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Distributed Test Manager
DTM
The Distributed Test Manager (DTM) is a Windows™ application which enables many different types of system level testing by simulating multiple devices in a system. DTM is a system level simulator that is unique compared to other Triangle MicroWorks tools which test the communications of a single device. DTM is a highly extensible tool with multiple options for configuring devices, creating test cases, and simulating data in the system.
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Semiconductor Test
Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.
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Asynchronous System Level Test Platform
Titan
The Titan System Level Test (SLT) platform delivers maximum flexibility, scalability and density in semiconductor test environments that require the highest levels of system performance testing. Titan is Teradyne’s solution for high-volume mobile application processor SLT requirements.
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SLT Socket
Mobile Phone, Tablet, TV Board, Set-top box etc.LEENO can provide a System Level Test solution on various types of packages.
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±6 kV ANSI/ESDA/JEDEC HBM Test System
HBM-TS10-A
High Power Pulse Instruments GmbH
*±6 kV Human-Body-Model (HBM) tester according ANSI/ESDA/JEDEC JS-001 standard with C = 100 pF, R = 1.5 kΩ discharge network*Wafer, package and system level HBM testing*True HBM: the classical discharge network of the HBM-S1-A according the standard ensures compliant waveforms for all load conditions*No trailing pulses*Integrated 10 kΩ charge removal resistor*Integrated DUT HBM current sensor for real time transient current monitoring with 1V/A output sensitivity into 50 Ω digital oscilloscope input*Integrated DUT HBM voltage sensor for real time transient voltage monitoring with 1/200V/V output sensitivity into 50 Ω digital oscilloscope input*Integrated overvoltage protection of the DUT voltage sensor, DUTcurrentsensor and DC test interface for efficient overload protection of the digital oscilloscope and SMU during high voltage HBM testing*Integrated DC test DUT switch with automatic switch control*Integrated 50 Ω precision hardware trigger output for high speed digital oscilloscopes*Fast HBM measurements, typically 0.5s per pulse including one-point DC measurement between pulses*Eficient sofware for system control and waveform data management (fully compatible with TLP measurement data)*The sofware can control automatic probers for fast measurements of complete wafers*Compact size 145 mm x 82.5 mm x 44 mm of the integrated HBM pulse generator probehead*System controller size 483 mm x 487 mm x 133 mm*High performance and high quality components*Optionally available hardware upgrades to all HPPI fully integrated HBM/HMM/TLP/VF-TLP test systems TLP-3010C, 4010C, 8010A, and 8010C
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Device Testing
S-TEST Lab
SPEKTRA Schwingungstechnik und Akustik GmbH Dresden
S-TEST Lab solutions have been tailored for system level testing in development and lab environments. The core component is the S-TEST desk system. It combines a compact design with the full test interface, that enables the developer to react flexible on changing requirements already in early project phases and to also verify product performance parameters.
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ECM PCB Tester
MS 1105
*Used for testing of DAWN RWR PCBs in Jaguar Aircraft*19” Rack mountable with built-in wide range of IO signals *Used in 4th line servicing of PCBs*Used in LRU and system level testing*Detects 100% fault coverage including track faults*Adaptability with off-the-shelf instruments
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System Level Test
SLT
As technology nodes continue to evolve and with a more aggressive time to market to bring devices to their end applications, full test coverage of such chips is possible only with System Level Testing.
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System Level Test and Burn-in Solutions
System Level Test (SLT) is a paradigm shift from traditional structural and functional testing. The device is tested in a complete, integrated system to evaluate its compliance against specified requirements. The system approach allows for higher and more cost-effective test coverage especially for multi-function and non-deterministic devices. It also brings new integration and test challenges like: ..Designing test fixtures on Burn-in Boards with system components ...
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Systems Integration for Circuit Card Assembly
Teledyne Advanced Electronic Solutions integrates CCAs and other sub-assemblies, cables and fabricated parts into system modules shipped directly to customers for integration into their products.- Box Build: custom built to order system solutions- High complexity box assemblies and subsystems- High frequency RF box assemblies and subsystems- Full functional RF testing up to 26 GHz (K band)- Multi-level systems integration – build and test modules and CCAs and integrate into higher level assemblies- Custom cell design for customer subsystems- Special bonding processes including thermal management and vibration- Robust torque and FOD control programs- System level testing including functional, vibration and thermal- Complex harness fabrication and integration- Fiber-Optic and RF waveguide integration and testing- Large system capacity in excess of 200 lbs.- Configure to order – Integrate different options, firmware, configurations, etc across a single order as required
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Test & Test Development for Circuit Card Assembly
Teledyne Advanced Electronic Solutions performs comprehensive testing at the CCA and system level assembly. Teledyne AES can perform testing developed by the customer or develop a complete test strategy for the customer’s products.- Bed of Nails FixtureIn-Circuit Test (Bed of Nails) or Flying Probe Testing for rapid feedback on CCAs- Functional testing of CCAs or complete systems- Environmental testing to include vibration, thermal cycling, HASS, etc.- CCA and system level test development- High frequency testing – currently to 40 GHz- High power system testing – currently to 4kW
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Bluetooth RF Test System
FRVS
FRVS is recognized by the Bluetooth SIG as a validated test system for qualification testing of products to Bluetooth BR/EDR and low energy RF test specifications.
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RSE Wireless EMC Spurious Emission
TS8996
The R&S®TS8996 RSE test system is designed for EMI and radiated spurious emission testing on wireless devices in semi-anechoic or fully anechoic chambers. The modular design makes it easy to extend the system to include new communications technologies. Typical devices under test include mobile phones or radio sets along with radiated measurements of other short-range devices. Standards require a wide range of test setups and a wide and high frequency range (up to 40 GHz). ESW or FSW frequency ranges are extended up to 325 GHz with option B21 using receive units TC-RSE for 5G FR2. Dedicated RSE test routines are also covered for this frequency range.
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NI Semiconductor Test Systems
The STS delivers the openness and flexibility of the NI PXI platform to the semiconductor production environment. For easy integration into the production test cell, the STS comes with features such as handler/prober integration, spring probe device under test interfacing, STDF data reporting, and system calibration.
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Semiconductor Test System
TS-960e
The GENASYS Semi TS-960e PXI Express Semiconductor Test System is an integrated test platform that offers comparable system features and capabilities found in proprietary ATE systems. Available as a bench top system or with an integrated manipulator, the TS-960e takes full advantage of the PXI architecture to achieve a cost-effective and full-featured test solution for device, SoC and SiP test applications.
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Image Sensor Testing
IP750Ex-HD Family
The IP750EX-HD has been the test platform that has enabled the industry to manufacture high quality CCD and CMOS image sensors, and it is the most economical platform to meet the needs of newer technologies such as Time of Flight (ToF) sensors. When you use a smartphone, high performance digital still camera, or in-home security and surveillance system, these applications have image sensors most likely tested by Teradyne’s IP750ExHD.
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Test Systems
Ball Systems delivers best-in-class automated testing systems, software programming, integrated manufacturing systems, and industrial engineered solutions. Our team has former corporate test engineers, quality assurance engineers, industrial engineers, and test managers who have decades of experience to assist customers in meeting their automated test challenges by offering:
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Physical Layer Test System
N19301B
The N19301B Physical Layer Test System (PLTS) 2022 software is a powerful signal integrity tool for today’s high-speed digital designers.
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OTP-Based Test System
Power electronics assemblies often cannot be tested using conventional technology for their electrical performance. Due to the adaptability of the instrumentation, the OTP concept offers an ideal platform even beyond the space requirements of several control cabinets. In order to achieve high test flexibility with different assemblies, the system was equipped with three-phase AC sources and AC loads as well as a precise three-phase power meter. DC sources and loads with different current and voltage ranges cover the test of frequent DUT operating parameters. Time-dependent voltage or current signals can be stimulated by an arbitrary generator with power amplifier. General measurements such as current, voltage, frequency, resistance can be carried out flexibly at various test points using the matrix concept. An oscilloscope with RF multiplexer is available for high-frequency measurements such as residual ripple, switching processes, etc.
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True Concurrent Test
TestStation Duo
The TestStation Duo is a true concurrent test system with independent test modules providing fast in-circuit test throughput and lowering high-volume production costs.It effectively doubles the test throughput of conventional in-circuit test systems, without doubling capital equipment costs or increasing manufacturing floor space, by combining two complete and independent test modules inside a single tester frame.
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H(3)TRB & HTGB Test Systems
SET offers two H(3)TRB and HTGB product lines which differ in the number of test object channels and the range of technical possibilities. The innovative systems are scalable, modular and standardized.
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VLSI Test System
3380P
The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (512 I/O pins to test 512 ICs in parallel) that can meet the upcoming higher IC testing demands.
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Advanced SoC/Analog Test System
3650
Chroma 3650 is an SoC tester with high throughput and high parallel test capabilities to provide the most cost-effective solution for fabless, IDM and testing houses.
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Inline test system for FCT, ICT, ISP and Boundary Scan for Automated Operation
LEON InLine
High production volume often requires inline solutions with fully automated product Handling – the LEONlnline is a complete Inline Board Test Solutions for printed circuit boards. It integrates a flexible and scalable test system that features an excellent signal integrity and a high-quality fixture interface. This is achieved by combining a cableless connection from ABex modules to Virginia panel interface connectors.
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HV Test System for Patient Monitors
HV test enclosure for testing medical products (patient monitors). Insulated test booth with large space for DUT.3 different test nests for adapting different devices.Displays from patient monitors are checked. For this, insulation tests and leakage current measurements must be carried out. Ensuring the standard-compliant test. For the safety of the operating personnel, the test cell is electrically locked while the high voltage measurement is active.
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In-Line 2-Module In-Circuit Test System; i337x, Series 5i
E9988EL
The i3070 Series 5i Inline ICT retains the popular and proprietary Keysight short-wire fixturing technology used in our stalwart Keysight 3070 and i3070 systems.
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Standalone Bench Test System for FCT, ICT, ISP and Boundary Scan
LEON Bench
The LEONBench test system is a flexible and scalable test system that features an excellent signal integrity and a high-quality fixture interface. This is achieved by combining a cableless connection from ABex modules to Virginia panel interface connectors. The system is optimized for high pin count test applications. Furthermore, it can be equipped with vacuum and pneumatic. Support for multi-level contact fixtures enables separate contact levels for FCT and ICT. The Konrad ITA (Interchangeable Test Adapter) frame allows various fixture houses all over the world to build custom fixtures for the LEONBench. Up to 15U additional rack space allows adding a bunch of high-performance measurement devices from various manufactures. An integrated power distribution unit takes care about power on and off sequencing.As part of the LEON Family, LEONBench is based on the ABex platform which directly incorporates Konrad analog bus technology and PXI/PXIe in one chassis.
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HTOL Test Systems
Our IOL & Power-Cycling systems increase measurement quality & throughput while simultaneously reducing the Total Cost of Test (TCoT) of an open platform. We focus on complete monitoring and precise temperature control for each device under test.
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Rack based antenna test system
R&S®ATS800R CATR
Very compact far-field over-the-air (OTA) test system based on compact antenna test range (CATR) technologyUnrivaled quiet zone size within 0.8 m2 footprintState-of-the-art reflector ensuring a high quiet zone accuracyUnique rack based CATR system supporting over 50 GHzIndirect far-field method (approved by 3GPP for 5G OTA testing)
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Image Sensor Test System
IP750
Teradyne's IP750 series dominates the image sensor tester market with its superior performance and low cost of test. The IP750 delivers high throughput and high parallel test efficiency, broad device test coverage from CCD and CIS, analog and digital capture, and concurrent image sensor and logic testing. In addition, Teradyne's IG-XL software environment provides easy, shorter test program development and easy maintenance.
