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Product
SODIMM DDR4
SQR-SD4N
Dual In-Line Memory Module (DIMM)
Original IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
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Product
SODIMM DDR4 3200MT/s
SQR-SD4S
Dual In-Line Memory Module (DIMM)
Original Hynix IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C Lifetime warranty.
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Product
DDR4 Parametric Test Reference Solution
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Keysight's DDR4 parametric test reference solution helps verify the signal integrity of DDR4 memory designs according to JEDEC specifications.
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Product
16G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U16N32-SEW
Memory Module
DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
DDR4 MSO Probes
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The DDR4 DIIM and SO-DIMM Mixed Signal Interposers connect Address, Command and Control signals of a DDR4 bus to the Keysight V-Series Oscilloscopes with the MSO option. These interposers also provide accessibility to DDR4 signals for convenient analog probing. The user can then easily observe both the digital and analog representation of the DDR4 Address, Command and Control bus. Solder down N5541A analog probes purchased separately from Keysight Technologies.
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Product
4G DDR4 2400 288Pin 512MBX8 1.2V Registered Samsung Chip
AQD-D4U4GR24-SG
Memory Module
DDR4-2400 Registered DIMM. – standard height, 30μ" gold plating thickness (IPC-2221 Standard) 1.2V power consumption. Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves data integrity.
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Product
DDR4 BGA Interposers, DDR4 DRAM X16 Packages
N2115A
Interposer
The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
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Product
DRAM SO-DIMM DDR4 Memory
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Improve performance up to 50% (compared to SO-DDR3.) with Advantech! We offer industrial grade SO-DDR4 2666/2400/2133 memory with 30μ" gold plating connector (260 pin) featuring 1.2v low operating voltage with faster burst accesses.
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Product
LGA 3647-P0 Intel® Xeon® Scalable ATX Server Board with 6 DDR4, 5 PCIe x8 or 2 PCIe x16 and 1 PCIe x8, 8 SATA3.0, 6 USB3.0, Dual 10GbE, IPMI
ASMB-815
Server Board
- ATX server board with Xeon® Scalable processors- DDR4 2933MHz RDIMM up to 768GB, support Intel Optane DC Persistent Memory- Five PCIe x8 or two PCIe x16 and 1 PCIe x8- Intel® X557-AT2 dual 10GbE ports- Eight SATA3.0 and one M.2 connectors (SATA / PCIe compatible)- 0 ~ 60 °C ambient operating temperature range
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Product
LGA1700 12th/13th/14th Generation Intel® Core™ I9/i7/i5/i3 ATX Motherboard With DP/HDMI/VGA, DDR4, USB 3.2, M.2
AIMB-788
Motherboard
Intel® 12th/13th/14th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q670E chipsetFour DIMM sockets up to 128 GB DDR4 3200Triple display DP/HDMI/VGA and dual GbE LANM.2, SATA RAID 0, 1, 5, 10, USB 3.2 Gen 2Advantech iBMC remote out-of-band power management solution on DeviceOnAWS (Amazon Web Service) IoT Greengrass qualifiedNote 1: Legacy platform is not supportedNote 2: dTPM 2.0 module is required to enable Intel vPro and TPM technologiesNote 3: Intel® Platform Trust Technology (Intel® PTT) ready for Windows 11
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Product
LGA 4189 Intel® 3rd Gen Xeon® Scalable ATX Server Board with 8x DDR4, 3x PCIe x16, 8x SATA 3, 6x USB 3.2 (Gen1), Dual 10GbE, and IPMI
ASMB-816
Server Board
- LGA4189 ATX server board with 3rd Gen. Xeon® Scalable processor- DDR4 3200 MHz RDIMM up to 512 GB (8 DIMMs) supports Intel® Optane™ Persistent Memory- Features 3x PCIe x16, 1x PCIe x8, 2x PCIe x4, and 1x PCIe x1- Intel® X550 dual 10GbE ports- Eight SATA 3 and one M.2 connectors (SATA/PCIe compatible)- 0 ~ 60 °C/ 32 ~ 140 °F ambient operating temperature range
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Product
Functional/Protocol Debug and Analysis Reference Solution
DDR4
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Highest confidence in measurement accuracy! Industry’s fastest triggering and data capture for DDR4 analysis, test, and debug.
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Product
Registered DIMM DDR4 3200/2933/2666
SQR-RD4N
Dual In-Line Memory Module (DIMM)
100% Screening Test, Compatible with server platform, Original IC chip adopted, 30u” golden finger.
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Product
8G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U8GN32-SEW
Memory Module
DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
16G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U16N32-SEW
Memory Module
DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
Space Radiation Tolerant 4GB DDR4
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This 4GB Radiation Tolerant DDR4 Memory Multi-Chip Package (MCP) is a Ultra High Density Memory Solution, targeting Space Embedded Systems & Applications.
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Product
8GB DDR4 SODIMM-3200 1GbX8 SAM
AQD-SD4U8GN32-SE
Memory Module
DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
Industrial Flash & Memory Solutions DDR4 Memory
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SQRAM DDR4 memory modules perform at superior speeds of up to 3200 MT/s, a 20% reduction in power consumption, and higher capacity than DDR3.
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Product
SOM Module
TEO820-ZU4EV
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Sundance Multiprocessor Technology Ltd.
Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784EZU4, 784 Pin Packages4 x 5 cm form factorRugged for shock and high vibration2 x 512 MByte 32-Bit width DDR4 SDRAM2 x 32 MByte (2 x 256 MBit) SPI Boot Flash dual parallel4 GByte eMMC Memory (up to 64 GByte)
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Product
COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors (formerly codename: Tiger Lake-UP3)
cExpress-TL
Computer on Module
ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel® Iris® Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel® Iris® Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
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Product
L-Band RF Tuner and 2-Channel 400 MHz A/D with Kintex UltraScale FPGA - XMC
Model 71891
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Accepts RF signals from 925 MHz to 2175 MHz- Programmable LNA handles L-Band input signal levels from -50 dBm to + 10 dBm- Programmable analog downconverter provides IF or I+Q baseband signals at frequencies up to 123 MHz- Two 400 MHz 12-bit A/Ds digitize IF or I+Q signals synchronously- Two FPGA-based multiband DDCs (digital downconverters)- Xilinx® Kintex® UltraScale™ FPGA- Five GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- PCI Express interface (Gen. 1, 2 & 3) up to x8- Clock/sync bus for multimodule synchronization- Optional LVDS and gigabit serial connections for FPGA for custom I/O- Navigator BSP® for software development- Navigator FDK® for custom IP development- Free lifetime applications support- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Product
LGA1200 10th Generation Intel® Core™ I9/i7/i5/i3 & Pentium®/Celeron® ATX With DP/DVI/VGA, DDR4, USB 3.2, M.2
AIMB-787
Motherboard
Intel® 10th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q470E chipsetFour DIMM sockets up to 128 GB DDR4 2933Triple display DP/DVI-D/VGA and dual GbE LANM.2, SATA RAID 0, 1, 5, 10, USB 3.2Supports Intel vPro, AMT & TPM technologiesAdvantech iBMC 1.2 remote out-of-band power management solution on DeviceOnNote 1: dTPM 2.0 module is required to enable Intel vPro and TPM technologies.Note 2: Legacy platform is not supported.Note 3: Intel® Platform Trust Technology (Intel® PTT) ready for Windows 11.
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Product
8-Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - 3U VPX
Model 5950
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- Now available in RFSoC Gen 3 with the Model 5953- Multi-board synchronization with Quartz RFSoC video- Supports Xilinx Zynq UltraScale+ RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- PCI Express (Gen. 1, 2 and 3) interface up to x8- LVDS connections to the Zynq UltraScale+ FPGA for custom I/O- Optional VITA-66.4 optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA-46, VITA-48, VITA-66.4, VITA-57.4 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Model 8257 1-Slot 3U VPX Development Chassis for Quartz Products- Model 4801 Carrier Design Kit for designing custom carrier for the Model 6001 QuartzXM- Model 6001 unique QuartzXM eXpress module enables migration to other form factors- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Synchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPX
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Product
LGA 1200 Intel® Xeon® W & 10th Gen.Core™ Proprietary Server Board with 4 x DDR4, 1 x PCIeX16, 2 x PCIeX4, 5 x USB 3.2, 3 x SATA 3, Quad LANs and IPMI
ASMB-610
Server Board
- Proprietary server board with LGA 1200 Intel® Xeon® W & 10th Gen. - Core™ i9/i7/i5/i3 processors- Compatible with HPC-61 series chassis- DDR4 2933/2666/2400 MHz ECC/Non-ECC UDIMM up to 128 GB- One PCIe x16 slot or two PCIe x8 slots support FH/10.5" Length Cards- Two PCIeX4 slots support low profile expansion cards- 3x SATA 3 ports and 5x USB 3.2 ports- One M.2 2280/2242 (SATA / PCIe compatible)- Quad LAN with Intel I350- Flexible IO board design
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Product
Mini-ITX SBC With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 Processor, DisplayPort++, VGA, EDP, USB 3.0, M.2 And Dual GbE LAN
MANO523
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*LGA1151 9th/8th gen Intel® Core™ i7/i5/i3 processor*Intel® Q370 chipset*2 DDR4 SO-DIMM for up to 32GB of memory*4 USB 3.0 and 4 USB 2.0*6 COM ports*2 SATA-600 and 1 M.2 Key M*PCIe x16 and M.2 Key E
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Product
15" XGA TFT LED LCD Touch Panel Computer With 8th Gen. Intel® Core™ I3/ I5/ I7 Processor, Built-In 8G DDR4 RAM
TPC-315
Panel PC
Industrial-grade 15" XGA TFT LCD with 70K lifetime and LED backlight.8th Gen. Intel® Core™ i3- 8145UE dual-core/ i5-8365UE quad-core/ i7-8665UE quad-core processor with built-in 8 GB DDR4 SO-DIMM.Compact, fanless embedded system with aluminum alloy front bezel and chassis grounding protection.True-flat touchscreen with 5-wire resistive touch control and IP66-rated front panel.Supports expansion via Full-size Mini PCIe and NVMe.Diverse system I/O and isolated digital I/O via iDoor technology.Supports fieldbus protocols via iDoor technology.
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Product
2-Ch 3.6 GHz or 4-Ch 1.8 GHz 12-bit A/D with DDC, Kintex UltraScale - 6U VPX
Model 58841
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Ideal radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- One-channel mode with two 3.6 GHz, 12-bit A/D- Two-channel mode with four 1.8 GHz, 12-bit A/D- Programmable DDCs (Digital Downconverter)- 10 GB of DDR4 SDRAM- µSync clock/sync for multiboard synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Compatible with several VITA standards including: VITA-46, VITA-48 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Synchronize up to twelve modules with Model 9192 System Synchronization and Distribution Amplifier- 1U Rack-mount
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Product
COM Express Compact Size Type 6 Module with Next Generation Intel Atom® Processor SoC
cExpress-EL
Computer on Module
ADLINK cExpress-EL supports next generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
1U Rackmount Network Appliance Platform
NA580
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The NA580 offers high reliability and performance through the LGA1151 socket Intel® Xeon® E3 and 7th/6th generation Intel® Core™ processors (codename: Skylake) with Intel® C236 chipset. The powerful network appliance supports up to 18 Gigabit LAN ports and allows system developers to configure their network solutions based on different performance requirements. Through the PCIe 3.0, the Axiomtek NA580 can integrate up to 18 Gigabit Ethernet ports. The standard configuration comes with 8 Gigabit Ethernet ports using Intel® i210 controller and supports 2 pairs of LAN bypass segments. Four DDR4 2133 MHz UDIMM sockets can provide storage of up to 32 GB and support both ECC and non-ECC memory types. To enhance reliability, this SMB network appliance platform supports data protection via 2 pairs of latch-type LAN bypass functions for fail-over option and features BIOS console redirection.
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Product
DDR4 Pro Memory Test Adapter
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This memory test adapter for the RAMCHECK LX includes an extraordinarily rugged test socket for many thousands of insertion/removal cycles.
