Sockets
receive conductors.
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Custom Sockets
Plastronics socket designs range from off-the-shelf sockets ready for immediate delivery, semi-custom sockets that utilize universal components and totally custom one-of-a-kind sockets and fixtures.
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Test Sockets
QFN/QFP
For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs
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Smart Sockets
Ironwood Electronics extended its high performance socket product line with smart features. Sockets are typically rated for 2K to 500K cycles. How do we know if the sockets are used for 100K or 200K insertions? Solution is electronic chip insertion counter. Our sockets can be integrated with electronics counter into the compression mechanism of the socket lid. A push button is exposed on the compression plate. Every time a chip is compressed, push button is actuated which in turn activates the electronic circuitry inside the lid. These activations are counted by the counter IC and displayed in LCD. Let’s say a contact element is rated for 2K insertions. After 2K insertions, this contact element will be replaced by new contact element. Now, the counter has to start the counting from the beginning. To achieve this function, a reset option is included in the electronics circuitry. When reset is actuated, LCD display will go to “0”.
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Test Sockets & Interposers
Silmat
Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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MultiSite Test sockets and Wafer Level
multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Burn-In Test Sockets
The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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GHz Elastomer Sockets
Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
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Module Sockets
Ardent Optical Engine
The scalability of SP connector technology is enabling the next generation of optical device IC manufactures to allow for solder-less high speed optical Electrical Module replace-ability. These connectors offer high speed input data rates in cost effective and real-estate friendly form factors.
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BGA Sockets
Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
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Open Top BGA Sockets
Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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High Performance Chipscale Test Sockets
SC
Ardent Concepts Test Sockets for ATE test deploy patented SC Contact Sets. This technology is capable of over 2 Million mechanical insertions in production environments and uses easy to replace pins with no complicated assembly procedure. It is designed to be drop-in compatible with 1mm offset and straight through footprints to ease implementation, and RC SC’s simple and robust design is extremely cost effective when compared with existing “roll” type test contactors and sockets. Designed specifically for JEDEC QFN and MLF applications, SC High Performance Test Sockets are available for most handler set-ups and offer exceptional AC performance.
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Relay Sockets & Accessories For Power Relays
Suitable for 35mm rail (DIN), wall or PCB mounting, timer modules, key receptables and retaining clips. See below for all models/series.
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Sockets
Ironwood Electronics Sockets – Embedded gold plated wire elastomer (SG) – Stamped & Etched spring pins (SBT) – Embedded silver ball elastomer matrix (SM/SMP)– Compressible silver button in polyimide (GT/GTP)– Surface mount adapters for sockets (SF)
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Test Sockets
Non Standard
Chances are good Ardent can help you with that. We can adapt our technology to just about any package, device or module. Small volumes of custom sockets for higher bandwidth applications are a niche all in their own, and our engineering team has many years of experience designing custom sockets for all kinds of applications.
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Dual Intel® Xeon® E5-2600 v3 Family 40G Ethernet AdvancedTCA® Processor Blade
aTCA-9710
- Two Intel® Xeon® processor E5-2600 v3 family (12C/24T)- 16 memory sockets support DDR4-2133 REG/ECC VLP RDIMM up to 256 GB- Intel® C612 PCH- Dual Intel® XL710-AM2 40GBASE-KR4 Fabric Interface channels- Support Intel® DPDK and Node Manager 3.0
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Temperature Transmitter
T0418
For exacting interiors in building energy management and HVAC systems. Are designed for easy installation on ordinary KU68 wiring boxes for household switches and sockets.
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Open Pluggable Specification (OPS) Digital Signage Player With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170 And Intel® AMT 11.0
OPS500-501
The OPS500-501 is a 4K resolution OPS compliant digital signage player supporting Intel® Active Management Technology (AMT) 11.0 for better remote management. The space-saving OPS signage module is powered by the 6th generation Intel® Core™ processor with Intel® Q170 chipset. It has one 260-pin DDR4-2133 SO-DIMM socket with up to 16GB memory capacity. Compliant with the Intel® OPS architecture, the 4K-ready signage player provides a high level of compatibility as well as simplified installation, maintenance and deployment for a lower total cost of ownership. The outstanding digital signage player, the OPS500-501, is connected to OPS-compliant display via a standardized JAE TX-25A plug connector that supports DisplayPort, HDMI 2.0, UART, audio, USB 3.0 and USB 2.0 signals. To meet various application needs, the powerful digital signage system offers rich I/O interfaces on its front panel, including one USB 2.0 ports, two USB 3.0 ports, one COM port, audio (in/out), HDMI and a Gigabit Ethernet port. This space-saving OPS signage player has one PCI Express Mini Card slot for WLAN connectivity and features one 2.5” SATA HDD for extensive storage needs.
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Single Port Serial Interface
APCI-7300-3
*PCI interface to the 32-bit data bus. *Asynchronous communication adapter, 1-port serial interface*1 socket for SI modules*Modular structure through SI modules*Configurable as: RS232, RS422, RS485, with or without isolation, or 20 mA Current Loop (active, passive) with isolation*Addressing through software
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8.25mm (0.32") Digit Height
DPM 2AS-BL
The DPM 2AS-BL is an ultra-miniature 31/2 digit LCD voltmeter with 8.25mm (0.32") digit height and LED backlighting. It features a negative rail generator which enables the meter to measure a signal referenced to its own power supply GND. The meter plugs directly into a SIL socket or can be snapped into a panel. Connection to the meter is via two rows of pins
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3.5 Inch SBC with 7th Gen Core i7 CPU and PCIe/104
VENUS
Based on the “Kaby Lake” 7th generation Core i7 processor, Venus offers high CPU performance in a small form factor rugged SBC with modest power consumption. It incorporates a full suite of rugged features such as soldered memory, latching connectors, a thicker PCB, and true -40/+85ºC operating temperature, making it suitable for the most demanding vehicle applications. High I/O density, multiple expansion sockets, rugged design, modest power consumption of 14W, and wide temperature operation combine to make Venus an extremely attractive option for applications requiring high CPU performance or ruggedness.
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StellarNet Spectrometer Models
StellarNet miniature spectrometers are portable & compact fiber optic instruments for UV, VIS, and NIR measurements in the 190-2300nm range. The StellarNet series of miniature spectrometers is a step up in low cost instrument design, offering CCD 2048 & PDA 512/1024 detectors. The units are engineered to have no moving parts, no detector sockets, ruggedized aluminum enclosure, and an integrated A/D digitizer for unmatched durability and quality that out performs any instrument in its class. Numerous models offer standard or high resolution (HR) optics for selected spectral ranges.
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Mini-ITX SBC With AMD G-Series APU, AMD A55E, HDMI/VGA/LVDS, Dual LANs And SATA-600
MANO120
The MANO120, a graphics-rich Mini ITX motherboard is based on the new AMD G-Series APU dual core T56N with AMD A55E FCH. Integrated with Radeon™ HD 6320 graphics with DirectX 11 technology, the MANO120 offers advanced 3D graphics and dual views via VGA and HDMI connection on the rear I/O, as well as onboard 18 bit single channel LVDS interface. The onboard SO-DIMM socket supports up to 4 GB of DDR3 1333 memory. It also has a wide range of storage with five SATA-600 ports and a mainstream CFast™ slot. To satisfy expansion capability requirement for industrial application needs, the MANO120 comes with one PCIe x4 slot and one PCI Express Mini Card slot. With advanced performance in both computing and graphics, this industrial grade motherboard meets the requirement of system developers in the gaming, digital signage, DVR, and NVR.
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Ethernet Digital Interfaces
Model 8063
All of ICS's Ethernet Digital Interfaces are user configurable and let you transfer data as bits, bytes, as strings of bytes or transparently. All data lines are high power TTL outputs or floating inputs with pullup resistors for sensing CMOS signals or switch contacts. All interfaces conform to the IEEE-488.2 Standard, are VXI-11 compatible and/or support TCPIP Raw Socket protocol.
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Pin-Line™ Collet Socket with Wire Wrap Pins
Series 0503
Pin-Line Collet Sockets with Wire Wrap Pins. Features: Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for .100 [2.54] grid or matrix patterns. Available with wire wrap or solder tail pins. Consult Data Sheet No. 12013 for solder tail pins. Break feature allows strips to be cut to the number of positions desired.
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RF Socket
With unparalleled technology, coaxial structure, and high-precision machining equipment, LEENO can provide RF test socket with high bandwidth, impedance matching and high frequency up to 40GHz.
