Ground Bond Testers
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Product
Handheld Grounding Tester
HGT1
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The HGT1 is a handheld meter to measure ground impedance as well as step and touch voltages. Using the CPC 100 and CP CU1, test currents at variable frequencies can be fed into power cables or overhead lines safely to simulate a ground fault.
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Product
Bonding Tester
PTR1102
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In wire bonding in semiconductor manufacturing, electrodes are joined using gold wires of several tens of microns. In order to measure the pull (tensile) strength and ball shear (shear) strength of this gold wire, this machine has load detection accuracy and fine positioning accuracy. In addition, for the measurement of high load areas such as die shear strength and solder joint strength, this machine supports measurement in high load areas while maintaining accuracy in low load areas by replacing the sensor part.
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Product
PE/ Ground, Insulation Resistance Tester
Handheld
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The safety testers of the Handheld class are used to measure PE/ Ground resistances, insulation resistances and to perform a simple functional test. The small and sturdy universal testers are intended for standard-compliant safety tests in workshops and production as well as for mobile operation during repair, installation, service and more.
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Product
Earth Ground Testers
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Fluke''s family of earth ground testers have been built to address the entire spectrum of ground testing methods from the basic to the most advanced. Our testers have been designed to be accurate, safe and easy to use. We provide quick and precise resistance measurements through several test methods: 3- and 4-pole Fall-of-Potential testing, selective testing, stakeless testing and 2-pole testing. Detailed application information can be found at the Earth Ground Solution Center.
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Product
Ground Resistance Tester
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Weshine Electric Manufacturing Co., Ltd
1.Soil resistivity tester supports 2, 3 and 4wire grounding resistance measurement. 2. 4digit large LCD display with white screen backlight, suitable for use in dimly lit places. 3. IP65 protection grade, good waterproof, compact and portable, supports multiple functional tests.
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Product
Earth Bond Test Set
EC-12
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The Earth bond test is a basic safety test prescribed in many standards to test samples for the integrity of earthing continuity throughout the sample.
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Product
Neutrino Ground ISR
SX12 ISR1200
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The Neutrino SX12 ISR1200 is the inaugural series model. With a 1280×1024/12 µm resolution focal plane array (FPA), a 120 mm to 1,200mm CZ lens, and advanced image processing, it is the ideal OEM camera module for integration into long-range ground ISR, perimeter surveillance, border surveillance, and counter-UAS (CUAS) systems.
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Product
Heavy-Duty Circuit Tester With Grounding Adapters
30610
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Heavy-duty circuit tester with multiple options for connecting to a ground source. Long, 12’ cord has a quick coupler to securely connect clamp or power outlet plug. Large, strong clamp connects securely. Power outlet plug can always be used to provide ground in the cabin. For testing circuits up to 12 volts.
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Product
ESD Ground Point
EGP-020
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The EGP-020 ESD Ground Point is a convenient mechanical socket that can be mounted on to any equipment frame for equal-potential bonding to the equipment. The 4 mm socket is not insulated, made of lathed brass, nickel-plated, for use as grounding socket.The EGP-020 is designed to be mounted on an unpainted conductive surface.
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Product
Ground Cables and Clusters
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STB Electrical Test Equipment, Inc
STB builds, tests and repairs grounding equipment. Ground cables and clusters are built to each customer's specifications.
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Product
Bond Tester for Wafers 2 - 12 inch
Sigma W12
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Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Product
Temporary Bonding Systems
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Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, important for 3D ICs, power devices and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors. A device wafer is bonded to a carrier wafer with the help of an intermediate temporary bonding adhesive, allowing the typically fragile device wafer to be processed with additional mechanical support. After the critical processes, the wafer stack is debonded. EVG’s outstanding bonding know-how is reflected in its temporary bonding equipment, which has been provided by the company since 2001.
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Product
Scott Internal Bond Impact Tester
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The Scott Internal Bond Impact Tester is used to determine tear resistance (Elmendorf). A sample is torn with the help of the pendulum device starting from a predetermined cut. The work required for a tear of a given length is measured.
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Product
Bond Force Measurement And Calibration Systems
BFS-20
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Based on its design and easy handling it can be used also on other brands to measure the bond force.
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Product
Fusion Bonded Cable Jumpers
Series 152FB
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Fusion Bonded Cable Jumpers. Aries Series 152FB Fusion Bonded Cable Jumpers are flexible...plug them directly into PC boards or sockets. Stranded wire conductors are fusion bonded with an overcoat of tin for easy soldering or socketing. Each jumper is shipped with protective tabs on both ends for maintaining proper conductor spacing.
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Product
Ground Weather Analytics
HELIOS
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L3Harris Geospatial Solutions, Inc
Microclimates are on the rise, and as a result, there are extreme deviations of wind, snow, fog and visibility even over short distances. Organizations of all sizes need hyperlocal ground information and weather data to enhance operational efficiencies and make better decisions that can save time, money, property and even lives.
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Product
High Force Large Area Bond Tester
Sigma HF
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- For high force and large area- Typically for IGBT, power modules and batteries up to 1000 kgf- High axis speed- Deep access up to 80 mm- SEMI S2 safety cabinet with visual feedback- Flexible positioning of multiple work holders
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Product
Ground Fault Monitor
IFT-120
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Our ground fault monitors enable you to easily and quickly find the source of the fault before a major problem occurs and damages your equipment. This is the IFT-120, designed to assist you in rapid identification of ground faults.
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Product
Post Wire and Die Bond Inspection Machine
IV-T3300
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IV-T3300 is a post wire and die bond inspection machine with Dual JEDEC Tray Feeder System. It features a large inspection area of 600x500mm and a quick trays change of 5-7 seconds.
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Product
SAFE-T-GROUND - Ground Continuity Monitor / Control
TR-7
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Model TR-7 Safe-T-Ground provides continuous monitoring of a truck's ground connection throughout loading operations. Static electricity is often brought in by tank trucks entering the loading area. The Safe-T-Ground Model TR-7 instantly stops loading operations if a tank truck loses its ground.
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Product
Hybrid And Fusion Bonding Systems
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Hybrid bonding extends fusion bonding with embedded metal pads in the bond interface, allowing face-to-face connection of wafers. The main application for hybrid bonding is advanced 3D device stacking.
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Product
Leakage Current Tester and Clamp-On Earth / Ground Resistance Tester
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10µA Ultra High ResolutionLarge Conductor Diameter (30mm)AC Current in 5 Ranges (40mA, 400mA, 4A, 40A, 60A)Wide Frequency Response (40Hz-1KHz)ACA, ACV, Ω and ContinuityLarge 3¾ Digit LCD (4000 Count)40 Segment Fast Bargraph Display (20 times/sec.)Data Hold and Max / Min HoldRelative Measurement600 Vrms Overload Protection in Resistance Range
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Product
Medical Grounding Resistance Tester
2678YM
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Shenzhen Chuangxin Instruments Co., Ltd.
Medical Grounding Resistance Tester，Product Introduction2678YM Medical Grounding Resistance Tester Is Used To Measure The Internal Electrical Equipment Of Grounding Resistance,Which Reflects The (Contact) Resistance Of Total Grounding Terminal Of Electrical Equipment.It Suitable For Measuring All Kinds Of Motors,Electrical Appliances,Instruments,Household Appliances And Other Equipment Resistan
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Product
Ground Fault Monitors
IFT
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In most industrial settings, ground faults can cause significant damage. Since these leaks are unavoidable in almost all industrial environments, our ground fault monitors allow you to quickly and easily find the source of the leak before a major problem occurs and damages your equipment. The IFT-120 is designed to help you rapidly locate ground faults.
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Product
Ground Grid Systems
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The Ground Grid systems module enables engineers to quickly and accurately design and analyze ground protection. Flexible design methodologies allow for quick auto-designed layouts or very detailed schemes. Color-coded graphical plots provide impressive results.
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