Thermal Chucks
control DUT's thermal state. Wafer
See Also: Temperature Forcing Systems, Wafer Probers, Temperature Chucks
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Product
Thermal Controlled Chucks & Plates
TOP Cool
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Mechanical Devices newest innovation in thermal testing. Each TP system contains a thermal chuck or thermal plate and a self-contained thermal control unit.The TP chuck and platforms is a breakthrough product that introduced the use of refrigerant for active cooling & heating of wafers and other components with no need of chiller, CDA, or consumable and expensive refrigerants such as liquid nitrogen and liquid carbon dioxide. It can be a perfect replacement system in the industry for uncompromising thermal and mechanical performance with a temperature ranging from -60 to +220°C.
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Product
Thermal Chuck Systems
C-Series
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Advanced Temperature Test Systems GmbH
Looking for a chuck system that gives you the possibility to cool down to - 60C and up to + 300C. The C-Series represents a product line of air cooled thermal chuck systems for a wide temperature range
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Product
On-Wafer Measurements
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Accurate DC/CV (and RF) statistical modeling of semiconductor devices requires collecting a significant amount of measured data from different wafers across several temperatures. Keysight Technologies recommends IC-CAP WaferPro as a turn-key DC/CV and RF automated characterization solution to help modeling and device engineers achieve more efficient on-wafer measurements across temperature. This new breakthrough solution is based on IC-CAP modeling software and efficiently controls DC/CV analyzers, network analyzers, probers, switching matrixes, and temperature chucks, as well as the powerful 407x and 408x Series of Keysight parametric testers.
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Product
Vacuum Chuck Temperature Controlled Test Stations
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These test stations offer the same reliable repeatable measurement capability of our temperature monitored stations with the added dimension of temperature control.
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Product
Semi-Automatic Probe Station
P300A
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The P300A probe station is the most stable, intuitive, and space efficient 300mm semi-automatic analytical probe station available today. Designed for low current, sub-micron positioning applications, the P300A comes standard with features such as single-point ground, dry/dark environment, and integrated thermal chuck plumbing.
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Thermal Chuck Systems
A-Series
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Advanced Temperature Test Systems GmbH
The A-Series represents a productline of air cooled thermal chuck systems for a temperature range between -30C up to +400C. The basic product offers an active cooled chuck system without an external chiller for a temperature range between +25C up to +200C at a very competitive price to common Hot Chucks.
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Product
Chamber/Pyroelectric Task
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Radiant's Chamber/Pyroelectric Task sets the sample to a series of temperatures by performingGPIB control of an external thermal device. At each temperature it captures the sample’s polarization response and/or small-signalcapacitance. These are combined to calculate the pyroelectric coefficient. The Pyroelectric Task is to be used with a Radiant Test System and a Linkam Stage (-196C to 600C), Thermal Chambers, Hot Chucks, or a Furnace to automatically measure the Pulse Polarization response and Small Signal Capacitance of a Pyroelectric material that is being heated and/or cooled. Radiant's Pyroelectric measurement Task can be added to Vision at additional cost. This measurement suite fully characterizes the pyroelectric charge (polarization) response of the sample under test. The Pyroelectric Task suite controls various thermal controllers such as Quantum Design, Lake Shore, Delta Design, and many others. Detailed Listing of Thermal Controllers Registered in Vision. The Chamber/Pyroelectric Task is quoted upon request.
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Product
Wafer Chucks
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American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Product
Drill Chuck Grips
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Metal rods, wires, and plates and electronic components can be tensile tested using drill chuck grips. Electronic components are tested by placing the metal legs of the components in the grips, allowing different shaped components to be tested with the same set of grips.
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Product
Wafer Chucks
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ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Product
Metal Foil Chucks
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Electrostatic chucks are the most reliable solution for gripping delicate, microfabricated metal foils - even in air. These chucks induce no distortion, are easily cleaned, are amazingly robust, economically priced, and exhibit uniform grip forces over their entire area.
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Product
Thermal Profiler
KIC K2
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The latest-generation mobile-friendly profiling technologyThe KIC K2 Thermal Profiler features a compact and robust design that allows it to fit through the tight, heated chambers of lead-free reflow ovens. A plug-and-play hardware and graphical user interface makes profiling both quick and easy. The profile data measured by the K2 can now be viewed on either a PC or on a mobile device using the Profile Viewer App.
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Product
Thermal Printer
DP-581H
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It allows to print data without AC power by driven with built-in rechargeable battery, enables to use anywhere. Lithium-ion battery (6-cell, 11.1 V, 6000 mAh, 66.6 Wh)
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Product
Thermal Platforms
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Thermal Platforms are perfect for using conductive transfer to test components hot and cold, they work best for parts with a low or flat physical profile. They transfer heat outstandingly for programmed or very rapid heating and cooling transition times (that’s why they’re called hot plates or cold plates as well), and have a precise temperature control every time from cryogenic temperatures to extremely hot
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Product
Thermal Tools
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BMP Testing and Calibration Services Inc.
BMP Testing and Calibration Services, Inc. utilizes the latest thermal measurement equipment to analyze low to medium-conductivity materials, from ceramics, plastics, and polymers to coatings, composites, liquids, and building materials.
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Thermal Imaging
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Is a sophisticated and non-invasive technique that utilizes infrared technology to detect heat emissions from various objects.
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Product
Thermal Imaging
JOHO272
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Wuhan JOHO Technology Co., Ltd
With innovative design and superior functions, this thermal weapon sight sets a new standard to build in an eye-safe laser ranger finder which you can get target distance very easily. The thermal aiming and laser ranging scale line would be changing smaller as distance further so that the shooter would easily and quickly lock target even in a further distance. To improve shooting percentage, as many as ammunition drop chart can be input to the sight program. Should any drop chart be selected, the sight would automatically generate a new shooting scale line after program calculating temperature, angle, wind speed, altitude. Different button size and battery convex design friendly for shooter night us
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Product
Thermal Shock
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Trialon routinely test products for the automotive, military, medical, aerospace, heavy truck and customer markets in our facilities in Michigan and Indiana.
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Product
Thermal Testing
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A view of multiple testing stations for use in conducting Thermal Analysis on various materials. This is one of several areas assigned to various thermal tests. Differential Scanning Calorimetry (DSC), Thermogravimetric Analysis (TGA), Thermomechanical Analysis (TMA), and Dynamic Mechanical Analysis (DMA)
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Product
Thermal Analysis
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The TORC (Thermo-optical Oscillating Refraction Characterization) technique applies decades of know-how in optical instrumentation to thermal analysis in a novel and unique way. The technique requires minimal sample preparation at maximal tolerance for sample properties. You can determine the coefficient of thermal expansion, glass and phase transitions as well as polymerization for various samples: liquids, gels, pastes, and certain solids. For example: cured and uncured resins, adhesives, glues, etc. can easily be characterized. Both thermal and time-dependent processes can be monitored with minimal effort.
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Hot Chucks
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Materials Development Corporation
Probe stations to suit all measurement requirementswhether production, engineering or research. See individual data sheets for more details.
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Product
Thermal Engineering Projects
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Precision Development Consulting Inc
Open loop temperature controller, LED process tool, Single wafer CVD chamber, Batch CVD Tool, Batch ALD Tool, MOCVD equipment, Device cooler
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Product
Thermal Test Vehicles
TTV
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Thermal Engineering Associates, Inc.
Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.
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Thermal properties sensor
TP01
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Hukseflux Thermal Sensors B.V.
TP01 is designed for long term (permanent) installation in soils. It covers the thermal conductivity (λ) range of 0.3 to 4 W/m.K, which is sufficient for most inorganic soil types. The core of TP01 is a differential temperature sensor (2 thermopiles) (1) measuring the radial differential temperature with record breaking sensitivity. The sensor performs a temperature measurement around a heating wire (2).
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Product
Fixed-Mount Thermal Camera
FLIR A50/A70 Smart Sensor
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FLIR A50 and A70 smart sensor cameras are ideal for users who want built-in, on-camera analytics and alarm capabilities for condition monitoring and early fire detection applications. With options for Wi-Fi, an integrated visual camera, and ONVIF S compatibility, FLIR A50/A70 cameras are a flexible, configurable solution to meet the unique needs of automation customers across a broad range of industries. When used as a system component for cloud and Industrial Internet of Things (IIoT) solutions, A50/A70 cameras can help companies protect assets, improve safety, maximize uptime, and minimize maintenance costs.
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Thermal Management
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Our air cooling components dissipating heat to the ambient air comprise high-performance heat sinks, general purpose DC fans and AC fans for forced air ventilation, as well as filter fans with exchangeable exhaust filter inserts that ensure clean and reliable air exchange in cabinets.
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Product
Thermal Control Devices
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Sumitomo Electric Industries, Ltd.
Sumitomo Electric offers heat control devices with excellent heat characteristics by combining its proprietary high-functional material technologies with process technologies (e.g. metallization, joining, sealing) and heat design technologies. These technologies are applied in the heaters for semiconductor fabrication equipment that achieves superior temperature uniformity and rapid heating and cooling characteristics.
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Thermal Camera
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Shenzhen UYIGAO Electronic Technology Co., Ltd
This is an infrared thermal imager that combines the functions of surface temperature measurement and real-time thermal imaging. The traditional thermal imaging camera needs to measure each component one by one, while this instrument does not need to. Therefore, it helps to save your time. Even the potential problems can be clearly displayed on the color screen which helps users quickly locate the central point to measure cursor and temperature.
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Product
Thermal Power Sensors
NRPxxT/TN/TWG
Power Sensor
The R&S®NRP power meter sensors have long been recognized for delivering supreme precision and speed. The R&S®NRPxxT, R&S®NRPxxTN and R&S®NRPxxTWG thermal power sensors are especially used for complex measurement tasks where highest accuracy counts
