Alignment
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Product
3U 12-slot VPX Backplane Aligned To SOSA 1.0
1OVX312AFQ-xxxx
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3U 12-slot backplane with profiles aligned SOSA. It is designed to meet the U.S. Army’s C5ISR Modular Open Suite of Standards (CMOSS), and supports high-speed signals on all data paths and VITA 67.3 and VITA 66.5 connectors.
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Product
SOSA Aligned Family Of Chassis Managers, VITA 46.11
79-V46-CHMC-x-CHMC-CMx-S1
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Designed to align with SOSA™, Elma’s VPX Chassis Manager assures the proper operation of the chassis and boards in defense embedded computing platforms. It monitors the health of the chassis, reports anomalies and takes actions when needed.
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Product
725-Watt (28VDC input) DC/DC Converter, SOSA™ Aligned, 3U VPX
VPX55HS
DC Converter
NAI’s VPX55HS-31 is NAI's latest +28 VDC Input, VPX DC/DC Converter. The VPX55HS was developed in alignment of the SOSA™ Technical Standard and is capable of handling up to 725 Watts of output power. It plugs directly into a standard 3U VPX chassis with a VITA 62 1.0” power supply slot. This off-the-shelf solution for VITA 46.0 and VITA 65 systems is compatible with VPX specifications; supports all VITA standard I/O, signals, and features; and conforms to the VITA 62 mechanical and electrical requirements for modular power supplies.
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Product
3U OpenVPX SOSA™-Aligned MFIO-Intensive Processing Board
68G6
Multifunction I/O
The 68G6 is a SOSA™-Aligned 3U OpenVPX board that can be configured with up to three NAI smart I/O and communication function modules. In addition to the standard expansion plane (EP) PCIe and control plane (CP) Ethernet control interfaces, the 68G6 facilitates convenient external access to supported NAI PCIe function modules through its 1 x1 PCIe interface, enabling seamless expansion of host SBC functions for enhanced project solutions, while also offering external access to supported NAI FMx modules via a SATA II interface. The 68G6 is on NAI’s certifiable product development roadmap supporting DO-178C and DO-254 design assurance guidelines for safety-critical applications. Ideally suited for rugged Mil-Aero applications, the 68G6 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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Product
3U 4-Slot OpenVPX Backplane Aligned To SOSA With 2 VITA 67.3 Aperture Slots
1SVX304AxP-xxxx
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Designed in alignment with the SOSA, Elma's 3U 4-Slot backplanes offer 4 Plug in Card (PIC) slots to support MOSA, CMOSS and HOST initiatives. It support high-speed signals on all data paths and VITA 67.3 connectors and VITA 66.5 optical connectors.
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Product
Large Substrate Mask Aligner
Model 6020
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The Model 6020 is a large substrate Production Mask Aligner or Auto-flood Exposure System for RDL First Level Advanced Packaging (PLP) and markets requiring exposure of large glass panels. It is engineered with OAI’s precision, reliability, and quality that is found in all of OAI’s products. The features include wedge effect leveling, superb process repeatability, ≤ 2.0µm printing resolution, and remote diagnostics. Using robotic handling, the system can stand alone or be fully integrated with photo resist processing.
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Product
SOSA Aligned LVDS with Optical I/O Kintex UltraScale FPGA - XMC
Model 71813
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Supports Xilinx Kintex Ultrascale FPGAs- Supports the emerging SOSA™ Technical Standard- PCI Express (Gen. 1, 2 & 3) interface up to x8VITA 42.0 XMC compatible with switched fabric interfaces- Optional front panel optical interface- Ruggedized and conduction-cooled versions available- Please refer to the product datasheet for Installed FPGA IP Module details
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Product
Type 39 CompacFrame Development Platform, 6 And 8 Slot 3U OpenVPX Aligned To SOSA
39S0xBWX94Y3VCC0
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Elma’s SOSA aligned CompacFrame is the next generation portable test platform designed to accelerate development and test of plug-in cards (PICs) aligned to the Open Group® SOSA™ Technical Standard. Accommodates up to 8-slot OpenVPX backplane.
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Product
Type 39 CompacFrame Development Platform, 2 And 4 Slot 3U OpenVPX Aligned To SOSA
39S0xBWX9ZY2VCC0
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Elma’s CompacFrame is the next generation portable test platform designed to accelerate development and test of plug-in cards (PICs) aligned to the Open Group® SOSA™ Technical Standard. Accommodates up to 4-slot OpenVPX backplane.
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Product
8-slots 25Gb backplane aligned to SOSA
1SVX308ABP-1X31
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3U 8-slots 25Gb backplane aligned to SOSA, with apertures for VITA 66/67 RF & optical modules.
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Product
Rugged Deployable, Rackmountable Chassis For 3U Cards Aligned To SOSA Or CPCI Serial
20037765
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This unit is a rack-mountable, rugged deployable chassis for use in harsh environments. The chassis has been designed to provide modularity and flexibility to support the full design life cycle of a system from initial concept and lab development through to qualification and full platform deployment.
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Product
3U 12-Slot Development Platform Aligned To SOSA 1.0 And CMOSS
39E12WUX98Y2VCM0-SOSA1
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3U OpenVPX development platform aligned with SOSA 1.0. It supports both SOSA and CMOSS profiles. It includes: 2 I/O intensive SBC, 7 primary payload, 1 radial clock, 2 switch and 2 power. Includes VITA 67.3 RF and optical I/O modules.
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Product
Tabletop Front & Backside Mask Aligner
Model 200IR
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The OAI Model 200IR Mask Aligner is a tabletop system that requires minimal clean room space. It is a cost-effective alternative for R&D or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The Model 200IR Mask Aligner is capable of one micron resolution and alignment precision. It has an alignment module which features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and z-axis.
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Product
MLA 300 Maskless Aligner
MLA 300
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The MLA 300 Maskless Aligner is engineered for high-volume production, delivering exceptional flexibility and precision in the realm of industrial lithography. This innovative tool supports wafers up to 300 x 300 mm and is capable of dynamically adjusting to surface variations, effectively eliminating the need for costly and time-consuming mask production. By employing direct data exposure instead of traditional masks, the MLA 300 provides advanced solutions for complex lithography challenges, including those encountered in advanced packaging, sensor calibration, and MEMS fabrication. With its high throughput of up to 18,000 mm²/min and resolution down to 1.5 μm, it streamlines workflows and integrates seamlessly with manufacturing execution systems (MES), making it the preferred choice for a broad range of applications like microfluidic devices and other cutting-edge technologies.
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Product
µMLA Maskless Aligner
µMLA
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The µMLA Maskless Aligner represents the pinnacle of tabletop maskless lithography technology, continuing the legacy of innovation established by the MLA family since its inception in 2015. As the entry-level solution built on the advanced µPG platform, it provides unmatched customization and flexibility, making it ideal for research and development applications. With features such as Raster Scan Mode and Vector Scan Mode, users can achieve variable resolution tailored to specific project requirements. This system excels in high-precision microstructuring applications, ranging from microfluidics and sensor fabrication to the intricate patterning of 2D materials and microlens arrays.
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Product
Virtex UltraScale+ HBM FPGA Processor - SOSA Aligned 3U VPX
Model 5586
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- Jade 5585 and 5586 FAQ- Co-processor for distributed FPGA processing tasks- High-Bandwidth Memory (HBM) delivers 20x more memory bandwidth than traditional DDR4 solutions- Board interfaces: 1 GigE, 10 GigE, 40 GigE, dual 100 GigE and PCIe- High-bandwidth memory, FPGA logic and DSP density make this board a single-slot 3U VPX proessing powerhouse- Features Xilinx Virtex UltraScale+ HBM FPGAs- 10 GigE Interface and 40 GigE Interface- Optional VITA 67.3C optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA 46, VITA 48.11, VITA 67.3C and VITA 65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled- Navigation Design Suite for software and custom IP development
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Product
DUV Mask Aligner
Model 200E
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OAI’S Model 200E DUV Mask Aligner performs all the functions of the tabletop Model 200 Mask Aligner but utilizes a 185nm Excimer Lamp as the UV light source. It is used for Biotechnology Processing.
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Product
8-Channel 250 MHz A/D with Virtex UltraScale+ HBM FPGA - SOSA Aligned 3U VPX
Model 5585
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- Jade 5585 and 5586 FAQ- Complete radar and software radio interface- Wideband data acquisition- Multi-channel, multi-board synchronization for high channel count systems- High-bandwidth memory, FPGA logic and DSP density make this board a single-slot 3U VPX processing powerhouse- Exceptional dynamic range and analog signal integrity- Features Xilinx Virtex UltraScale+ HBM FPGAs- Eight 250MHz 16-bit A/Ds- 10 GigE Interface- 40 GigE Interface- Dual 100 GigE UDP interface- Optional VITA 67.3C optical interface for backplane gigabit serial communication- Compatible with several VITA standards including: VITA 46, VITA 48.11, VITA 67.3C and VITA 65 (OpenVPX™ System Specification)- Navigation Design Suite for software and custom IP development
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Product
8 Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SOSA Aligned 3U VPX
Model 5550
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- Now available in RFSoC Gen 3 with the Model 5553- Supports Xilinx® Zynq® UltraScale+™ RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- 10 GigE Interface- 40 GigE Interface- Optional VITA 67.3C optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA 49, VITA 46, VITA 48, VITA 67.3C and VITA 65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Model 8256 3U VPX SOSA Aligned Development Chassis- Model 6001 unique QuartzXM eXpress module enables migration to other form factors- Video: Model 8256 3U VPX SOSA Aligned Development ChassisPentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Synchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPX- Please refer to the product datasheet for Installed FPGA IP Module details
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Product
FlexVNX+ 8-Slot Test And Development Platform Aligned To SOSA And VITA 90 Standards
39S08VPXZZY2VAND
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Elma’s all-new FlexVNX+ Test and Development chassis is the next generation portable test platform designed to accelerate development and test of VNX+ plug-in cards (PICs) aligned to The Open Group® SOSA™ Technical Standard and VITA 90.
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Product
High-Speed System Sync and Distribution Amplifier - SOSA Aligned 3U VPX
Model 5503
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- Supports Xilinx® Zynq® UltraScale+™ RFSoC FPGAs- Synchronizes up to 32 channels across four Quartz boards- Synchronizes sampling and data acquisition for multichannel systems- Provides single sample accurate synchronization between multiple channels and multiple boards- Synchronizes gating and triggering functions- Optional VITA 67.3D optical interface for backplane gigabit serial communication
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Product
3U 2-slot OpenVPX Backplane Aligned To SOSA™ - VITA 67.3c Aperture In Slot 2
1SVX302AMP-1X31
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Designed in alignment with SOSA, this 3U backplane offers 2 Plug-in Card (PIC) slots to support the DoD’s MOSA and CMOSS initiatives. The backplane supports high-speed signals on all data paths and VITA 67.3c aperture in slot 2.
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Product
3U OpenVPX™ SOSA™-Aligned SBC with Intel® Core™ i7-1186GRE Processor (Tiger Lake)
68INT6
OpenVPX
The 68INT6 is a SOSA™-aligned 3U OpenVPX Intel® Core™ i7-1186GRE Processor / integrated PCH-LP (Tiger Lake) w/ 4 Cores & 12M Smart Cache running up to 2.8 GHz Single Board Computer that can be configured with up to two Smart I/O and communications function modules (w/ NAI-XMC configuration option). Ideally suited for rugged Mil-Aero applications, the 68INT6 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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Product
3U 5-slots 25Gb Backplane Aligned To SOSA. AFT And VITA 48.8 Ready
1SVX306APP-1X31
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Designed in alignment SOSA, this 3U backplane offers 5 PIC (Plug in Card) slots supporting high-speed signals on all data paths and VITA 67.3 connectors and VITA 66.5 optical connectors.
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Product
3U OpenVPX SOSA™-aligned PWM Servo Motor Drive
68PW1
Servo Motor Drive
The 68PW1 is a 3U OpenVPX SOSA™-aligned (basis, Snapshot 2) single-axis PWM servo motor drive that can be configured with closed loop feedback measurement options including Hall, Resolver/Synchro or Encoder. The PWM drive provides programmable PWM output drive (up to 65 V @ 10 A continuous) from a single +28 VDC input source. Ideally suited for rugged Mil-Aero applications, the 68PW1 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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Product
3U OpenVPX™ SOSA™-Aligned Single Board Computer Intel® Xeon® W Processor (Tiger Lake)
68INT6H
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The 68INT6H is a SOSA™-aligned 3U OpenVPX Intel® Xeon® W Processor (Tiger Lake) w/ 8 Cores & 24 M Smart Cache running up to 2.6 GHz Single Board Computer that can be configured with up to two smart I/O and communications function modules (w/ NAI-XMC configuration option). Ideally suited for rugged Mil-Aero applications, the 68INT6H delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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Product
AI Optimized 3U VPX Development Platform For GPUs Aligned To SOSA
39S06NWX94Y3VCC0-6AUP
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Accelerate battlefield AI development with Elma's 7-slot CompacFrame chassis. It features six 3U slots aligned to SOSA, with meshed GPU connectivity and SBC-to-GPU coupling for testing tactical edge applications from concept to field-ready solutions.
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Product
IC-INT-VPX3l, SOSA™-Aligned 3U VPX Intel® Xeon® W SBC
IC-INT-VPX3l
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The IC-INT-VPX3l is a 3U VPX Single Board Computer based on the Intel® Xeon® W (code name Tiger Lake-H) processor and designed in alignment with the SOSA™ Technical Standard. This high-processing module is ideally suited for mil-aero applications and edge applications such as Mission Computer, Radar and Sonar HPEC.
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Product
6-Slots 25Gb Backplane Aligned To SOSA, With VITA 67.3D Aperture In Switch Slot, With Apertures For VITA 66/67 Modules
1SVX306ACP-1X31
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6-slots 25Gb backplane aligned to SOSA, with VITA 67.3D aperture in switch slot, with apertures for VITA 66/67 modules





























