Failure
See Also: Destructive
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Product
Failure Analysis – Materials
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Failure analysis – materials is the investigation into the background or history of a sample, or an event, to determine why a particular failure occurred. A product failure may include premature breakage, discoloration or even an unexpected odor. It is useful to know if this failure is a new, unique occurrence or if it has been an ongoing issue. The investigation can involve analyzing the sample as it currently exists and extrapolating from that data what may have caused the failure. A sample of the “good” vs. “bad” product may also be useful for comparison purposes.
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Product
Partial Load Failure
PLF Device
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The control device series “PLF” has been designed to monitor the partial and/ or total failure of the alternating current absorbed by loads driven by static switches and / or electromechanical relays.
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Product
Failure Analyziz and Quality Assurance
NX20
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There's no room for error in the data provided by your instruments. Park NX20, with its reputation as the world's most accurate large sample AFM, is rated so highly in the semiconductor and hard disk industry for its data accuracy.
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Product
Failure Analysis
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A partial list of our state of the art test equipment, applicable to these testing disciplines, will include the following: Two Scanning Electron Microscopes with EDS (SEM/EDS) Three Differential Scanning Calorimeters (DSC) Three Thermogravimetric Analyzers (TGA) Three Thermo Mechanical Analyzers (TMA) One Dynamic Mechanical Analyzer (DMA) Two Real-Time Fluoroscopic X-ray Systems, including a Microfocus System One Fourier Transform Infrared Microscope (FTIR) (capable of identifying a single particle of an unknown material) Two Ion Chromatographs (IC) (capable of identifying ionic impurities in ppm)
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Product
Failure Analysis
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Failure analysis on electronic components is a continuous challenging task. The smaller transistor dimensions, increasing functional complexity and changing device packaging styles requires new tools and skills for sample preparation, fault localization techniques, high resolution imaging and analysis.
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Product
Fatigue Failure Tester
EKT-2002FF
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EKT-2002FF Flexing Fatigue Tester is designed in accordance with ASTM D4482 to test the fatigue life under a tensile strain cycle on different kinds of vulcanized rubber compound to determine the fatigue life at various extension ratios.
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Product
Electronics Failure Analysis System
Sentris
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Due to the continued decrease in integrated circuit feature size and supply voltages, detecting and locating the miniscule amount of heat generated by failure sites has become increasingly difficult. Sentris pinpoints low-level infrared thermal emissions from IC faults such as short circuits and leakage current.
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Equipment Failure Diagnosis System and Safety Management System
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A system for diagnosing failures of rotating machinery such as turbines, motors, pumps, fans, and compressors, which are major facilities in nuclear power, hydropower, thermal power plants, petrochemical plants, shipbuilding, and aviation, through displacement sensors.
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Failure Analysis And Magnetic Imaging Services
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Micro Magnetics offers failure analysis services on a contractual basis. We maintain two current density metrology systems at our headquarters in Fall River and can produce maps of current flow in a wide variety of ICs and packages, usually with initial results delivered within 48 hours. Our engineers will work closely with you to understand and interpret the results in order to determine the root cause of the failure.
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Product
Failure Analysis Services
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Innovative Circuits Engineering, inc
Innovative circuits engineerin's failure analysis group performs root cause analysis on a wide variety of integrated circuit devices.
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Product
Failure Analysis
MicroINSPECT 300FA
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The MicroINSPECT 300FA is an automated wafer inspection tool used for semiconductor wafer failure analysis. Its small footprint, high speed, and low cost relative to its rich features yield a superb cost of ownership and makes this an ideal tool for your fab or failure analysis lab. The MicroINSPECT 300FA combines advanced robotics, wafer sorting, an intelligent wafer inspection microscope together with SiteVIEW Software to produce an integrated failure analysis tool.
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Benchmark, Competitive and Failure Analysis
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Helping you determine the root cause of product failures and evaluate products against industry competition and standards.We provide third-party verification and support for claims related to performance versus competition, root product failure cause, and benchmark industry performance. As an independent laboratory with over 60 years of product testing experience, our expertise helps you evaluate products for a variety of performance related characteristics. Additionally, we can provide expert witness legal testimony for insurance claims, CPSC filings, and civil/criminal court cases through our testing results and data.
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Product
Failure Analysis
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Failure Analysis (FA) plays a crucial role in the production of semiconductors. It provides process and design feedback to determine the root cause of any failures. Time-to-data for the FA Engineer is a critical measurement and SemiProbe’s Probe System for Life ® (PS4L) is ideally suited to excel in this application. All key components are interchangeable, making it easy to switch between individual die, wafers, and packaged parts.
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Product
Automatic Extensometer
SIE-560A/560SA
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To determine the suitability of a material for an application where it is under load, measuring its elongation is important. Measuring elongation enables determination of the elastic modulus (reversible elongation in the elastic region) by measuring the small initial elongation range, and determination of elongation at specimen failure, by measuring larger irreversible elongation in the plastic region. Shimadzu’s SIE-560A series automatic extensometers accomplish both of these measurements with high accuracy, and provide automated functions that increase testing efficiency and test reproducibility. Ideal for testing a wide variety of materials, including metallic materials, plastics, and composites, the SIE-560A series complies with ISO 527, JIS K 7161, and ASTM D638 standards for plastics tensile testing. In addition, the SIE-560A series supports strain-rate controlled metallic material tensile testing measurements specified in ISO 6892, JIS Z 2241, and ASTM E4
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Product
PPS Clamp Transformer
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PPS2 provides power supply to the PD detectors installed on HV cable when low voltage AC power is not available. The PPS2 takes the required power directly from the High Voltage power line under monitoring by means of units clamped on the HV power cable(s).PPS2 is designed to withstand High Voltage line failure events such as temporary overload and short circuit conditions. An internal detection and self limiting circuitry guarantees that PPS2 and the connected equipment survives in case of such events.
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Product
Robotic ESD Tester
SmartZap
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The SmartZap is a fully automated zap gun tester with automatic failure detection capability, providing far superior performance than manual zap gun test. It is complying IEC61000-4-2 test standard.
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Product
High Impedance Probes
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Everbeing offers GGB’s high impedance active probe for failure analysis of your devices. The high impedance with low capacitive design allows measurements of internal nodes without loading the device. For more information, please visit http://www.ggb.com.Everbeing offers GGB’s high impedance active probe for failure analysis of your devices. The high impedance with low capacitive design allows measurements of internal nodes without loading the device. For more information, please visit http://www.ggb.com.
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Product
Environmental Stress Screening (ESS) Chamber
ESS
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Developed to help electronics manufacturers detect product defects and production flaws, Environmental Stress Screening (ESS) forces infancy product failures that would otherwise occur after final assembly and product delivery. ESS’s goal is to improve profitability by eliminating defective products. ESS Systems can meet individual performance needs, product loading, and throughput requirements. Thermotron has the experience to provide the best solution for ESS testing at your company.
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Product
Attenuators
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Keysight Attenuators offer a compact, rugged design with exceptionally low insertion loss. Our latest design evolution sets new standards for size and performance. Keysight Attenuators provide excellent repeatability and safeguard your test platform from failures, downtime, and lost production. Discover which of our Attenuators best suits your test and measurement needs.
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Product
Digital I/O Modules
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ADAM-5000 DI/O modules are equipped with high density channels, isolation, short circuit protection, failure protection and hot swap functionality.
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Product
Position Sensors for Hazardous Environments
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Intrinsically Safe systems provide a safe operating environment for personnel and equipment. Intrinsic Safety (IS) is based on the principle of restricting the electrical energy transmitted into a hazardous area, thereby ensuring that anysparks or heated surfaces that may occur as a result of electrical failures areinsufficient to cause ignition. The threat of an explosion is eliminated.
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Product
Miliohm Meters
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Measures low resistance to detect faulty connections that degrade electrical system performance.Prevent electronic failures.
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Product
Ethernet To Fiber Optic Converters (Multi-Drop)
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Our advanced, rugged, industrial-grade, Fast and Gigabit Ethernet to multi-drop fiber optic converters are designed to cover large areas. These converters support up to 255 fiber nodes, and each fiber node can extend the Fast and Gigabit Ethernet data up to 100 miles or 160 km. Depending on the site situation, these multi-drop fiber optic converters can be configured as a daisy-chain or a self-healing redundant ring fiber network. When configured as a ring fiber network, the built-in self-healing feature allows the Ethernet data to be transmitted clockwise or counterclockwise; therefore, failure of any individual converter will not affect other devices located on the same fiber ring, making the entire Ethernet network more robust and reliable. These Fast and Gigabit Ethernet to multi-drop fiber optic converters have been designed for harsh industrial environments and withstand a wide temperature of -40°F to 185°F (-40°C to 85°C), and they come with the options multi-mode and single-mode, and ST, SC, FC, and SFP connectors.
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Belt Alignment
Belt Hog
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The Acoem USA Belt Hog uses the pulley groove as the reference, allowing you to achieve a precise belt alignment which reduces wear, bearing failures and vibrations.
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Product
Regenerative Battery Pack Test System
17040
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Conforms to international standards for battery testing: IEC, ISO, UL, and GB/T, etc.Regenerative battery energy discharge (Eff. >90%, PF >0.95, I_THD <5%)Multiple voltage and current ranges for auto ranging function to provide optimum resolutionHigh accuracy current/voltage measurement (0.05%FS/0.02%FS)2ms current slew rate (-90% ~ 90%)Dynamic (current/power) driving profile simulation tests for NEDC, FUDS, HPPCTest channel parallel functionTest data analysis functionData recovery protection (after power failure)Automatic protection for error conditionBattery simulator (option)High power testing equipment- Voltage range : 80~1000V - Current range : 0~750A - Power range : 0~300kWCustomized integration functions- Integrated temperature chamber - BMS data analysis - Multi-channel voltage/temperature recording
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Battery Monitoring System
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JUNXY Battery Monitoring Systems are designed in accordance with IEEE Battery Maintenance recommendations. This allows you to maintain a safe and secure system with Real-time monitoring, which will minimize the probability of a failure and optimize the service life of the battery. JUNXY Battery Monitoring Systems not only monitor the batteries, but also the external parameters which could affect the performance of the system, providing added security. It is a powerful tool for mitigating and preventing costly downtime due to unexpected system failure.
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Dynamic Test Systems
H3TRB | HTGB (HTGS) | RTGB (RTGS)
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Durability and reliability of wide-bandgap materials such as SiC and GaN are an important topic. The focus here is on new failure mechanisms whose effects are not visible with traditional H(3)TRB/HTGS – but which nevertheless have an influence on the real application.
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Product
Infrared Thermometer
6572
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Peaceful Thriving Enterprise Co Ltd
6572 Infrared (IR) Thermometer is the non-contact way to make safe and quick temperature checks on mechanical equipment, electrical circuits and building systems while in operation. Regular monitoring of heat (infrared energy) emitted from surfaces can prevent potential problems and failures.
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Product
Ultrasonic Leak Detector
ULD-410
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When equipment begins to fail due to an air or gas leak or vibration, or electrical discharge, the leakage point emits an ultrasonic sound wave that is above the natural range of human hearing. The ULD-410 Ultrasonic Leak Detector converts this ultrasonic sound into a signal that can be used to pinpoint the exact location of the equipment failure.
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Product
Remote RF Monitoring
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Critical communication systems are expected to work, without warning and without failure. But most system managers only see what’s happening when they’re on site or after users report a problem. Remote RF monitoring helps close that visibility gap by providing insight into system performance between site visits, allowing issues to be identified earlier before coverage, reliability, or service is impacted.
