Bump
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Product
Easy3DMatch
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Align a scanned 3D object with another scan or with a reference meshCompute the local distances between 3D scans and a golden sample or reference meshDetect anomalies such as misplaced features, geometric distortions, gaps, bumps,...Compatible with all 3D sensors that produce point clouds, depth maps or height maps
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Product
Cantilever Probe Card
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MPI Cantilever Probe Card is widely applied on gold bump and pad wafer testing for display driver, logic, and memory device. MPI’s cantilever probes are the corresponding answer to the demands of fine pitch, small pad size, high speed, less cleaning, multi-DUT, high pin count, and ultra-low leakage requirements. With outstanding craftsmanship, innovative architecture and proven methodologies based on mechanical and electrical simulation/measurement results, making MPI the top cantilever provider worldwide.
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Product
Wafer Sort
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TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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Product
Semiconductor
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Aerotech has a long history of engineering and manufacturing motion systems and components for high precision wafer processing, scanning electron microscopy (SEM), wafer bumping, 450 mm wafer manufacturing, lithography equipment and advanced laser micromachining. We also specialize in systems and components for vacuum applications, such as EUV lithography. So whether you need off-the-shelf wafer bumping components or a custom-engineered SEM system manufactured and tested to exacting specifications, Aerotech can provide the optimal solution for your application.
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Product
Analysis
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External appearance due to non-destructive semiconductor · X-ray fluoroscopic observation, SAT observation, electrical operation confirmation, ESD fracture analysis, plastic opening observation of Chip, search for abnormal portions by EMS / OBIRCH, package (PKG) analysis, Please do not hesitate to contact us anything related to semiconductor analysis, such as observation by polishing / parallel polishing (ball and bump observation etc.), peeling observation of defective part, analysis of foreign matter by EDX · FT - IR etc.
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Product
Nano-focus X-ray Inspection System
X-eye NF120
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Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
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Product
Shock Test System
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Labtone Test Equipment Co., LTD
Products are inevitably affected by impact, bump, free fall, tumbling etc. during production, transportation, loading and unloading as well as during the use of the products. All of these are transient excitation on the object, causing the object to produce mechanical characteristics of high speed, acceleration, strain rate instantly. These kind of characteristics are completely different from that in static load, and may cause problems to the object in terms of structural strength and stability and sometimes the object may fail. Therefore, it's necessary to study the effect of impact and reproduce the shock environment, to assess the structural strenghth and performance of the object under shock environment.
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Product
Optical VisionInspection System
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NIDEC-READ's inspection systems serve to locate open/leak circuits on printed substrates forming different conductor patterns within inner/outer layers. These vision inspection systems are also used to measure the shape of via holes and solder bumps and to find scratches and stains on them.
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Product
Scanning Acoustic Microscope
Pulse2
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This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
