.
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Product
Semiconductor Probe
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Using the spring contact probes for semiconductor package inspection, customers can test various types of packages with LEENO's Total Interface Solution.
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Product
Semiconductor
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The semiconductor industry faces continuous pressure to reduce device size and costs while improving performance and reliability. Semiconductor, test and assembly automation manufacturers demand the same improvements from the motion technology which drives it. Haydon Kerk Pittman continues to develop new technologies in motors, lead-screws, gears, encoders, actuators, slides, drives and complete sub-systems that increase operational speeds and accuracy while lowering the cost of ownership.
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Product
Semiconductor Test Platform
PAx
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PAx semiconductor test system delivers uncompromised RF performance in a low-cost system for testing RF power amplifiers and front-end modules for next-generation wireless standards.
