Common Core
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Product
Fanless Embedded System With LGA1151 Socket 8th Gen Intel® Core™ & Celeron® Processor, Intel® H310, HDMI, DisplayPort, 6 USB, 2 COM And 8-CH DI/DO
eBOX640-521-FL
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*LGA1151 socket 8th gen Intel® Core™ i7/i5/i3 & Celeron® processor (Coffee Lake)*Supports 2 COM, 6 USB and 8-CH DI/DO*Two 2.5" SATA drive bay*M.2 Key E 2230 for Wi-Fi*Front I/O connectivity design*12/19 to 24 VDC power input via DC-Jack*Flexible I/O window supported
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Product
Metal Cored PCB
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Teledyne Labtech is at the forefront of complex metal-cored PCB design and manufacture. The PCB use a thin metal core <2 mm, which acts as isolation between the RF/Microwave circuit and the Analogue/Digital circuitry and creates an excellent thermal path.The major advantages are reduced size and no need for complex microwave feed-thru's. The ability to laser cut pockets allows the designer engineer to mount the high power MMIC directly on to the metal core.
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Product
PICMG 1.3 Full-size CPU Card With LGA1150 4th Gen Intel® Core™ I7/i5/i3 Processor, Intel® Q87, SATA3, USB 3.0, DVI-D, VGA, DisplayPort And Dual LAN
SHB130
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The PICMG 1.3 full-size CPU card, SHB130, designed for the new architecture 4th Generation Intel® Core™ processors (codename: Haswell/Haswell Refresh) with Intel® Q87 chipset on 22nm technology using LGA1150 socket. The outstanding SHB130 with new Intel® architecture delivers up to double the graphics performance over the previous generation. The new graphics solution has high levels of integration to enable new form factors and designs with excellent visual quality built in. In addition, The PICMG 1.3 full-size CPU card comes with two DDR3 1333/1600 MHz unbuffered ECC DIMM slots up to 16 GB of system memory and six SATA 6Gbps ports with RAID 0, 1, 5, 10. The PCI Express 2.0 available on the new Intel® Core™ processor provides flexible x16, x4 or x1 lanes for versatile applications. The high performance SHB130 with improved graphics ability is ideal for applications such as network security, storage server, POS, kiosk, medical, gaming, digital signage, and surveillance security monitoring.
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Product
COM Express Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor (formerly codename: Alder Lake-P)
Express-ADP
Computer on Module
ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
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Product
15.6" Fanless Widescreen Panel PC With Intel® 13th Gen Core™ I7/i5/i3 Processor
PPC-415W
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15.6" true-flat Full HD LCD panel with projected capacitive touchscreen, anti-glare coatingIntel® Core™ i7-1365URE/i5-1345URE/i3-1315URE processor with fanless system designSupports PCIe x4 or PCI expansion1 x isolated RS-422/485 with auto flowWide input power range (9 ~ 32 VDC)Dual 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technology3 x Independent displays1 x M.2 bay (2242/2280) for storage onlySupport TPM2.0 hardware security
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Product
LGA 1700 Intel® 12th Gen. Core™ ATX Server Board with 4 x DDR5, 5 x PCIe(1 x Gen 5, 3 x Gen 4, 1x Gen 3), 7x USB3.2, 4xSATA3, Quad/Dual LANs, and IPMI
ASMB-788
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- LGA 1700 Intel® 12th Gen. Core™ i9/i7/i5/i3 processors with W680 chipset- DDR5 ECC/Non-ECC 4400/4000/3600 MHz UDIMM up to 128 GB- One PCIe x16 (Gen 5) and four PCIe x4 (3 x Gen 4 & 1 x Gen 3) slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Four SATA 3 ports and seven USB 3.2 ports- One M.2 2280 (PCIe x4)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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Product
Compact Modular Industrial Computers Based On 14/13/12 Gen Intel® Core™ Processors
MVP-5200 Series
Industrial Computer
The MVP-5200 Compact Modular Industrial Computers powered by 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron processors. Featuring Intel R680E chipset and supporting up to 65W, the computers can also incorporate GPU cards in a rugged package suitable for AI inferencing at the Edge, and can be used for but not limited to smart manufacturing, semiconductor equipment, and warehouse applications.
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Product
Pico-ITX SBC With 7th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor, LVDS And LAN
PICO511
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The PICO511 is an extremely compact Pico-ITX motherboard featuring the latest 7th generation Intel® Core™ processor or Celeron® processor 3965U (codename: Kaby Lake). The feature-rich 2.5-inch embedded board is building flexible I/O interfaces through board to board connectors, wide temperature range in a small-form factor motherboard to fit different needs of many demanding applications in various industries. The PICO511 is perfect for system integrators who require an extremely compact embedded motherboard with great processing power and expansion capabilities. Its compact size form factor has ensured that it can fit into a variety of space constricting environments. In addition, the Intel® Kaby Lake-based motherboard was designed to withstand extreme temperatures, ranging from -20°C to +70°C (0°F to +158°F).
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer (Code name: Skylake)
MVP-5000 Series
Industrial Computer
The MVP-5000 Series provides an optimal balance of price and performance in a compact construction. Incorporating 6th Generation IntelR Core? processors, the MVP-5000 features computing performance boosted by up to 30% over previous generation-processors. Integrating the front-mounted industrial I/O and fanless construction featured in ADLINK?s proven Matrix line, and rich LGA 1151 socket type CPU selection, the MVP-5000 Series is ideally suited to a wide variety of machine, factory, logistic automation, and general embedded applications.
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Product
COM Express Type 6 Compact Module With 6th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor
CEM501
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The CEM501 COM Express Compact Type 6 module is based on the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (codename: Skylake) with support for up to 32 GB dual channel DDR4 SO-DIMM memory. Featuring improved processing and graphics performance compared to the previous generation Intel® processor, the compact-size system on module CEM501 offers intense graphics performance and multitasking capabilities, making it ideal for telecommunication, medical imaging, digital signage, gaming machines, military, and IoT related applications.
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Product
Industrial ATX Motherboard with 6th/7th Gen Intel® Core™ i7/i5/i3 Processor (Code name: Skylake/Kabylake)
IMB-M43
Motherboard
The ADLINK IMB-M43 is industry's first 6th/7th Gen Intel Core i7/i5/i3 Processor (formerly codenamed Skylake/Kabylake) based industrial ATX motherboard in the LGA1151 package with Intel Q170 Express chipset. The ADLINK IMB-M43 supports high-speed data transfer interfaces such as PCIe3.0, USB 3.0, and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133/2400 MHz memory up to 64 GB in four DIMM slots.
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Product
PXI/PXIe RF Multiplexer, Single 4-Channel, Terminated Common, 3GHz, 50Ω, MCX
40-876A-101
Multiplexer Module
The 40-876A-101 (PXI) and 42-876A-101 (PXIe) are 50 Ohm 4 to 1 RF multiplexers with 1 bank in a single slot. Additionally, extra switching allows the common connection to be terminated into 50 Ohm, maintaining signal integrity. The module exhibits low insertion loss and VSWR through the use of modern RF relay technology at an affordable cost.
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Product
Common Armament Test Set
MTS-209
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The MTS-209 is a state-of-the-art portable test set for various armament systems used on the F-16, F-15, F-18, TA-50, FA-50 and additional aircraft. The MTS-209 supports a wide range of Alternate Mission Equipment (AME) including launchers, pylons, and racks. It combines the test capabilities of an I-Level test set in a compact, rugged, flight-line qualified enclosure. The MTS-209 performs parametric functional tests on AME components including Launchers (LAU-117, 16S210, LAU-127,, LAU-128, LAU-129, LAU-7,etc.), bomb racks (MAU-12, MAU-50, SUU-20, TER-9, etc.), Remote Interface Units (RIUs) and Pylons. The MTS-209 can also test MIL-STD-1760 aircraft stations and weapon systems.
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Product
Air Core Line & Load Reactors
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Line and load reactors are generally serial-connected to the input and/or output terminals of three phase equipment such as motor speed controllers, inverters and UPS systems. These equipment make use of semiconductor switches such as IGBTs, thyristors, and diodes and therefore create harmonic distortion and high switching over-voltages (dv/dt). Use of such equipment has been becoming more widespread as the technology advances. However, the negative effects of these equipment should not be overlooked.
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Product
ATX Server Board With Intel® Core™ Ultra 9/7/5, DDR5, And PCIe Gen5 For Workstations, General-Purpose Servers, And Multi-Tasking.
ASMB-789
Server Board
Features an LGA 1851 socket for Intel® Core™ Ultra 9/7/5 processors with the W880 chipset, delivering next-gen performance.Supports up to 192 GB of high-speed DDR5 ECC/Non-ECC UDIMM memory at up to 5600 MT/s.Provides extensive expansion with one PCIe x16 (Gen5), one PCIe x8 (Gen5), and five PCIe x4 slots.Drives triple independent displays through DisplayPort, VGA, and HDMI 2.0 for advanced visual workspaces.Includes four SATA 3 ports for traditional storage and seven USB 3.2 ports for high-speed peripherals.Features one M.2 2280 slot (PCIe x4) for fast NVMe SSDs, accelerating boot times and application performance.Its rackmount-optimized design ensures positive airflow, enhancing cooling and system reliability in server environments.Built to operate reliably in a 0 ~ 60°C (32 ~ 140°F) ambient temperature range, suitable for various industrial settings.
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Product
COM Express® Basic Size Type 2 Module with 6th Gen Intel Core™, Intel Xeon® and Intel Celeron® Processors (formerly codename: Sky Lake-H)
Express-SL2
Computer on Module
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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Product
1U Network Appliance With 12th/13th/14th Gen Intel® Core Processors For Network Security And Management For Network Security Applications.
FWA-3034
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12th/13th/14th Gen Intel Core Processors, up to 24 Cores/32 Threads, Hybrid Performance & Efficiency CoresDDR5 UDIMM with up to 64GB2 x 1GbE SFP, 8 x 2.5GbE RJ-45, 2 x 10GbE SFP+ with two pairs of LAN bypass2 x internal 2.5” SATA SSDs/HDDsIPMI v2.0 compliant BMC1 x Advantech network module expansion
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Product
Split Core Current Transformer
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Beijing GFUVE Electronics Co.,Ltd.
Have a "split" in the core that allows the CTs to open and be placed around the conductor without having to disconnect the conductor or disrupt the wiring.
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Product
3U CompactPCI Serial 9th Gen Intel Xeon®/Core™ i7 Processor Blade
cPCI-A3525 Series
Processor Blade
CompactPCI® Serial (PICMG CPCI-S.0) is a new modular computer standard officially adopted by PICMG in 2011. The CompactPCI Serial standard defines a completely new connector to support high-speed serial interfaces including PCI Express, SATA, USB and Ethernet. A CompactPCI Serial backplane has six high-speed connectors P1 to P6 on the system slot but only P1 is mandatory on peripheral slots, P2 to P6 being optional. A CompactPCI Serial system can comprise a total of nine blades (one system blade and eight peripheral I/O blades) through an Ethernet full mesh or single star architecture. The CompactPCI® Serial standard is the next-generation of the CompactPCI® specification and provides more flexibility and higher speed and bandwidth in modular system solutions.
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Product
14th Gen Intel® Core™ Ultra 7/5-Based Advanced Embedded Box PC
EMP-520 Series
Box PC
- 14th Gen. Intel® Core™ Ultra 7/5 Processors (Meteor Lake-H/U)- DDR5-5600MHz up to 96GB (48GB per DIMM)- 4x independent displays support EDID Emulation- 2x 2.5GbE, 1x COM, 6x USB ports, Type C Thunderbolt (optional)- 2 x Wi-Fi/BT/LTE antenna holes- M.2 2280 (SSD), M.2 3042 (LTE), M.2 2230 (Wi-Fi/BT)- VESA mount (optional)
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Product
4-slot Fanless Industrial System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, Front-access I/O, PCIe And PCI Slots
IPC964-512-FL
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The IPC964-512-FL is a 4-slot fanless barebone system with modular design and optimized expandability. The rugged industrial PC supports the high-performance 7th/6th generation Intel® Core™ and Celeron® processors with the Intel® Q170 chipset. The IPC964-512-FL features dual DDR4-2133 SO-DIMM slots with up to 32GB memory. For easy cabling and maintenance, the IP40-rated embedded system features a wide choice of front-accessible I/O interfaces, including two Gigabit LAN ports, four USB 3.0 ports, one VGA, one HDMI, one audio (Mic-in/Line-out), and three optional I/O modules - a 4-port isolated RS-232/422/485 module, an isolated 8-in/8-out DIO module, and a 2-port isolated RS-232/422/485 and 4-in/4-out DIO module. The compact industrial PC also provides four flexible PCI/PCIe expansion slots with three different combinations of expansion kits: one PCIe x16 and one PCIe x4; one PCIe x16 and one PCI; and two PCI. Additionally, it has a full-size PCI Express Mini Card slot for 3G/4G, GPS, Wi-Fi and Bluetooth connections, and comes with two easy-swappable 2.5” HDD trays for storage. To fit various industrial environments, the rugged modular industrial PC supports 24VDC (uMin=19V/uMax=30V) power input with a lockable terminal block-type connector and a wide operating temperature range of -10°C to +60°C.
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Product
Fanless Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, Vision I/O, 4-CH PoE And 4-CH LED Output
MVS900-512-FL
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The CAPA500 features the LGA1151 socket 7th generation Intel® Core™ processor family (codename: Kaby Lake) with 35W TDP (thermal design power), as well as the Intel® H110 chipset (Q170 optional). The CAPA500 supports one 260-pin DDR4-2400 SO-DIMM with a memory capacity up to 16GB for extensive storage. The compact 3.5-inch embedded motherboard also offers display outputs through HDMI, VGA and LVDS for triple independent display applications. Moreover, the compact-sized embedded board runs on +12 VDC power, supporting auto power-on. It can operate at a wide range of temperatures from -20°C to 60°C under active thermal control. The 146 mm x 104 mm embedded SBC is suitable for IoT/M2M-related, industrial control, self-service terminal, digital signage, POS, kiosk and many other applications where high-speed processing and graphics performance under limited space is required.
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Product
Open Pluggable Specification (OPS) Digital Signage Player With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor And Intel® H110
OPS500-501-H
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The OPS500-501-H is an OPS compliant digital signage player supporting dual displays with 4K at 60Hz resolution. The smart cableless open pluggable digital signage module is powered by the latest 7th/6th generation Intel® Core™ and Celeron® processors (codename: Skylake) with the Intel® H110 chipset, providing outstanding performance at a lower cost. It supports LGA1151 socket-type CPUs to offer greater flexibility for CPU selection. In addition, the OPS signage module has one 260-pin DDR4-2133 SO-DIMM socket with up to 16 GB memory capacity. The high-performance OPS500-501-H is a perfect solution for multi-display applications in airport information board, shopping mall, corporate, education, hospitality, religious organization, bank, retail store, restaurant, performing art center, and many more.
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Product
Common Rail Injector Tester
ICR-4 Tester
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ICR-4 tester is used to control electromagnetic and piezoelectric injectors used in the common rail injection systems. It is possible to control up to four injectors of a type at a time. The signal generated by the tester which controls the injectors, corresponds to the signal which appears in the car engine controller.
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Product
PICMG 1.3 Full-Size SBC With 14/13/12th Gen Intel® Core™ Processors And Intel® Q670E Chipset
NuPRO-E47
Single Board Computer
The NuPRO-E47 is a high-performance embedded single board computer that features with 14/13/12th Gen Intel® Core™ i7/i5/i3 processor and an Intel® Q670E Express chipset, which supports PCIe Gen 3. It comes equipped with 2 DIMM sockets that can support up to 64GB of Non-ECC DDR5 memory running at 4800MHz. The NuPRO-E47 also includes 6 SATA 3.0 ports with RAID support and 4 COM ports (including RS-232/422/485) for increased connectivity options. Additionally, the NuPRO-E47 supports Intel® PCIe bifurcation, allowing for flexible and efficient use of PCIe lanes. This single board computer is designed for use in a variety of industrial applications that require high-performance computing and reliable connectivity
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Product
Tilera GX72 Processor, 72 Core, Mid-size, AMC
AMC741
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The AMC741 is ideal for packet filtering, intelligent networking, multimedia, video transcoding, cloud and other applications. The device includes 72 identical processor cores (tiles) interconnected with Tilera’s iMesh™ on-chip network.
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Product
LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ ATX Server Board with 4 DDR4, 7 PCIe, 6 USB 3.1, 8 SATA3, Quad/Dual LANs, IPMI
ASMB-786
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- LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ i7/i5/i3 processors with C246 chipset- DDR4 2666/2400/2133 MHz ECC/Non-ECC UDIMM up to 128 GB- One Gen 3.0 PCIe x16 link (or two PCIe x16 slots with x8 link), two PCIe x4, and three PCIe x1 slots- Triple displays - DVI-D, VGA and HDMI 2.0 ports- Eight SATA3 ports and six USB 3.1 ports- Rackmount optimized placement with positive air flow design- 0 ~ 60° C ambient operating temperature range
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Product
PICMG 1.3 Half-size CPU Card With LGA1150 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q87, SATA3, USB 3.0, DVI-I/LVDS And Dual LANs
SHB230
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The SHB230 is high-performing PICMG 1.3 half-size single board computer.The SHB230 based on the Intel® Q87 PCH is designed to support 4th Generation Intel® Core™ i7/i5/i3 and Celeron® processors (codename: Haswell/Haswell Refresh) in the LGA1150 socket.The slot CPU card is equipped with two DDR3-1333/1600 SO-DIMM sockets with up to 16 GB memory capacity to meet customers needs.The PICMG 1.3 specification brings advantages of PCI Express to this single board computer that offers four PCIe x1 or one PCIe x4, and one PCIe x16 routed to the backplane.The onboard two SATA interfaces support RAID 0/1 functions to ensure reliable storage for multiple applications.Utilizing with the latest Intel® technologies, this PICMG 1.3 system host board is an ideal solution for DVR, medical equipment, industrial automation, process control, and network security market.
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Product
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
Computer on Module
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Product
Fanless Embedded System With 7th/6th Gen Intel® Core™, Pentium® And Celeron® Processor For Railway And Vehicle PC
UST500-517-FL
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The UST500-517-FL is powered by the LGA1151 socket 7th/6th generation Intel® Core™ and Pentium® processors up to 65W with the Intel® Q170 chipset. The integrated 16 PoE ports are available in RJ-45 or M12 connectors for IP cameras. It provides a full scope of power protection that includes intelligent vehicle power management technology for ACC on/off delay, shutdown delay, and over/under voltage protection. Enhanced by its robust structure and system design, the UST500-517-FL is able to operate under a wide temperature range from -40°C to +70°C and vibration endurance up to 3 Grms. This transportation embedded box is in compliance with ISO 7637-2 and EN 50155 for mobile surveillance applications. There are 16 Gigabit LAN ports which support 802.3at/af Power over Ethernet with a total power budget of 200W. Its DVI-D, HDMI and VGA interfaces support three surveillance monitors. Furthermore, its external accessible SIM card slot enables users to easily change SIM card for different telecommunication service. With wireless LAN modules, this user-friendly transportation embedded system can real-time transmits the video to the control center. The two built-in or four swappable SATA hard drives are used for mass storage of video files.
