Common Core
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Product
Detector of Earth Faults on Multi/Single-Core Terminations
CableTroll 2310
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CableTroll 2310 is an indicator for detection of earth faults (PtG) on multi-core and single core cable terminations. The unit uses NorTroll type current sensor (CT)
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Product
Intel® Core™ Ultra 5/7/9 LGA1851
AIMB-589
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Intel® Core™ Ultra Series 2 Processors, max. 24Core. Support W880/Q870 chipsetsUp to 192GB DDR5 UDIMMs/CUDIMMs for data transfer2 x 2.5GbE LAN and 2 x GbE LAN for digital devices1 x USB4, 8 x USB3.2, 4 x USB2.02 x M.2 M-Key 2280 for NVMe SSDAccommodate 2 double-deck GPU cards by PCIe x16 slots (x8 lanes)
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Product
Split Core Current Transformers
LZCK-55
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Beijing GFUVE Electronics Co.,Ltd.
Outdoor waterproof current transformers are applicable for AC power system 35kV and measurement of current of power supply equipment below 10KV also can be used for microcomputer protection. This type of current transformer employs imported silicon steel which with high permeability as magnetic material, has the characteristics of Small magnetic circuit loss and can be split, its semicircular core and secondary windings employ high quality epoxy resin vacuum, casting in plastic-case(ABS or PC) which is flame retardance anti-moisture, stable performance, no maintenance.
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Product
X-Band Silicon Radar Quad Core IC
AWS-0105
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The AWS-0105 is a highly integrated silicon quad core IC intended for radar and 5G phased array applications. The device supports four radiating elements, single beam transmit, and single beam receive and includes all requisite beam steering controls for 6 bit phase and gain control. The device provides 21 dB gain and +15 dBm output power during transmit mode and 7 dB gain and +7 dBm IIP3 during receive mode. Additional features include gain compensation over temperature, temperature reporting, and fast beam switching using eight on-chip beam weight storage registers. The device features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 56 lead 7x7 mm QFN for easy installation in planar phased array antennas.
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Product
Shortwave Infrared Camera Core
Tau® SWIR
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FLIR Tau® SWIR provides outstanding short-wave infrared image quality and performance over a wide range of imaging and light level conditions. It is the ideal OEM SWIR imaging module for applications like hyperspectral instrumentation, silicon inspection, electro-optical payloads, art restoration, and portable imaging. The Tau SWIR camera incorporates the FLIR high resolution 640×512 ISC1202 Indium Gallium Arsenide (InGaAs) 15-micron pitch focal plane array (FPA) and includes several advanced camera controls features.
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Product
Common Mode Chokes
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Common Mode Chokes, as the name implies, are designed to attenuate and filter common mode noise within an electric system. The key parameters for a common mode choke are the current rating (to ensure the part does not overheat within the application), the impedance versus frequency (to ensure it is optimized to attenuate the desired frequencies), the isolation voltage (to ensure it meets board level requirements between the line and neutral phases) and safety isolation (to ensure it meets the safety requirements of the end-application). It is important to remember that common mode chokes cannot saturate in the application (under normal use) as they are designed to ensure that the line and return currents are balanced.
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Product
Embedded System Support Intel® 12th/ 13th/ 14th Gen. Core I9/i7/i5/i3 Platform
EPC-B2208
Embedded PC
Support Intel 12th/ 13th/ 14th Gen. Core i9/i7/i5/i3.Two DDR4 3200MHz SODIMM and up-to 64GB.Supports triple independent displays of 2x DP/HDMI/LVDS.One low-profile PCIe expansion slot.
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Product
Ultra-compact, Uncooled Thermal Imaging Core
Dione S 640 CAM Series
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The Dione S 640 CAM series is based on an uncooled 12 μm pitch microbolometer detector with a 640 × 480 resolution and NETD of less than 40 mK (available upon request) and 50 mK. The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione S 640 CAM is lightweight and small with mechanical shutter. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione S 640 versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione S 640 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M24/M34 lens (optional).The ultra-compact Dione S 640 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Product
Thermal Imaging Core
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Zhejiang ULIRvisionTechnology Co., LTD
Infrared thermal imaging technology is now more and more widely used in many different areas around the world, such as the security monitoring, industrial detection, the autonomous vehicle auxiliary market, iron industry and so on. Choosing the most suitable thermal imaging core is choosing half the right Infrared thermal imager. Therefore, how to choose the highly qualified infrared thermal imaging core is very important.
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Product
Industrial ATX Motherboard with 8th/9th Gen Intel® Core™ i9/i7/i5/i3 or Xeon® E Processors
IMB-M45
Motherboard
ADLINK IMB-M45 ATX industrial motherboard supports the 8th/9th Generation Intel Core i9/i7/i5/i3 and Xeon E3 processor in the LGA1151 package, and the Intel C246 chipset. This model supports ubiquitous high-speed data transfer interfaces PCIe 3.0, USB 3.1 Gen2 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2400/2666 MHz ECC or non-ECC memory up to 128 GB in four DIMM slots.
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Product
3U CompactPCI Intel® 6th Gen. Quad- Core™ Processor Blade
MIC-3332
Processor Blade
MIC-3332 is using Intel® 14nm technology to provide significant performance and power efficiency. It provides an ideal solution for railway rolling stock, high-performance computing and military application. With its optimized design on EMC & thermal, it is available to meet or exceed EN50155.
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Product
Industrial ATX Motherboard with 8th/9th Gen Intel® Core™ i9/i7/i5/i3 Processor
IMB-M45H
Motherboard
ADLINK IMB-M45H ATX industrial motherboard supports the 8th/9th Generation Intel Core i9/i7/i5/i3 processor in the LGA1151 package, and the Intel H310 chipset. This model supports ubiquitous high-speed data transfer interfaces PCIe Gen3, USB 3.1 Gen1 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2400/2666 MHz memory up to 64 GB in two DIMM slots.
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Product
8th/9th Gen Intel® Core™ Processor LGA1151
AIMB-286
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Supports Intel® 8th/9th Gen Core™ i processor (LGA1151) with Intel H310 chipsetTwo 260-pin SO-DIMM up to 64GB DDR4 2666 MHz SDRAMSupports PCIe x 4 (Gen 3), 1 M.2 B key, 1 M.2 E key, 6 COM, 4 USB 3.0 and 3 SATA IIISupports dual display of DP/HDMI/LVDS(or eDP)Supports TPM 1.2 / 2.0 (optional)THIN Mini-ITX with 12V DC InputSupport Windows 10 LTSC & Ubuntu 20.04 LTS; SUSI API and WISE-
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Product
Intel® Core™ IPC Controller
AMAX-7580 V2
Controller
Optimized BIOS & Embedded OS for 1ms real-time control (Windows and Linux)Achieve 128-axis motion control with 500 μs EtherCAT cycle time under LinuxOPC UA and Modbus TCP/RTU as IT connectivity enabled by CODESYSEtherCAT, PROFIT, Ethernet I/P, CANopen as OT connectivity enabled by CODESYSUnlimited I/O points, fieldbus networks, and visualization variables for CODESYS applicationsCODESYS Visualization (Target and Web), SoftMotion and CNC/Robotics support by different packageAdvantech Data Connect (ADC) Library provides flexible and highly efficient data connection with 3rd party application software through symbols (PLC Handler) & shared memory (C++/C#)13th Generation Intel® Core™ i7/i5 Processor with 8GB DDR5 memoryPort isolation for 8 x DI, 8 x DO, 4 x COM
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Product
IP Core and FPGA Products
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Our FPGA offerings include development boards and IP cores for Altera FPGA devices. The IP cores include: I2C, PCIe, JPEG-LS, LVDS Camera Link and memory controllers.
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Product
Compact DIN-Rail Edge Controller With 11th Gen Intel® Core™ I CPU
UNO-148
Controller
Port isolation for 8 x DI, 8 x DO, 4 x COMSupports M.2 M key 2280 NVMe SSD storage, M.2 B key 2242 storage, 3042/3052 cellular modules, and M.2 E Key 2230 wi-fi modulesDual 2500BASE-T Ethernet supports Time-Sensitive Network(TSN) technologyRemote out-of-band (OOB) power management with Advantech iBMC technologyMicrosoft Azure IoT Edge and Amazon AWS IoT Greengrass certified
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Product
13th Gen. Intel® Core I7/ I5/ I3/ U300E P/U-Series 3.5" SBC
MIO-5377R
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13th Gen. Intel® Core™ Processor up to 14 Cores, TDP 28/15WDual Channel DDR5-4800 up to 64GB, IBECC support by SKU4 simultaneous displays: LVDS/HDMI/DP/USB-C Alt. DP2x LAN, 8x USB (incl. 1x USB4), 4x UART, 2x CANBus, 3x I2C3 Expansions: M.2 E-Key, B-Key, M-Key (support NVMe)Supports Windows 10/11 LTSC & Ubuntu 22.04 LTS, embedded software APIs, DeviceOn Remote Management, Robotic Suite
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Product
Industrial All-In-One Touch Panel PC Based On 7th Gen. Intel® Core™ Processor
STC2-KL Series
Panel PC
- Intel® Core™ i3-7100U/i5-7300U/i7-7600U- 10.1"/15.6”/21.5” 16:9 LCD with LED backlight up to 50,000 hours- With up to 1920 x 1080 resolution- 10-point PCAP touchscreen- Anti-fingerprint surface treatment- IP 65 rating for water and dust protection- Robustness with wide 9-36V DC input- Ease of installation with optional VESA mount
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Product
Processor Intel Core I7, PCI Gen 3, AMC
AMC726
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The AMC726 is a Processor AMC (PrAMC) in a single module, mid-size AdvancedMC (AMC) form factor based on the Intel® 4th generation Core i7 Processor (Haswell) with QM87 PCH. The module follows the AMC.1, AMC.2 and the AMC.3 specifications.
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Product
Modular TPC - Computing Box Module With Intel® Core™ I3-N305 Processor
TPC-B520L
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Modular Computing Box powered by Intel® Core™ i3-N305, octo-core processorModular Front Panel modules ranging from 12.1" to 23.8" with P-CAP multi-touch in selection (12.1", 15", 15.6", 21.5" with high brightness panel option)Single DDR5 Memory slot supports up to 16GBSupport expansion via three M.2 slots (PCIe, Wifi, 5G)LAN, POE, isolated serial port and isolated digital I/O via iDoor technologySupport Type-C connector with USB 3.2, DP 1.4a, 15W power deliverySupport fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technologyPerformance, fanless embedded system with chassis grounding protection
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Product
Intel® 6th/7th Generation Core™ I3/i5/i7 Performance Embedded PC
EPC-B2205
Embedded PC
Supports Intel® 7th & 6th Gen Core™ i processor (LGA1151) with Intel Q170/H110 chipset.Two 260-pin SO-DIMM up to 32GB DDR4 2133 MHz SDRAM.Supports triple display of VGA/DP/DVI.One expansion slot (low profile).Two Shock Resistant 2.5" drive bays.Support SUSI, WISE-DeviceOn and Edge AI Suite.
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Product
Mini-ITX Embedded Board with 8th/9th Gen Intel® Core™ i7/i5/i3 Processors
AmITX-CF-I
Motherboard
The AmITX-CF-I is a Mini-ITX motherboard supporting the 8th/9th Gen Intel® Core™ i9/i7/i5/i3, Pentium® and Celeron® processor in the LGA1151 package, and the Intel Q370/H310 chipset. The AmITX-CF-I is specifically designed for customers who need high-level processing and graphics performance with a long product life solution. This model supports ubiquitous high-speed data transfer interfaces PCIe 3.0, USB 3.1 Gen2 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2400/2666 MHz non-ECC memory up to 32 GB in two SODIMM slots. The AmITX-CF-I features DVI, DP and HDMI ports, LVDS header, dual Gigabit Ethernet ports, USB 3.0 ports, USB 2.0 ports, SATA 6 Gb/s ports, and audio with Line-out, Line-in and Mic-in connectors. Expansion is provided by one PCIe x16, one M.2, and one mini-PCIe slot. The onboard pin header provides GPIO, USB and RS-232 support. The board is equipped with SPI AMI EFI BIOS, supporting embedded features such as hardware monitor and watchdog timer.
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Product
9th Gen Intel® Xeon®, Core™ i7/i5/i3-Based Compact Industrial GPU Workstation
DLAP-8000 Series
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- 9th Gen Intel® Xeon®, Core™ i7/i3 LGA processors with workstation C246 chipset- Dual SODIMMs for up to 64GB DDR4 / ECC options*- Rich I/O: 2x DP++, 1x DVI-I, 3x GbE, 4x COM, 8-ch DI, 8-ch DO, TPM 2.0- 2x USB 3.1 Gen2, 1x USB 3.1 Gen1, 3x USB 2.0- Up to 4 hot swappable 2.5" SATA 6 Gb/s tray with RAID 0/1/5/10 support, CFast, M.2 2280- Embedded expansion: 1x Mini PCIe, 1x M.2 3042, 2x USIM- Front accessible I/O and adaptive Function Module v.2 option- Flexible and powerful PCIe expansions via backplane
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Product
Value Series Industrial ATX Motherboard For 12/13/14th Gen Intel® Core™ I9/i7/i5/i3 Processors
IMB-C47
Motherboard
Elevate your industrial applications with the ADLINK IMB-C47 value series motherboards, engineered to deliver robust performance at an exceptional value. Designed with the evolving needs of cost-conscious businesses in mind, the IMB-C47 value series offers a versatile foundation for a wide range of computing tasks.From manufacturing automation to retail kiosks, these motherboards bring reliability without the premium price tag. Featuring support for the latest processors, abundant I/O connectivity, and expansion options, the IMB-C47 value series is crafted for those who seek reliable technology that aligns with their budgetary parameters.
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Product
Embedded Real-Time Robotic Controller with 11th Gen Intel® Core Processor
ROScube Pico TGL
Robotic Controller
ADLINK’s ROScube Pico TGL is a real-time ROS 2 enabled robotic controller based on the 11th Gen Intel® Core™ i7/i5/i3 processors with Intel® Iris® Xe Graphics featuring exceptional I/O connectivity and supporting a wide variety of sensors and actuators for unlimited robotic applications. The ROScube Pico TGL supports the full complement of resources developed with ADLINK Neuron SDK. Bundled with AI features and capabilities and developed with the Intel® distribution of OpenVINO™ toolkit, the ROScube Pico TGL is a perfect platform for industrial service robot applications such as autonomous mobile robots (AMR) and autonomous mobile industrial robots (AMIR).
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Product
15" Fanless Panel PC With Intel® Celeron Quad Core J1900 Processor
PPC-3150-RJ9
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15" TFT XGA LED Panel with resistive touchscreenEmbedded Intel Celeron processor, quad core J1900 2.0GHz onboardSystem memory up to 8GB DDR3L 1333 SDRAMSupports one internal SATA 2.5" HDDSupports one Mini PCIe socket, two Gigabit EthernetFanless and compact size with low power consumputionSupports five RS-232 and one RS-232/422/485, besides six RS-232 and two RS-422/485 are optional by requestSupports one mSATA socket
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Product
Compact Fanless System With Intel® Core™ Ultra 5/7/9 Processors (Series 2)
MIC-780
Modular Edge Computer
Intel® Core™ Ultra 5/7/9 Processors (Series 2)CPU type: Socket (LGA1851)Chipset: Intel® W880/H810DDR5 Memory up to 128GB 6400MT/sMIC-780W: 3 x displays – 2 x HDMI/1 x DP, 4 x GbE LAN, 4 x USB 3.2 Gen2x1 (10G), 2 x COM, 1 x NVMe M.2 (PCIe Gen4 x4)MIC-780H: 3 x displays – 2 x HDMI/1 x DP, 2 x GbE LAN, 2 x USB 3.2 Gen 2x1 (10G), 2 x USB 3.2 Gen 1x1 (5G) , 2 x COM
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Product
Modular TPC - Computing Box Module With Intel® 12th/13th/14th Gen./BTL S Core™ I CPU Socket (LGA1700)
TPC-B620
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High Performance Computing Box powered by Intel® 12th/13th/14th Gen. Core™ i / BTL Core™ S-series CPUs Socket (LGA1700) with fanless design10+ x Panel Modules (IP66) ranging from 15" to 23.8" in selectionDual Channel Memory slots (DDR5) support up to 64GB in totalComprehensive I/Os, including 4 x USB, 2 x COM, 3 x RJ45...etcSupports Expansion via 1 x PCIe x16, 1 x PCIe x4 or PCIe x2, 4 x M.2 (NVMe, SATA, WIFI)Supports Storage via 2 x M.2 2280 SATA SSD (RAID 0/1), 1 x M.2 NVMe SSD (2280)Supports Fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technologySupports Diverse system I/O, DIO, PoE...etc. via iDoor technologySupports TPM 2.0 hardware security
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Product
Industrial ATX Motherboard With 12/13/14th Gen Intel® Core™ I9/i7/i5/i3 Processor
IMB-M47
Motherboard
ADLINK's IMB-M47 ATX Motherboard is a driving force behind industrial automation, supporting 14/13/12th Gen Intel® Core™ processors, and delivering substantial improvements in performance, capacity, and GPU support through its seven PCIe slots, PCIe 5.0 compatibility, DDR5 memory, and 2.5GbE PoE capability. Tailored for a range of industrial applications including automation, machine vision, factory automation, and logistics, the IMB-M47 features up to 128GB DDR5 memory at 4800MHz, supports three independent displays, offers USB 3.2 Gen2x2 (20Gb/s), 3x 2.5GbE LAN, multi-M.2 Key M, TPM 2.0 security, and PCIe 5.0 slots for high-performance add-on cards. Optimized for the latest Intel processors, this motherboard blends efficiency and performance cores, bolstering edge applications with swift memory performance via DDR5 technology. With a commitment to technology leadership, ADLINK equips customers with the tools to harness the latest processors, streamline real-time graphics processing, and fuel innovation in Edge AI applications, solidifying its role in the future of industrial edge computing.
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COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
Express-RLP
Computer on Module
ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
