Sockets
receive conductors.
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Product
Test Sockets
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Smiths Interconnect offers a wide range of spring contacts and design standards for high quality test sockets providing flexibility and fast delivery for optimal cost/performance ratio.
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Product
LGA Sockets
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We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.
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Product
Test Sockets
Non Standard
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Chances are good Ardent can help you with that. We can adapt our technology to just about any package, device or module. Small volumes of custom sockets for higher bandwidth applications are a niche all in their own, and our engineering team has many years of experience designing custom sockets for all kinds of applications.
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Product
Test Sockets
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socket design as per customer specificationsquick + easy socket changehigh-performance spring probesdesigned for high frequency up to 16 GHz-55C/-67F to 150C/302F temperature rangemanual/automatic application optionssmall socket footprintone socket base for each insert (3x3 to 9x9 QFN)one-click switch from engineering to production socket modedevice dependent standard socket frame with changeable insertmore than 500,000 compression cyclesKelvin test applicabilitytool-free insert + actuator exchanges0.3 mm minimum lead pitchQFP extender available
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Product
Custom Test Connectors and Sockets
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Custom test sockets are traditionally expensive to build and maintain. To reduce these costs, consider: Using rapid prototyping techniques to build a housing. Using replaceable Z-Axis Connectors. Depending on board layouts and compressed height, these sockets or test fixtures can achieve high numbers of mate/de-mate cycles and operate at GHz frequencies.
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Product
DU Sockets
445012
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DU bushings are rolled dry sliding bearing bushings and also serve to properly guide the guide pins into the pin carrier plate.
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Product
Module Sockets
Ardent Optical Engine
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The scalability of SP connector technology is enabling the next generation of optical device IC manufactures to allow for solder-less high speed optical Electrical Module replace-ability. These connectors offer high speed input data rates in cost effective and real-estate friendly form factors.
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Product
Sockets
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Ironwood Electronics Sockets – Embedded gold plated wire elastomer (SG) – Stamped & Etched spring pins (SBT) – Embedded silver ball elastomer matrix (SM/SMP)– Compressible silver button in polyimide (GT/GTP)– Surface mount adapters for sockets (SF)
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Product
QFN Sockets
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With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.
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Product
Test Sockets
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Yamaichi Electronics Co., Ltd.
A test socket is the ideal point to test your home’s internal phone wiring for faults. You can also use it to identify any potential faults with the phone line outside. Your test socket is located in your master socket. It is the point between the internal phone wiring in your house and the phone line outside. That means by plugging into your test socket you can bypass all the internal wiring and test your device directly on the phone line.
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Product
Test Sockets
MEMS Device
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Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications
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Product
Aspen Sockets
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Ironwood Electronics’ Aspen line of sockets are designed in standardized stepped footprint configurations, incorporating industry standard high performance spring pins. Sockets can be designed to work with any type of IC package; BGA – LGA – QFN – DFN and even leaded devices where you have minimal space to fit a socket in place of your device to allow fast, easy testing and development.
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Product
Off-Set Kelvin Test Sockets
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This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that's flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm.
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Product
High Performance Chipscale Test Sockets
SC
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Ardent Concepts Test Sockets for ATE test deploy patented SC Contact Sets. This technology is capable of over 2 Million mechanical insertions in production environments and uses easy to replace pins with no complicated assembly procedure. It is designed to be drop-in compatible with 1mm offset and straight through footprints to ease implementation, and RC SC’s simple and robust design is extremely cost effective when compared with existing “roll” type test contactors and sockets. Designed specifically for JEDEC QFN and MLF applications, SC High Performance Test Sockets are available for most handler set-ups and offer exceptional AC performance.
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Product
Smart Sockets
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Ironwood Electronics extended its high performance socket product line with smart features. Sockets are typically rated for 2K to 500K cycles. How do we know if the sockets are used for 100K or 200K insertions? Solution is electronic chip insertion counter. Our sockets can be integrated with electronics counter into the compression mechanism of the socket lid. A push button is exposed on the compression plate. Every time a chip is compressed, push button is actuated which in turn activates the electronic circuitry inside the lid. These activations are counted by the counter IC and displayed in LCD. Let’s say a contact element is rated for 2K insertions. After 2K insertions, this contact element will be replaced by new contact element. Now, the counter has to start the counting from the beginning. To achieve this function, a reset option is included in the electronics circuitry. When reset is actuated, LCD display will go to “0”.
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Product
Qualification Hardware & Sockets
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Reltech Limited holds over 35 years’ experience in the design and manufacture of all types of qualification test hardware. Our advanced technology products include: HTOL Boards (Mother and Daughter cards) Burn-In Boards HAST Boards THB (humidity) Boards Burn-In Modules and frames Dynamic Driver cards (Digital, Analogue and Mixed signal) Back Planes Voltage regulator cards Custom electro-mechanical assemblies DUT Cassettes and test Fixtures
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Product
GHz Elastomer Sockets
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Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
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Product
Open Top BGA Sockets
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Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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Product
BGA Sockets
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Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Product
Fine Pitch Connector Test
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C.C.P. Contact Probes Co., LTD.
Our Ceramic/Aluminum sockets have a lifetime of up to 30,000 cycles.
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Product
Thin Mini-ITX SBC With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 Processor, DisplayPort++, HDMI, LVDS, VGA, USB 3.0, M.2 And Dual GbE LAN
MANO521
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The MANO521 is a thin mini-ITX motherboard powered by the LGA1151 socket 9th/8th generation Intel® Core™ i7/i5/i3 (code name: Coffee Lake) with Intel® H310 chipset or optional Intel® Q370 chipset. This Intel® Coffee Lake-based motherboard provides rapid video acceleration advantage, multiple expansion interfaces and triple-view capability. It is designed with rich functionality, solid performance in a small footprint, making it suitable for a broad range of performance-driven embedded applications such as industrial automation, transportation, self-service kiosks, medical, and digital signage. The MANO521 features two high bandwidth 260-pin DDR4-2400/2666 with a memory capacity up to 32GB. It offers two SATA-600 sockets and one M.2 Key M 2242/2260/2280 connector for storage. The thin mini-ITX motherboard also provides various expansion interfaces within its limited dimensions including one PCIe x4, one full-size PCIe Mini Card slot and one M.2 Key E 2230, which offers diversity and flexibility for application integration. Moreover, the mini-ITX embedded board has a built-in DC Power Jack or ATX connector supporting 12V and 19 to 24V DC input with AT mode auto power function.
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Product
Ethernet Digital Interface
Model 8063
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* Provides 48 high-power TTL I/O lines that can sink 48 mA or source 24 mA. * Easily interfaces to TTL or CMOS signals and contact closures. * User can configure the data bytes as inputs or outputs.* Transfer data as bits, bytes or data strings.* Transparent data transfer mode.* Fully VXI-11 Compliant plus Raw Socket for easy programming with Visual Basic or C, Agilent VEE and LabVIEW.* 1 U high rack mount kit mounts one or two 8063s.* Includes 100-230 VAC Power Adapter with universal plugs.
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Product
Training Board
1500
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The TESCO Training Boards were designed to create different problematic installation scenarios that a meter technician may encounter at an installation. The Training Boards are comprised of three independent meter sockets (Forms 1S, 2S and 12S) on the front of the board (trainee side). The back of the Training Board has three control panels, one for each socket, with switches that will create the different scenarios, in which the trainee must troubleshoot. TESCO Training Boards are the perfect solution for training new employees or to use as a refresher for senior meter technicians.
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Product
Go No Go Gauges
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Shenzhen Bonad Instrument Co., Ltd.
BONAD’s Go No Go Gauges comply with BS1363, UL 498, EN 50075, VDE0620-1 and other standards. We have a variety of gauges to ensure that all kinds of sockets and plugs work properly and safely. For more information, please contact us, BONAD will provide you with professional technical advice and high-quality testing equipment.
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Product
RF Device Test Socket
Coaxial Socket
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With unparalleled technology, coaxial structure and high-precision machining equipment, LEENO can provide RF test socket with high bandwidth, impedance matching and high frequency up to 100Ghz.
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Product
Film Frame Test Handler
4170-IH
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High throughput ・High withstand load, and high thrust table ・Expansion of the strip attachment area ：260(L) X 300(W) [Withinφ300mm for WLCSP]・LOT control by barcode/2D code reader ・Easy device type exchange only test socket and display screen setting・Auto-cleaning function unit is installed to clean the socket at any desired timing.・8/12 inches ring conversion ・S2/S8 regulation compliance・SEMI G85 compliance・SECS/GEM compliance
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Product
Inverter Socket
Series 6621
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Inverter Sockets. Inverted configuration allows the socket to be wave soldered on the component side of the PCB and the device socketed through a window on the solder side of the PCB. Available on .600 [15.24] centers. Consult factory for other sizes.
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Product
Single Processor VPX Payload Blade
VP62106
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LinkedHope Intelligent Technologies Co.,Ltd.
VP62106 is a single processor VPX payload blade based on the Intel® 3rd generation CoreTM i3/i5/i7 platform. It enables the highest performance available in 6U VPX form factor with two PCI Express 3.0 x8 lanes in the VPX Data plane for workstation and compute intense applications.Two x8 PCI Express ports with up to 8GB/s throughput offer a high performance interface to mainstream peripherals and I/O boards.With a SO-DIMM socket dual channel DDR3 design running up to 1600MT/s, the VP62106 offers the ability to fit harsh environments while maintaining maximum memory throughput and supporting memory expansion using the latest SO-DIMM technology. Moreover, the 3rd generation CoreTM processors offer increased cache size and efficiency as well as instruction set improvements which make the VP62106 a high performance compute engine with outstanding floating point and vector processing performance.
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Product
Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, 4 PoE, 4 USB 3.0, And Real-time Vision I/O
IPS960-511-PoE
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Featuring a multi-core CPU, IP40-rated rugged design, camera communication interfaces, real-time vision-specific I/O with microsecond-scale and LED lighting control, the IPS960-511-PoE provides an all-in-one solution that addresses the needs across various machine vision platforms and automatic inspection cases. The IPS960-511-PoE is powered by the LGA1151 socket the 7th & 6th generation Intel® Core™ (codename: Kaby Lake/Skylake) and Celeron® processors (up to 65W) with the Intel® H110 chipset. The intelligent vision system comes with dual DDR4-2133/2400 un-buffered SO-DIMM sockets for up to 32GB of system memory as well as supports rich camera interfaces for connecting industrial cameras, including four IEEE802.3at PoE LAN ports and four USB 3.0 ports. Its vision I/O integrates a full range of isolated I/O interfaces and real-time controls essential to machine vision applications, including trigger input, LED lighting controller, camera trigger, as well as an encoder input for conveyor tracking. The IPS960-511-PoE also supports lighting dimming control to identify object characteristics for different inspection. Two easy-swappable 2.5" HDDs are available for extensive storage needs.
