Computational Fluid Dynamics
qualitative and quantative simulation of fluid mechanics.
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Product
Computational Fluid Dynamics
CFD
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Computational Fluid Dynamics analysis is a value-added service from Teledyne Cormon that predicts pipeline flow and sand particle behavior for specific project scopes, allowing asset integrity teams to understand the optimal placement for erosion and corrosion monitoring probes.
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Product
Multiphysics Computational Fluid Dynamics (CFD) Simulation & Analysis
STAR-CCM+
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Siemens Digital Industries Software
STAR-CCM+ is a stand-alone simulation solution for computational fluid dynamics (CFD), computational solid mechanics (CSM), heat transfer, particle dynamics, reacting flow, electrochemistry, electromagnetics, acoustics and rheology. STAR-CCM+ delivers accurate and efficient simulation technologies through a single integrated user interface and automated workflows. This facilitates the analysis and exploration of complex real-world problems.
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Simulation
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From structural analysis and computational fluid dynamics to injection molding simulation and advanced, cloud-enabled capabilities powered by Abaqus, SOLIDWORKS® and 3DEXPERIENCE® Works Simulation provide integrated analysis tools for every designer, engineer, and analyst.
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Software
Coolit
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The world's easiest-to-use computational fluid dynamics (CFD) software for thermal management of electronics. Innovative, intuitive and powerful, Coolit guides the novice, yet imparts full control to the thermal expert.
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Fluids
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Computational Fluid Dynamics (CFD) Simulation Software. Ansys computational fluid dynamics (CFD) products are for engineers who need to make better, faster decisions. Our CFD simulation products have been validated and are highly regarded for their superior computing power and accurate results. Reduce development time and efforts while improving your product’s performance and safety.
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Product
Basic Heating Module
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Microwave heating analysis including loads rotation and translation, frequency tuning, heat flow and material parameters modification as a function of dissipated power. QW-BHM (Basic Heating Module) for QuickWave 3D provides a novel regime of operating the FDTD solver: the possibility of simulating microwave heating problems.The software has been prepared to work in sophisticated regimes, modelling rotation and movement of the heated load(s) even along complicated trajectories, etc. Transfer of the heat generated by electromagnetic fields can be modelled with external or internal Heat Transfer Module or by coupling QuickWave 3D simulations to external computational fluid dynamics packages.
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Fluids And Thermal
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Whether you’re an analyst performing advanced computational fluid dynamics (CFD) modeling or a design engineer who quickly needs to understand fluid or thermal effects on a design proposal, Altair offers a complete line of tools to support your project. From detailed component analysis to full systems performance, Altair provides a range of scalable solvers under Altair CFD™, as well as robust pre- and post-processing software for CFD.
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Testing & Measurement Services
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Delserro Engineering Solutions
Delserro Engineering Solutions is your complete source forHALT/HASS, Accelerated Life Testing, Environmental Testing, Lead Free Solder Joint Reliability Testing, Linear andNon-Linear FEA, Computational Fluid Dynamics (CFD)
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Product
COM Express Basic Size Type 7 Module with Intel Atom® C3000 SoC
Express-DN7
Computer on Module
The Express-DN7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Atom® C3000 processor (formerly “Denverton-NS”) system-on-chip (SoC). 16 CPU cores with 31W TDP and integrated 10G Ethernet make the Express-DN7 especially suited for customers who need excellent computing performance with low power consumption, such as edge computing applications, in a long product life solution.
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Product
SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
Computer on Module
The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
SMARC Short Size Module, Intel® Atom® X7000 Series (Amston Lake) Processors
LEC-ASL
Computer on Module
The ADLINK LEC-ASL is a SMARC module that supports 2/4/8 cores Intel® Atom® x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C (x7203C, x7405C, x7809C) Processors (formerly Amston Lake) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ASL modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that run 24/7.
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Product
OSM R1.1 Size-L Module Based On NXP® I.MX93 Series Processor
OSM-IMX93
Computer on Module
The OSM-IMX93 is an OSM R1.1 Size-L module featuring NXP® i.MX93 series processor with 2-core Arm Cortex-A55 & M33. With its in-SoC Arm Ethos U-65 microNPU, the module is made for edge solutions needing on-device AI processing at ultra-low power.
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Product
COM Express Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor (formerly codename: Alder Lake-P)
Express-ADP
Computer on Module
ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
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Product
COM Express Compact Size Type 6 Module with Up to Quadcore Intel® Core™ and Celeron® Processors
cExpress-WL
Computer on Module
ADLINK introduces its latest COM Express Type 6 modules to fulfill the needs of size, weight, and power (SWaP)-constrained edge computing applications. ADLINK’s cExpress-WL modules feature the 8th generation Intel® Core™ and Celeron® processors (formerly codenamed Whiskey Lake-U) with up to 4 cores and up to 64GB memory capacity, offering edge computing applications uncompromising performance and responsiveness despite SWaP constraints. The cExpress-WL is suited for applications such as data acquisition and analysis, image processing, and 4K video transcoding and streaming at the edge.
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Product
Compact Modular Industrial Computers Based On 14/13/12 Gen Intel® Core™ Processors
MVP-5200 Series
Industrial Computer
The MVP-5200 Compact Modular Industrial Computers powered by 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron processors. Featuring Intel R680E chipset and supporting up to 65W, the computers can also incorporate GPU cards in a rugged package suitable for AI inferencing at the Edge, and can be used for but not limited to smart manufacturing, semiconductor equipment, and warehouse applications.
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Product
COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)
Express-SL/SLE
Computer on Module
The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename "Skylake-H") with IntelR QM170, HM170, CM236 Chipset.
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Product
COM Express Compact Size Type 6 Module with Intel Pentium, Celeron N3000 Series and Atom x5 E8000 SoC (formerly codename: Braswell)
cExpress-BW
Computer on Module
ADLINK cExpress-BW provides two DDI channels (with up to 4K resolution) and one eDP or DDI3 channel supporting three independent displays, enabling it to drive multiple HD screens without the need for a discrete graphics card. In addition, LVDS is optionally available to support next generation displays. The cExpress-BW offers up to five PCI Express lanes x1. A wide range of operating systems are supported, including Linux, Windows 7 and 8.1u, Windows Embedded Standard 7, Windows Embedded Industry 8.1 and VxWorks.
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Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
Industrial Computer
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
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Product
COM Express
Computer on Module
COM Express, defined by the PCI Industrial Computer Manufactures Group (PICMG), is the most successful Computer-On-Module (COM) standard in the embedded market today. COM Express employs a mezzanine-based approach, whereby an off-the-shelve module with two 220-pin board-to-board connectors, plugs into a custom, application-specific carrier board.
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Product
COM Express Mini Size Type 10 Module with Intel Atom® x6000 Processors (formerly codename: Elkhart Lake)
nanoX-EL
Computer on Module
The ADLINK nanoX-EL is a COM Express Type 10 module that supports Intel Atom® x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE, x6414RE, x6412RE) as well as Intel® Pentium® and Celeron® N and J series processors (formerly Elkhart Lake) with integrated Intel® UHD graphics at a and high speed interfaces. nanoX-EL modules support LPDDR4 memory with in-band ECC up to 16GB, and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
COM-HPC Server Type Size D Module with Intel® Xeon® D-2700 Processor (formerly codename: Ice Lake-D)
COM-HPC-sIDH
Computer on Module
ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D-2700 processor and features integrated high-speed Ethernet for up to 8x 10G or 4x 25G combined with 32 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), and AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it offers precise control for hard-real-time workloads across all networked devices.
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Product
SMARC® 2.1 Short Size Module With NXP I.MX95
LEC-IMX95
Computer on Module
ADLINK LEC-IMX95, based on the powerful NXP i.MX95 (6x Arm Cortex-A55 + 1x Arm Cortex-M7 + 1x Arm Cortex-M33) processor with an integrated ISP and eIQ Neutron Neural Processing Unit (NPU) operating at up to 2 TOPS., is the latest SMARC revision 2.1 compliant module. It combines power-efficient high-performance compute, immersive Arm® Mali™-powered 3D graphics, innovative NXP NPU accelerator for machine learning, and high-speed data processing with safety and security features.
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Product
OSM R1.1 Size-L Module Based On MediaTek Genio 510 Series Processor
OSM-MTK510
Computer on Module
The OSM-MTK510 is an OSM R1.1 Size-L module featuring the advanced MediaTek Genio 510 series processor. Equipped with a dual-core Arm Cortex-A78 and a quad-core Cortex-A55, it boasts an impressive MediaTek DLA+VPU AI engine capable of up to 3.2 TOPS, making it ideal for edge AI applications. This module excels in providing edge AI processing at ultra-low power consumption.
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Product
SMARC Module
LEC-MTK-I1200
Computer on Module
The ADLINK LEC-MKT-I1200 is a SMARC module powered by the MediaTek MT8395 SoC with 4x Arm Cortex-A78 and 4x Cortex-A55 cores and up to 5 TOPS APU. The module incorporates a spate of IoT technologies, such as on-device artificial intelligence (AI) capabilities and support for up to 3 cameras, while delivering a low power envelope, making it the ideal solution for robotic and drone applications across various sectors, including consumer, enterprise, defense, industrial, logistics, and more.
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer (Code name: Skylake)
MVP-5000 Series
Industrial Computer
The MVP-5000 Series provides an optimal balance of price and performance in a compact construction. Incorporating 6th Generation IntelR Core? processors, the MVP-5000 features computing performance boosted by up to 30% over previous generation-processors. Integrating the front-mounted industrial I/O and fanless construction featured in ADLINK?s proven Matrix line, and rich LGA 1151 socket type CPU selection, the MVP-5000 Series is ideally suited to a wide variety of machine, factory, logistic automation, and general embedded applications.
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Product
COM Express® Basic Size Type 6 Module with Up to Hexacore 8th Gen Intel Core™ 8000 Series and Intel Xeon® Processors (formerly codename: Coffee Lake-H)
Express-CF/CFE
Computer on Module
The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Product
COM Express Type 7 Basic Size Module with Intel® Xeon® D-1700 Processor (formerly codename: Ice Lake-D)
Express-ID7
Computer on Module
ADLINK’s Express-ID7 COM Express Type 7 Basic Size module is based on the Intel® Xeon® D-1700 processor and features integrated high-speed Ethernet for up to 4x 10G combined with 16 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it provides precise control of hard-real-time workloads across all networked devices.
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Product
ETX Module with Intel Atom® Processor E3800 Series SoC (formerly codename: Bay Trail)
ETX-BT
Computer on Module
The ETX-BT is based on the latest Intel Atom® processor E3800 SoC series, adopting the latest 22nm process technology with 3-D Tri-Gate transistors featuring significant improvements in computational performance and energy efficiency. The E3800 SOC series integrates processor and GPU cores and all I/O on a single chip. Processor performance is scalable from a single-core Intel Atom® processor E3815 at 1.4GHz to a quad-core Intel Atom® processor E3845 at 1.9GHz. Two quad-core Intel® Celeron® processors, based on the same microarchitecture, are also available.
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Product
PICMG® 1.3 Full-Size 6th generation Intel® Core™ i7/i5/i3 LGA1151 Processor-based SHB (Code name: Skylake)
NuPRO-E43
Single Board Computer
The ADLINK PICMG 1.3 SHB, the NuPRO-E43, supporting the 6th Gen IntelR Core i7/i5/i3 processor and equipped with the IntelR Q170 Express chipset. The NuPRO-E43 supports high-speed transfer interfaces such as PCIe3.0, USB 3.0, and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133 MHz memory up to 32 GB.
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Product
Extreme Rugged PC/104 Single Board Computer with Intel® Atom™ Processor System-on-Chip
CM1-BT1
Single Board Computer
The CMx-BTx is a PC/104-based, Single Board Computer (SBC), fully compliant with the PCI-104 Specification, Version 1.1 and partially compliant with the PC/104 Specification, Version 2.6. PC/104 SBCs are very compact and highly integrated computers. This SBC features the 22nm, Intel® Bay Trail SoC. The board provides a DDR3L SO-DIMM socket, a PC/104 connector, a PCI-104 connector, two USB 2.0 ports, one USB 3.0 port, up to two Gigabit Ethernet ports, up to two SATA 3 Gb/s ports, one dedicated HD-Audio panel connector, one VGA port, one LVDS port, up to four COM ports, one mini-PCIe slot (with one USB 2.0 port included). The CMx-BTx can be run with only 5 volts and is capable of running operating systems like DOS, Windows XP/7/8 in either 32-bit or 64-bit configuration, Linux, VxWorks, and others. Another feature included on the board is a fail safe BIOS that enables the user to start the module even if the original BIOS is corrupted.
