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3D SPI
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
See Also: 3D Solder Paste Inspection
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3D SPI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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3D SPI Series
MS-15
- Exclusive 15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
Saki's 3D SPI identifies critical defects and assists with process improvement.
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5D SPI
On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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3D SPI Series
MS-11e
- Exclusive15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Solder Paste Inspection Machine
3D SPI
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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Solder Paste Inspection
3D SPI
Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
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Solder Paste
MVP Versa (3D SPI)
The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
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3D Solder Paste Inspection (SPI)
TR7007 SII
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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3D Scanner
Artec Eva Lite
Eva Lite is the budget version of the bestselling white light Artec Eva 3D scanner. It features the same accuracy specs, but with reduced functionality: Eva Lite has geometry only tracking and capture. As a result, this affordable 3D scanner can be used for making high quality textureless 3D scans when scanning geometrically rich objects, such as the human body.
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3D Software
Geomagic Freeform
Geomagic Freeform is the best solution for the design and manufacturing of organic shapes, giving you the real sensation of clay modeling but with all the added benefits of digital design. Now combined with Artec’s precise 3D scanners, you can effortlessly capture a large variety of objects in high detail directly into Geomagic Freeform software in order to easily solve any design and manufacturing challenges.
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3D AOI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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3D Geo-Magnetometer
For the measurement of magnetic equilibria such as the earth's magnetic field, for the determination of anomalies and biologically active location factors. Three highly sensitive magnetic field sensors, as well as a dedicated microprocessor, are integrated into the measuring probe. The sensitive magnetic field sensor is connected to a PC, notebook or laptop (not included). The main features in brief:
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AOI & SPI Test Systems
To keep the quality of your production at its best you need a good inspection of your boards. For efficient and detailed in-depth board inspection ensure you have SMT inspection equipment that meets your needs. Our AOI & SPI units will provide the quality you need for reliable inspection of soldering inspection.
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AOI & SPI, Test Systems
SigmaX SPI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The SigmaXs inspection technology is unaffected by varying materials, surface conditions, or colors. The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
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3D Sensors
*Up to 38500 distance values per measurement for a detailed assessment of the application*Configurable outputs*Visual assessment of distance, level or volume*Predefined function blocks*Time-of-flight measurement principle
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USB/RS232/SPI Programmable Attenuator
RUDAT-13G-90
Mini-Circuits’ RUDAT-13G-90 is a general purpose programmable RF attenuator supporting frequencies from 10 to 13000 MHz with attenuation from 0 to 90 dB in 0.5 dB steps. Its unique design maintains linear attenuation change per dB, even at the highest attenuation and frequency settings. The attenuator is controlled via USB, RS232 or SPI. It comes housed in a compact, shielded metal case with SMA(F) input/ output RF ports (RF ports are interchangeable), a USB type Mini-B socket, and a 9-pin D-sub(F) RS232 and SPI port. Power can be supplied via either USB or the D-sub port. The RUDAT-13G-90 is supplied with our easy-to-install, user-friendly GUI software, API objects for Windows® environments, and complete programming instructions for 32 and 64 bit Windows® and Linux® operating systems. See p. 9 for a complete list of included accessories.
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3D Measurement Software
PowerInspect®
3D measurement software for a range of hardware.PowerInspect software makes inspecting complex free-form surfaces simple, across all your inspection hardware. Use the right tools for the job, with one interface on all devices.
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3D Software
Along with manufacturing professional 3D scanners, Artec develops smart 3D scanning software. Meticulously designed to meet the needs of both new and experienced users alike, it is the best choice for any application.
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Relay Test Set Type SP-I
Supreme Instrument Laboratories
Supreme make relay testing set is designed for site testing of protective relays which simulate in common fault conditions under which a protective relay will be called into positive function. Periodic field testing is the best way of ensuring the integrity of the protective relays. We offer our relay testing set with specific testing capacity to suit different group of protective relays. The testing set operates on single phase 230 V, A.C. 50Hz. Supply.
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3D Microscope
BVM-5006
BVM-5006 Electric 3D Microscope features the quality optical system, high resolution, large field of view, high zoom ratio, novel design and one-up technology, easy and automatic operations. Includes: Motorized zooming, motorized observation angle for changing and optional motorized focusing. The speed can be adjusted while changing observation angle. With the angle attachment, the microscope can realize 3D image effects for observing the components and deep holes. The LED lights can generate high brightness. Theoretically the service life of LED lights can reach 20,000 hours. The LED lights with area control function can illuminate from different angles for convenient multi-angle inspections. The M-N3D Microscope can be widely used in micro-electronics, automated monitoring and testing industries. By selecting the appropriate objectives and video couplers, different magnification, field of view and depth of field can be acquired. Digital and Analog video systems can meet the different users' demands.
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3D Audio Servers
GoldSeries
AuSIM offers a growing number of prepackaged configurations, designed to meet a broad spectrum of R&D and deployment needs. These standard packages are generically called GoldSeries, and have a range of options to tune them to the needs of a specific project. If none of these are appropriate to your application, AuSIM will gladly develop a custom package for your specialized needs.
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Economy 3D Scanners
Cost-effective 3D scanners with high-end technology, provide you with 3D scanning capabilities to fit within your budge
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3D Metrological Software
InnovMetric PolyWorks
Powerful metrological software which can effectively process vast amounts of data from 3D scanners in real time. Due to its modular architecture the software covers a large number of applications: one-point inspection by touch measurement systems, scanned data processing and data comparison to CAD models or complete reverse engineering – CAD model creation.
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3D Verification Station
Omron’s 3D verification systems provide high-quality imagery to ensure the best results in post-solder inspection.
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3D Guidance®
The 3D Guidance® electromagnetic tracking solution delivers exceptional performance and value for OEM image-guided interventional and therapy systems and medical trainers that require real-time navigation tracking capabilities. The 3D Guidance solution tracks 6DOF sensors that can be embedded into OEM instruments such as ultrasound probes, rigid and flexible scopes, and laparoscopic tools. Continuous in-vivo tracking is maintained through difficult anatomy, even when sensors are out of sight. Low latency and fast update rates ensure the most subtle tool movements are instantly tracked and visualized within the OEM host interface. The 3D Guidance solution is available in the driveBAY™ and trakSTAR™ configurations, as based on the Electronics Unit. The trakSTAR is a standalone desktop unit that connects to a direct power source. The smaller driveBAY fits inside the drive bay of a computer, OEM imaging cart, or medical trainer/simulator, using the host’s power supply. Both share the same tracking accuracy and reliability. The ready-to-use configuration facilitates cost-effective integration and speeds time to market.
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3D AOI Series
MV-7 OMNI
- Exclusive 15MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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3D Imaging Sensor
The GS 3D sensors, can be used in applications such as bin picking, robotic manipulation, sorting products, mold clearance checking, and space monitoring and object recognition. In addition, the 3D technology will aid in determining spatial positions and measurements.The GS 3D images larger objects at longer distances and does so in milliseconds without the cycle time and motion required by scanning-based methods.
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Mek Selective 3D AOI
Every one of our desktop AOI and inline AOI systems is optimised for the demands of today’s advanced SMT applications and critical manufacturing environments. All are capable of delivering Selective 3D, using our unique stereoscopic imaging from the 9 cameras of the GTAz /GDAz optical heads.
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
