Wafer Level Reliability
-
product
Probe Card
T90™ Series
The 90 mm tile was designed for mounting on a standard 4.5″ probe card holder for multi-site wafer level reliability testing. The 1.6 mm (0.062″) thick rails allow the chassis to slip into planarity adjustable probe card holders for most analytical probe stations.
-
product
MPI Automated Probe Systems
MPI Advanced Semiconductor Test
MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.
-
product
Semi-Automated Probe Stations
SPS 2600, SPS 2800, and SPS 12000 Series
The SPS 2600, SPS 2800, and SPS 12000 Series systems are MicroXact’s semi-automated probe stations designed to be flexible and easy to use when performing high productivity device characterization, wafer level reliability testing and failure analysis. These semi-automatic probe station systems are designed to support manual and semi-automatic probing of up to 200mm wafers.
-
product
Probe Card
VC20E Series
The 20mm VC20 is a highly adaptable probe card solution for a wide variety of tests including Modeling & Characterization, Wafer Level Reliability or Parametric Test. It can be easily combined with different interfaces to create modular probe cards supporting Keithley, Keysight or other custom tester platforms. Probes can be configured in either single or dual layer.
-
product
Multisite Probe Card
T300 ButtonTile™
The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
-
product
Probe Card
VC43™/VC43EAF™
VC43™/VC43EAF™ probe cards offer a larger format version of the popular VC20. In addition to saving time, another advantage of the modularity is the ability to leave the interface in place and simply install the VC43™ topside using Celadon’s twist and lock insertion tool which minimizes the possibility of triboelectric or interconnect issues that can occur during typical probe card changes. The VC43™ can be used for production parametric test, modeling, characterization, and wafer level reliability testing. Cards can be configured up to 104 probes in either single or dual layer with near vertical probes to minimize scrub lengths on pads allowing the VC43s to probe pads as small as 30 microns.
-
product
Wafer Level Test
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
-
product
System to Handle Wafer Levels
AMI AW Series
Operator-Free Wafer Inspection, Analysis and Sorting The AW Series are advanced high-capacity, high throughput automated wafer C-SAM® instruments specialized to deliver maximum sensitivity for the evaluation of wafer and device level applications.
-
product
MultiSite Test sockets and Wafer Level
multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
-
product
Production Wafer Level Burn-in
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
-
product
RELIABILITY BOARD (Reliability Test Board)
The reliability test board is used for testing of HAST, THB, HTOL, BURN-IN, etc. It is a product that evaluates the environmental test and durability when applied to actual products such as lifetime test, high temperature, low temperature, high humidity and thermal shock
-
product
Wafer Testing
Trio Vertical
SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
-
product
Wafer Prober
Precio octo
200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
-
product
Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
-
product
Reliability Solutions
RT-300
RT-300 is a customizable ecosystem of connected insights, which empower plants and teams to proactively identify maintenance needs, make smarter decisions and keep machine performance and profitability at optimum levels.
-
-
product
Reliability And Durability Testing
Underwriters Laboratories Inc.
Our reliability and durability testing services provide an accurate assessment of how your product may perform under expected and unusual use. We can help you meet regulatory requirements, gain actionable knowledge about the anticipated life cycle of your products and identify design flaws that have adverse effects on a product’s reliability and durability.
-
product
MBP Reliability Module MOSRA - TMI
W8614EP
The W8614EP Model Builder Program (MBP)Reliability Module MOSRA - TMI includes the extraction package for MOS Reliability Analysis (MOSRA) and the TSMC Model Interface (TMI) aging model.
-
-
product
Reliability Testing Services
Innovative Circuits Engineering, inc
Our Reliability Testing Services make it possible for us to work with many different customers who manufacture devices that need tests such as pressure pot, temp cycle and more.The focus of our reliability testing lab is to provide our customers with an array of services and tests that fulfill all of their reliability testing needs. Whether you need preconditioning, thermal shock, pressure pot, or many other reliability testing needs, we are happy to be of service.
-
product
Level Transmitters
NOSHOK industrial submersible level transmitters are designed to withstand harsh applications. Our offering includes a small diameter (0.97") submersible level transmitter designed for hydrostatic level measurement for use in applications including bore holes and wells with small diameters. This sensor provides low power output signals for battery-powered applications, and an optional temperature output available. We also provide a cage-protected level transmitter ideal for harsh environments including sludge, slurries, tank monitoring, water & wastewater.
-
product
Level Quadrant
LIQUA
F. W. Breithaupt & Sohn GmbH & Co.KG
*Clinometer with robust housing*Quick adjustment of circle with eccentric bush*Illumination of circle and level*Graduation 6400-*Scale interval 1-*Measuring range +1000- bis .600-*Accuracy ± 0,5-*Made in Germany
-
product
Wafer & Die Inspection
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
-
product
Wafer Test
Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
-
product
Level Sensors
Level sensors measure the level of a medium in a tank or silo with different measuring methods.
-
product
Lighting Reliability
LED/OLED package lifetime is highly dependent on thermal management, and LED lamp performance can be dependent on the luminaire in which it is installed. Lighting reliability test system for LED/OLED Products are widely used for normal /accelerated aging, lumen maintenance measuring, lifetime evaluation and temperature characteristic testing for LED/OLED products including LED package, array, module, OLED module and luminaires.
-
product
Liquid Level Sensors
Are used to detect liquid levels or interfaces between liquids such as oil and water or liquids and solids. They can be defined as sensors or transducers, or as integrated systems with instrumentation and control capabilities.
-
product
Ultrasonic Level Sensor
2270
The type 2270 is a rugged, high performance ultrasonic level measurement sensor, having transducer and processing electronics incorporated in one single housing. It provides all the sophisticated echo detection features of the well accepted 2260 Ultrasonic Level Transmitters.
-
product
Sound Level Meters
A sound level meter is used for acoustic (sound that travels through air) measurements. It is commonly a hand-held instrument with a microphone. The diaphrahm of the microphone responds to changes in air pressure caused by sound waves.
-
product
Silicon & Compound Wafers
Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
