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Thermal Test
Designed to produce a temperature change in a device. The magnitude and rate of this change should induce a sufficient thermal stress fatigue to identify sources of potential failure without causing catastrophic failure of all components. (sigmasystems.com)
See Also: Thermal, Thermal Shock
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Thermal Shock Test Chambers
How well does your product stand up to the shock of extreme thermal temperature changes? Tenney Environmental's thermal shock test chambers take products from 200°C to -65°C in just seconds.
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Thermal Test Boards
Thermal Engineering Associates, Inc.
TEA offers a series of thermal test boards for package characterization and design comparison that conform to to the JEDEC JESD51 standards. The board family, referred to as the TTB-1000 series, consists of two different standard sizes designed to cover a wide range of package sizes. These boards, also referred to as test coupons, provide a well defined mounting environment, will withstand temperatures to 125 oC, and have lead lands terminated in eyelets to allow for hand-wired connection to the board edge contacts. The board mates with a dual 18-pin, 3.962 mm (0.156") pitch edge-card connector.
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Thermal Shock Test Chamber (Three Zone)
Guangdong Bell Experiment Equipment Co.,Ltd
DGBell’s Thermal Shock Test Chamber (3 Zone) consist of the Test Zone, Heat Storage Zone and Cold Storage Zone. The specimen stay in test zone, hot and cold air will be blew from the storage zones to achieve rapid temperature change for thermal shock.
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Thermal Stability Test System
Premier Electrosystems' Thermal Stability Test Setup is used to test thermoplastics and PVC (Plasticized Polyvinyl Chloride) materials. When exposed to continuous heat, these materials degenerate and emit harmful acidic gases. The instrument is manufactured for testing PVC materials for their thermal stability at higher temperature.
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Thermal Test Enclosure, -90°C To +220 °C, ≥100 DB, 300 MHz - 18 GHz
dbSAFE TSE
Compatible with all platforms of temperature forcing units and thanks to the DVTEST “waveguide” technology; isolation performance will not be impacted. The temperature range of the units will be -90°C to +220°C.
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IEC60884 Fig38 Thermal Compression Test Device For Plug Testing
IEC60884 fig38
Shenzhen Chuangxin Instruments Co., Ltd.
IEC60884 fig38 thermal compression test device for plug testingUsed to evaluate the pressure resistance of electrical accessories and wall mounted mounting boxes under heatStandard: GB2099.1-2008 Articles 24.19 and 25.4 and Figure 38, IEC60884-1 Figure 38, etc.
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Thermal Runaway Test Machine
Guangdong Bell Experiment Equipment Co.,Ltd
DGBELL Thermal runaway test machine test the whole vehicle or the complete vehicle-borne ion battery system or the subsystem of vehicle-borne lithium-ion battery system, including a lithium ion battery and an electrically connected lithium ion battery. The applicable standard is UL 2580, IEC 62619.
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Thermal Shock Environmental Test Chamber
Guangdong Bell Experiment Equipment Co.,Ltd
DGBell’s Thermal Shock Chamber provide the sudden temperature changes between extreme cold and extreme hot from -65℃ to 150℃ (customized available), specially for environmental stress screen test of the industries that rely on thermal testing, such as component, board electronic assemblies, defense, material stress, consumer products etc. The thermal shock test can cause faulting or cracking by the expansion and contraction on the products, indicates the hidden manufacturing defects. Bell’s Thermal Shock Chamber ensure you to launch qualified product to the market.
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Environmental Testing
Environmental testing capabilities include: High and Low Temperature Testing including Thermal Shock. Humidity Testing to 100% Relative Humidity at High and Low Temperatures. Altitude Testing to 100,000 Feet. Combined Vibration, Temperature and Altitude Testing. Mass Spectrometer for Leak Testing. Vibration Testing to 50 G's and 3000 Hz including Resonance Scan, Cycling, and Endurance. Free Fall Half Sine Wave Mechanical Shock Testing to 100 G's
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Automated Thermal Stress System
ATSS Series
Thermotron's Automated Thermal Stress Systems (ATSS) facilitate extremely rapid product temperature change rates in a space-saving, self-contained design that accelerate a Thermal Stress test. Thermotron's ATSS chambers meet the latest MIL-STD 883E and MIL-STD 202F thermal shock specifications as well as JEDEC and IPC test methods. ATSS chambers are capable of the following: Rapid thermal shocking, Accelerated product stressing, Controlled thermal cycling in a self-contained, compact design. With separate hot and cold zones, the Automated Thermal Stress System was designed with a patented retractable product transfer carrier that makes full use of the available working volume in both temperature zones for increased product loading and throughput. The product transfer carrier reduces the overall height requirements of the chamber and is made as light as possible to minimize thermal loading restraints. Thermotron ATSS chambers can be used as part of most commercial reliability and quality control programs, helping to determine:
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Test System for Circuit Breakers
Spitzenberger & Spies GmbH & Co. KG
Thermal testing with long-time currents up to 550 A. Magnetic testing with short-time currents up to 2000 A. Control software. Customer specifically adapted. 4 candidate records with pneumatic adapting.
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Temperature Chambers For Thermal Tests
Before anything reaches out for market distribution, you would need to determine its exact quality and performance to that follows to the point with readings. Thermal and environment testing are some of the most positive aspects to get your materials tested for their underlying performance capacity and reliability in quality.
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IR FPA sensors
IR FPA sensors are the most important modules of thermal imagers. Design of sensor electronics (camera core) is a crucial part of designing of new thermal imager. Knowledge of precise parameters of IR FPA sensor is needed by both professionals involved in both IR FPA technology/thermal imagers technology because parameters of IR FPA sensors determine performance limits of thermal imagers. Therefore test equipment that enable measurement of IR FPA sensors is a vital tool for development of both IR FPA technology/thermal imagers technology. It is commonly known that data sheets provided by manufacturers of IR FPA sensors (both cooled or non-cooled) provide too little details for electronics designers. Sometimes the provided data is not accurate enough and better sensor performance can be achieved using modified control signals. Therefore design teams loose sometimes years to develop electronic camera core optimized for a specific IR FPA sensor. When the type of the IR FPA sensor is changed the whole process is to be repeated. In this situation an universal, flexible camera core that would accept IR FPA sensors from different manufacturers and to carry out semi-automatic determination of optimal signal controls for a specific IR FPA sensor would be highly desirable.
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OSFP-XD Thermal Load with a Controller Board
In an everchanging industry, new form factors are launched to support higher speeds like 800G and later, 1.6T. With the speed per lane increasing exponentially, the need for thermal and cooling tests also rises with new requirements and demands.MultiLane is offering a OSFP-XD thermal load with a controller board, with the goal of emulating transceiver thermal behavior, but also to test cooling systems.
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Primary Current Injection
PCI-600
The VIC Model PCI-600 is a programmable, high-current source that is designed specifically for utility-substation applications. This alternating current(ac) test device is used primarily for injection testing of protective relays. This same device can also be used for testing thermal, magnetic and solid-state motor-protection relays and molded-case circuit breakers.
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Temp Characterized CalPod, 20 GHz
85531B
CalPods provide a new and unique way to quickly and easily refresh a network analyzer calibration, at the push of a button and without removing the DUT or re-connecting standards. Very useful in thermal chamber testing, where it is desired to remove the thermal effects of the test cables and connectors from the DUT’s response, and where it is impractical to stop the thermal testing to perform a normal re-calibration.
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Power Supply Rack For Climatic Cycling Test
One essential part of the module quality testing according to IEC 61215 is the thermal cycling test (MQT 11) and humidity freeze test (MQT 12). Besides the environment simulation in the climate chamber, it is necessary to energize the PV modules during specific parts of the test.
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MCB Thermal Verification Test Bench
The test system is a special version of the thermal test test system in the sense that the test jig is primarily designed to hold and connect multi pole MCBs for thermal verification so that each pole can be verified to trip within the IEC time band after the MCB has been riveted. This test ensures the trip verification of MCB so as to trip all the 4 poles at once when overload is detected in one single pole. In short, this is a verification-only bench.
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Thermal Testing
At E-Labs, Inc., we support thermal cycling and thermal bakeout vacuum testing requirements. During thermal cycling, the unit experiences repeated heating and cooling as it would when exposed to the harsh environment of space. During thermal bakeout, flight equipment is subjected to an outgassing reduction process so as to decrease the chance of molecular contamination of the spacecraft instrumentation.
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Environmental Test Chamber
High and Low Temperature Test Chambers, ESS Environment Stress Screening, 2 Zone Thermal Shock Test Chamber, 3 Zone Thermal Shock Chambers, Walk-In Chambers, Burn-in Room and Aging Test Chambers, Altitude Chambers, Industrial Drying Oven, Salt Spray Test Chambers, Temperature Humidity Vibration Comprehensive Test Chamber, Test Machine Series, Custom Made Environmental Test Equipment, Double-Layer High and Low Temperature Chamber, Explosion Proof Temperature Chamber For Power Battery, etc.
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Environmental Testing
Environmental testing typically involves hot or cold temperatures, humidity, altitude (vacuum) or thermal shock. This testing can even be combined with other test methods such as vibration or shock.
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Semiconductor
With ultra-multi pin count and fine pitch, our general-purpose IC socket lineup corresponds to every need. For semiconductor burn-in sockets for thermal acceleration tests, and test sockets for semiconductor electrical testing, we continue to hold a high market share all over the world.
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Thermal Abuse Test Chamber
Guangdong Bell Experiment Equipment Co.,Ltd
DGBell's Thermal abuse test chamber is suitable for standard IEC 62133-2017, UL 1642 and GB 31241-2014.
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Targets
Targets from group A are developed to support mostly testing infrared imaging systems understood as thermal imagers. These targets can be used also in testing visible/near infrared cameras or SWIR cameras but such application is not optimal. IR targets are mostly used in DT systems for testing thermal imagers and in MS systems for testing multi-spectral systems.
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Climatic Test Chamber
Before anything reaches out for market distribution, you would need to determine its exact quality and performance to that follows to the point with readings. Thermal and environment testing are some of the most positive aspects to get your materials tested for their underlying performance capacity and reliability in quality.
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Thermal Testing
A view of multiple testing stations for use in conducting Thermal Analysis on various materials. This is one of several areas assigned to various thermal tests. Differential Scanning Calorimetry (DSC), Thermogravimetric Analysis (TGA), Thermomechanical Analysis (TMA), and Dynamic Mechanical Analysis (DMA)
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Thermal Abuse Test Chamber
Guangdong Bell Experiment Equipment Co.,Ltd
DGBELL Thermal abuse test chamber protect for short circuit caused by incorrect operation of the operator and battery electrode, battery positive and negative connection, etc
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Precise Temperature Forcing System
TA-5000A Series
The ThermalAir TA-5000 Series of temperature forcing systems bring precise thermal testing capabilities directly to your test application, exactly localizing to where thermal conditioning temperature cycling is required. ThermalAir TA-5000 temperature systems provide flexible thermal test solutions for an array of products and technologies.
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OSFP 800G
OSFP800 has emerged as a leading standard to drive the development of 800G ecosystem. The MultiLane OSFP800 development kit is an essential tool to ensure the validity of your OSFP800 products. The module compliance board (MCB) is used to test transceivers, AOCs, active cables and DACs, while the host compliance board (HCB) enables the testing of system host ports. The loopback modules (LB) provide an economical way to test thermal capacity and signal integrity of system host ports at every stage of the process: R&D validation, production testing, and field testing.
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Pyroelectric and Thermal Testing
The optional Chamber Task measures the Pulse Polarization response and Small Signal Capacitance of a Pyroelectric material that is being heated and/or cooled within a thermal chamber, on a hot chuck or in a furnace. From these measurements the Spontaneous Polarization Pr(q) and the Dielectric Constant er(q) are computed. These are then combined to determine the Electrical Displacement D(q) as a function of the temperature q.
