Wafer Level Reliability
-
Product
Probe Card
T90™ Series
-
The 90 mm tile was designed for mounting on a standard 4.5″ probe card holder for multi-site wafer level reliability testing. The 1.6 mm (0.062″) thick rails allow the chassis to slip into planarity adjustable probe card holders for most analytical probe stations.
-
Product
Probe Card
VC43™/VC43EAF™
-
VC43™/VC43EAF™ probe cards offer a larger format version of the popular VC20. In addition to saving time, another advantage of the modularity is the ability to leave the interface in place and simply install the VC43™ topside using Celadon’s twist and lock insertion tool which minimizes the possibility of triboelectric or interconnect issues that can occur during typical probe card changes. The VC43™ can be used for production parametric test, modeling, characterization, and wafer level reliability testing. Cards can be configured up to 104 probes in either single or dual layer with near vertical probes to minimize scrub lengths on pads allowing the VC43s to probe pads as small as 30 microns.
-
Product
MPI Automated Probe Systems
-
MPI Advanced Semiconductor Test
MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.
-
Product
Semi-Automated Probe Stations
SPS 2600, SPS 2800, and SPS 12000 Series
-
The SPS 2600, SPS 2800, and SPS 12000 Series systems are MicroXact’s semi-automated probe stations designed to be flexible and easy to use when performing high productivity device characterization, wafer level reliability testing and failure analysis. These semi-automatic probe station systems are designed to support manual and semi-automatic probing of up to 200mm wafers.
-
Product
Probe Card
VC20E Series
-
The 20mm VC20 is a highly adaptable probe card solution for a wide variety of tests including Modeling & Characterization, Wafer Level Reliability or Parametric Test. It can be easily combined with different interfaces to create modular probe cards supporting Keithley, Keysight or other custom tester platforms. Probes can be configured in either single or dual layer.
-
Product
Multisite Probe Card
T300 ButtonTile™
-
The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
-
Product
Inspects MEMS and Wafer Level Devices
NorCom 2020-WL
-
The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
-
Product
Lighting Reliability
-
LED/OLED package lifetime is highly dependent on thermal management, and LED lamp performance can be dependent on the luminaire in which it is installed. Lighting reliability test system for LED/OLED Products are widely used for normal /accelerated aging, lumen maintenance measuring, lifetime evaluation and temperature characteristic testing for LED/OLED products including LED package, array, module, OLED module and luminaires.
-
Product
Wafer Level Test
-
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
-
-
Product
Wafer Tester
-
Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
-
-
Product
Wafer Bonder
AML
-
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
-
Product
Wafer Prober
Prexa
-
The latest fully automated 300mm wafer prober. The system offers excellent productivity and advanced functions, contributing to KGD (known good die) testing for advanced packaging.
-
Product
Production Wafer Level Burn-in
-
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
-
Product
Wafer Mapping Sensor
M-DW1
-
Panasonic Industrial Devices Sales Company of America
To provide better safety and improved sensing accuracy, Panasonic studied the requirements for future Wafer Mapping Sensors to ultimately develop the LED Beam Reflective Type Wafer Mapping Sensor, M-DW1. This Sensor uses LEDs as a light source for safe operation and a 2-segment receiving element for higher accuracy in wafer detection.
-
Product
Wafer Prober
Prexa MS
-
The latest fully automated 300mm wafer prober for memory devices. Featuring high rigidity and exceptional thermal control, the system enables full-wafer contact testing.
-
Product
Level Sensors
-
Sensor solutions for point level detection and continuous level measurement.
-
Product
Laser Levels
-
Shenzhen UYIGAO Electronic Technology Co., Ltd
UYIGAO laser level is a construction tool which measures levelness by projecting a red or green light beam onto a flat surface. Laser levels are used to deduct how level or straight a surface is by projecting a light beam across or around it.
-
Product
Wafer Prober
Precio octo
-
200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
-
-
Product
Laser Levels
-
Use a laser, an amplified, focused beam of light emitted from a solid-state device called a diode.
-
Product
Level Indicators
-
4B has a wide range of radio frequency (RF), rotary paddle and capacitance point level indicators for detecting high, intermediate, or low levels of liquids, powders and free flowing granular solids stored in tanks, bins, silos or other containers. Certain units can also be used as plug or choke detectors in chutes, conveyors and elevator legs.
-
Product
Photodiode Burn-in Reliability Test System
58606
Test System
The Chroma 58606 PD/APD Burn-in system is a high density, multifunction and temperature controlled module based system for photo diode burn-in and lifetime test. Each module has up to 256 Source Measurement Unit channels which can source current and measure voltage in various scenarios such as one described below. The system can accommodate 7 modules for a total of 1,792 device channels.
-
Product
Wafer Edge Profile Measurement
WATOM
-
WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
-
Product
System to Handle Wafer Levels
AMI AW Series
-
Operator-Free Wafer Inspection, Analysis and Sorting The AW Series are advanced high-capacity, high throughput automated wafer C-SAM® instruments specialized to deliver maximum sensitivity for the evaluation of wafer and device level applications.
-
Product
Laser Levels
-
Fast, accurate and portable, PLS laser levels save time and money versus traditional layout methods using a bubble vials, plumb bobs or complex measurements. Compare the benefits PLS laser tools: Beam quality will be bright, thin and crisp. Drop tested with water and dust Ingress Protection (IP). Designed for the professional contractor with self-leveling technology. Green Laser Levels, Rotary Lasers, Point Lasers and Line and Combo Lasers.
-
-
Product
Level Measurement
Level Measurement
-
AMETEK Sensors, Test & Calibration
B/W Controls uses the same advanced magnetostrictive technology as in Gemco products providing high accuracy and reliability for continuous liquid level measurement.
-
Product
Reliability Testing Services
-
Innovative Circuits Engineering, inc
Our Reliability Testing Services make it possible for us to work with many different customers who manufacture devices that need tests such as pressure pot, temp cycle and more.The focus of our reliability testing lab is to provide our customers with an array of services and tests that fulfill all of their reliability testing needs. Whether you need preconditioning, thermal shock, pressure pot, or many other reliability testing needs, we are happy to be of service.
