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DSP-Based 4/8-Axis Advanced Pulse-Train Motion Controllers
AMP-204C/AMP-208C
ADLINK"s new AMP-204C/AMP-208C DSP-based 4/8-axis advanced pulse-train motion controllers incorporate up-to-date floating-point DSP and FPGA technology, enabling high pulse output and encoder input frequency up to 6.5 MHz and 20 MHz respectively. Leveraging ADLINK" s Softmotion technology, the AMP-204C/AMP-208C offer impressive comprehensive and application-oriented motion functionality to reduce development time while maintaining superior throughput and accuracy. Superior synchronous motion control performance combines with point-table function integrating multi-dimensional interpolation, such as 3D linear/circular/spiral interpolation with enhanced trajectory and velocity planning, for contouring applications in semiconductor, display and conventional manufacturing industries. The AMP-204C/AMP-208C also support PWM control with three different control modes for frequency or duty cycle, benefiting laser engraving/marking/cutting applications. Moreover, hardware-based position comparison and trigger output are applicable in AOI applications.
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Batch AOI Machine
Sherlock-300B
Compact Sherlock 300B batch PCB inspection (AOI) system provides manufacturers with the benefits of inline AOI—hands-off board handling, automatic good/bad board sorting and minimal operator interaction—in the convenience and flexibility of a standalone AOI station that can be located anywhere in the facility and used to process boards from multiple production lines, including production lines that aren't inline/automated, such as smaller and benchtop lines. With an average cycle time of 10 seconds per board (including transport), Sherlock 300B automated optical inspection (AOI) machine can be used for everything from first article to 100% inspection for increased quality and production yields. (Cycle time measured using a 7.3" x 5.1" (185 x 130 mm) PCB with 253 parts.)
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3D Automated Optical Inspection Systems (3D-AOI)
3Di Series
Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
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2D Automated Optical Inspection Systems (2D-AOI)
BF1 Series
Saki’s unique line scanning technology and coaxial overhead lighting enables high-speed accurate inspection.
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3D AOI Series
MV-9
- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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3D AOI with Revolutionary New 3D Measurement
Zenith
The Zenith 3D AOI system measures the true profilometricshape of components, solder joints, patterns and even foreignmaterial on assembled PCBs with true 3 dimensional measurement, overcoming the shortcomings and vulnerabilities of 2D AOI.
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Automated Optical Inspection
AOI
No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks performed routinely by ficonTEC’s suite of inspection tools. As for all of ficonTEC’s systems, a modular approach permits the inspection platform to equipped with additional features – automatic tray handling and various feeding philosophies, testing capabilities (e.g. LIV), top/bottom chip inspection, and in-situ labelling.
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Packaging Manufacturing
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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3D Automated Optical Inspection
Zenith UHS
High-speed full 3D AOI that brings about a revolution in SMT process management Industry-leading speed for full 3D measuring inspection equipment skill solutions- Only solution in the industry to set inspection criteria according to IPC-610 standards- Performs defect diagnosis through measurement-based data and eliminates the causes of possible errors- Powerful 3D solder joint inspection
